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Document overview

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Technical content

1.1 General description

small Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

Table 1. Quick reference data

  1. Pinning information 3. Ordering information 4. Marking [1] % = placeholder for manufacturing site code 5. Limiting values

Table 2. Pinning information

Description

1 G gate

SOT23 (TO-236AB) 2Ss o u r c e

3 D drain

S D G 017aaa253 Table 3. Ordering information PMV31XN TO-236AB plastic surface-mounted package; 3 leads SOT23 Table 4. Marking codes Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).