PGT20102 ERICSSON | Alldatasheet

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Technical content

for 2.5 Gb/s Applications PGT 201 02

Description

The laser module, intended for DWDM applications at OC-48/STM-16, consists of a DFB laser with integrated absorption modulator mounted in a high speed package including isolator. Laser wavelengths are available according to the ITU-T grid. Key Features

  • 1550 nm DFB CW source monolithicly integrated with an Electro Absorption- modulator (EA)
  • Hermetic, 14 pin butterfly package
  • Single-mode fiber pigtail
  • 4 GHz typical bandwidth
  • -3 dBm output power
  • Multisourced footprint

Applications

  • 2.5 Gb/s
  • DWDM-systems

Electrical and optical characteristics at recommended operating conditions, unless otherwise noted. Parameter Conditions Symbol Min Typ Max Unit Wavelength ITU-T grid λ 1530 1564 nm Output power BOL P out -3 dBm Extinction ratio 2.5 V pp ER 10 dB Dispersion penalty @ 6500 ps/nm disp. 1.5 dB Side mode suppr.ratio SMSR 35 dB Optical isolation 30 dB

Electrical Characteristics

Parameter Conditions Symbol Min Typ Max Unit Operating Current I op 50 100 mA Treshold Current I th 25 mA Forward Voltage V f 2V Reflection E/E 0-3 GHz S 11 -10 dB Small signal modulation bandwidth -3 dB e fC 3 GHz Rise/Fall time 20/80% t r/tf 125 ps Monitor current 0.1 1 mA Monitor dark current -5 V 5 100 nA Thermistor resistance @ 25 °C 9.5 10.5 k Ω TEC Voltage -2.5 2.5 V Current -1.2 1.2 A Power 3W Operating Conditions Parameter Symbol Min Typ Max Unit Operating Case Temperature T Case 07 0 °C Operating Chip Temperature T op 20 35 °C Absolute Maximum Ratings Parameter Symbol Min Max Unit Storage Temperature, maximum duration 12 months T Stg -40 85 °C Laser forward current I LD 150 mA Modulator voltage V mod -4 1 V CAUTION: Stresses outside those listed in ”Absolute Maximum Ratings” may cause permanent damage to the device.

Ericsson Microelectronics AB SE-164 81 Kista, Sweden Telephone: +46 8 757 50 00 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int + 46 8 757 47 00, Fax: +46 8 757 47 76 1522-PGT 201 02 Rev. E © Ericsson Microelectronics AB, October 2000 Information given in this data sheet is believed to be accurate and reliable. However no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Product specifications subject to change without notice. Handling Precautions This device may be damaged as a result of electrostatic discharge (ESD). Take proper precautions during both han- dling and testing. This typically includes grounded wrist wraps, workbenches and floor mats in ESD controlled areas. Semiconductor devices may be damaged by current surges, use appropriate transient protection. Quality Assurance Ericsson Microelectronics commitment to quality has been proven through a decade of semiconductor device produc- tion and has been confirmed to ISO 9001. Opto product qualification is made according to the intention of applicable Telcordia standards. Connector Options FC/PC SC (Other connectors available on request) INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE TO BEAM DANGERDANGER WAVELENGTH 1300 nm - 1600 nm CLASS 3B LASER