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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls 3750Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) FCC Compatible VDE Compatible No EMI/RFI Generation No Moving Parts High Reliability Arc-Free With No Snubbing Circuits Small 8-Pin Package Machine Insertable, Wave Solderable Surface Mount and Tape & Reel Versions Available Parameter Rating Units Blocking Voltage 350 V P Load Current 120 mA rms / mADC On-Resistance (max) 35 Approvals
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UL Recognized Component: File E76270 CSA Certified Component: Certificate 1175739 EN/IEC 60950 Certified Component: TUV Certificate: B 10 05 49410 006 Part # Description TS120 8-Pin DIP (50/T ube) TS120P 8-Pin Flatpack (50/T ube) TS120PTR 8-Pin Flatpack (1000/Reel) TS120S 8-Pin Surface Mount (50/T ube) TS120STR 8-Pin Surface Mount (1000/Reel) + LED - Relay – LED - Relay Collector - Phototransistor Emitter - Phototransistor Load - Relay (MOSFET Output) Load - Relay (MOSFET Output) LED - Phototransistor –/+ LED - Phototransistor +/– Switching Characteristics of Normally Open Devices The TS120 integrated circuit device combines a 350V normally open (1-Form-A) relay with a Darlington transistor optocoupler in a single package. The relay uses optically coupled MOSFET technology to provide 3750V rms of input to output isolation. Its optically coupled relay outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The TS120 enables telecom circuit designers to combine two discrete functions in a single component that uses less space than traditional discrete component solutions. Form-A IF ILOAD 10% 90% ton toff
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R12 TS120 Absolute Maximum Ratings @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Ratings Units Blocking Voltage 350 V P Input Power Dissipation 1 150 mW Input Control Current, Relay 50 mA Peak (10ms) 1 A Input Control Current, Detector 100 mA T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Electrical Characteristics @25ºC: Relay Section Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous - I L - - 120 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance I L=120mA R ON -2 3 3 5 Off-State Leakage Current V L=350V I LEAK --1 A Switching Speeds T urn-On I F=5mA, VL=10V ton --3 m s T urn-Off t off --3 m s Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L=120mA I F --5m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Voltage - V R --5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Input to Output Capacitance - C I/O -3 - p F Parameter Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Blocking Voltage I C=10AB V CEO 20 50 - V Phototransistor Dark Current V CE=5V , IF=0mA I CEO - 100 1000 nA Saturation Voltage I C=0.15mA, IF=0.05mA V SA T - 0.5 0.8 V Current T ransfer Ratio I F=0.05mA, VCE=0.8V CTR 300 1000 - % Input Characteristics Input Control Current I C=2mA, VCE=0.5V I F -12 m A Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Input to Output Capacitance - - - 3 - pF Isolation, Input to Output - V I/O 3750 - - V rms Electrical Characteristics @25ºC: Detector Section
INTEGRATED CIRCUITS DIVISION TS120 www.ixysic.com 3R12 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) Turn-On Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) Turn-Off Time (ms) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=120mADC) LED Current (mA) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mADC) On-Resistance (:) Device Count (N) Typical Blocking Voltage Distribution (N=50) Blocking Voltage (V Device Count (N) Typical LED Forward Voltage Drop vs. Temperature (IL=120mADC) LED Forward Voltage Drop (V) Temperature (ºC) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA Typical Turn-On Time vs. LED Forward Current (IL=120mADC) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R12 TS120 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Typical Turn-On Time vs. Temperature (IL=120mADC) Temperature (ºC) IF=5mA IF=10mA IF=20mA Turn-On Time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=120mADC) Temperature (ºC) Turn-Off Time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature (IF=5mA, IL=120mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=120mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Maximum Load Current vs. Temperature Temperature (ºC) Load Current (mA) 180 160 140 120 100 -40 -20 0 20 40 60 80 120 100 IF=20mA IF=10mA IF=5mA Typical Load Current vs. Load Voltage (IF=5mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 -3 -2 -1 0 1 2 3 Typical Blocking Voltage vs. Temperature Temperature (ºC) Blocking Voltage (VP) -40 430 425 420 415 410 405 400 395 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured across Pins 7&8 Temperature (ºC) Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Energy Rating Curve Time Load Current (A) 10Ps 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100Ps 100ms 1s10ms 10s 100s RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION TS120 www.ixysic.com 5R12 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Typical Normalized CTR vs. Forward Current (VCE=0.8V) Forward Current (mA) Normalized CTR (%) 0 2 4 6 8 10 12 14 16 18 2.5 2.0 1.5 1.0 0.5 Typical Normalized CTR vs. Temperature (VCE=0.8V) Temperature (ºC) IF=1mA IF=2mA IF=5mA IF=10mA IF=15mA IF=20mA Normalized CTR (%) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Collector Current vs. Forward Current (VCE=0.8V) Forward Current (mA) Collector Current (mA) 0 2468 1 2 10 14 16 18 20 DETECTOR PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R12 TS120 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating TS120 / TS120P / TS120S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time TS120 / TS120S 250ºC for 30 seconds TS120P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION TS120 www.ixysic.com 7R12 TS120 TS120P TS120S Mechanical Dimensions Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP . (0.285) 7.620 ± 0.254 (0.300 ± 0.010)
4.064 TYP
(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) PCB Land Pattern 9.398 ± 0.127 (0.370 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.286 MAX. (0.090 MAX.) 0.203 ± 0.013 (0.008 ± 0.0005) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 0.457 ± 0.076 (0.018 ± 0.003) 2.159 ± 0.025 (0.085 ± 0.001) 2.54 (0.10) 8.70 (0.3425)1.55 (0.0610) 0.65 (0.0255) 0.864 ± 0.120 (0.034 ± 0.004) Pin 1 Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1
INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com TS120 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-TS120-R12 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 TS120STR Tape & Reel TS120PTR Tape & Reel Dimensions mm (inches) User Direction of Feed NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1 =4.20 (0.165) 0 K =4.90 (0.193) P=12.00 (0.472) W=16.00 (0.63)Bo=10.30 (0.406) Ao=10.30 (0.406) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) User Direction of Feed P = 12.00 (0.472) W = 16.00 (0.63) Bo = 10.30 (0.406) Ao = 10.30 (0.406) K1 = 2.00 (0.079) K0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157)