8810B TUOFENG | Alldatasheet
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www.sztuofeng.com Feb,2018 V1.0 SHENZHENTUOFENGSEMICONDUCTORTECHNOLOGYCO.,LTD V(BR)DSS RDS(on)MAX ID 20V 0.015Ω @ 4.5V 6.0A 0.019Ω @ 2.5V MARKING EquivalentCircuit FEATURE z TrenchFET Power MOSFET z Excellent R DS(on) z Low Gate Charge z High Power and Current Handi ng Capability z Surface Mount Package Dual N-Channel MOSFET APPLICATION z Battery Protection z Load Switch z Power Management ABSOLUTE MAXIMUM RATINGS (T a =25℃ unless otherwise noted) Parameter Symbol Value Unit Drain-Source Voltage V DS Gate-Source Voltage V GS ±12 V Continuous Drain Current I D A Pulsed Drain Current (note 1) I DM 25 A Thermal Resistance from Junction to Ambient (note 2) R θJA 100 ℃/W Junction Temperature T J 150 ℃ Storage Temperature T STG -55~+150 ℃ Lead Temperature for Soldering Purposes(1/8’’ from case for 10 s) T L 260 ℃ V Max Y :year code W :week code TSSOP-8 Plastic-Encapsulate MOSFETS z 8810B TFZYWJ TSSOP-8 8810B 8810B
www.sztuofeng.com Feb,2018 V1.02 MOSFETELECTRICAL CHARACTERISTICS Ta=25℃ unlessotherwisespecified Parameter Symbol Test Condition Min Typ Max Unit STATIC CHARACTERICTISCS Drain-source breakdown voltage V (BR)DSS V GS = 0V, I D =250µA 20 V Zero gate voltage drain current I DSS V DS =19V,V GS = 0V Gate-body leakage current I GSS V GS =±12V, V DS = 0V ±100 nA Gate threshold voltage (note 3) V GS(th) V DS GS , I D =250µA 0.5 V Drain-source on-resistance (note 3) R DS(on) V GS =4.5V, I D =6A m Ω V GS =2.5V, I D =5.5A 19 m Ω Forward tranconductance (note 3) g FS V DS =5V, I D =6A 10 S Diode forward voltage (note 3) V SD I S =1.50A, V GS = 0V 1.0 V DYNAMIC CHARACTERICTISCS (note4) Input Capacitance C iss V DS =10V,V GS =0V,f =1MHz 615 pF Output Capacitance C oss 150 pF Reverse Transfer Capacitance C rss 120 pF SWITCHING CHARACTERICTISCS (note 4) Turn-on delay time t d(on) 7.2 ns Turn-on rise time t r 13 ns Turn-off delay time t d(off) 29 ns Turn-off fall time t f 11 ns Total Gate Charge Q g V DS =10V,V GS =4.5V,I D =6A 12 nC Gate-Source Charge Q gs 1.2 nC Gate-Drain Charge Q gd 3.0 nC Notes : 1.Repetitive rating：Pluse width limited by maximum junction temperature 2.Surface Mounted on FR4 board，t≤10 sec. 3. Pulse test : Pulse width≤300μs, duty cycle≤2%. 4. Guaranteed by design, not subject to production. 1.0 15.5 12.5 15 V GS =5V, V DS =10V, R L =1.4Ω, R GEN =3Ω 100 nA 9.0 12.0 SHENZHENTUOFENGSEMICONDUCTORTECHNOLOGYCO.,LTD TSSOP-8 Plastic-Encapsulate MOSFETS 8810B
www.sztuofeng.com Feb,2018 V1.06 Dimensions In Millimeters Symbol Min Max D 2.900 3.100 E 4.300 4.500 b 0.190 0.300 c 0.090 0.200 E1 6.250 6.550 A 1.100 A2 0.800 1.000 A1 0.020 0.150 e 0.65(BSC) L 0.500 0.700 H 0.25(TYP) Θ 1° 7° SHENZHENTUOFENGSEMICONDUCTORTECHNOLOGYCO.,LTD TSSOP-8 Plastic-Encapsulate MOSFETS 8810B