DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
Features
Description
Ordering Information
Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Load Current up to 1Arms (3Arms with heat sink) Blocking Voltages up to 400VP 5mA Sensitivity Zero-Crossing Detection DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity VDE compatible Machine Insertable, Wave Solderable Approvals UL Recognized Component: UL 508 File E69938 CSA Certified Component: File 043639 – LED + LED AC Load AC Load ZC The PS1201 is an AC Solid State Switch using optical coupling with dual power SCR outputs to produce an alternative to optocoupler and Triac circuits. The PS1201 switches are robust enough to provide a blocking voltage of up to 400V P and max surge current rating of 20A. In addition, tightly controlled zero-cross circuitry ensures switching of AC loads without the generation of transients. The input and output circuits are optically coupled to provide 3750V rms of isolation and noise immunity between control and load circuits. As a result the PS1201 is well suited for industrial environments where electromagnetic interference would disrupt the operation of electromechanical relays.
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R14 PS1201 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Min Max Units Blocking Voltage - 400 V P Reverse Input Voltage - 5 V Input Control Current - 100 mA Peak (10ms) - 1 A Input Power Dissipation 1 - 150 mW T otal Package Dissipation 2 - 1600 mW Isolation Voltage, Input to Output 3750 - V rms Operational T emperature -40 +85 ºC Storage T emperature -40 +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 16.6 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics AC Operating Voltage I F=5mA V OP 20 - 120 V rms Load Current (Continuous) V L=120-240VAC I L 0.005 - 1 A rms Maximum Surge Current t<16ms I PEAK - - 20 A Off-State Leakage Current V L=400VDC ILEAK --1 m A On-State Voltage Drop I L=1Arms - - - 1.2 V rms Critical Rate of Rise - dV/dt 1000 1200 - V/µs Switching Speeds T urn-On I F=5mA ton - - 0.5 Cycles T urn-Off t off - - 0.5 Zero-Cross T urn-On Voltage 1 1st half-cycle - -25 V Subsequent half-cycle - - 1 V Operating Frequency - - 20 - 500 Hz Load Power Factor for Guaranteed T urn-On 2 - PF 0.25 - - - Capacitance Input-T o-Output - C I/O -3 - p F Input Characteristics Input Control Current For Normal Environment - IF --5 mA For High Noise Environment - - - 10 Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Input Dropout Voltage - - 0.8 - - V Reverse Input Current V R=5V I R - - 10 µA 1 Zero Cross 1st half-cycle @ < 100Hz. 2 Snubber circuits may be required at low power factors. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION PS1201 www.ixysic.com 3R14 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. -40 1.2 1.0 0.8 0.6 0.4 0.2 05 58 5 Ambient Temperature (ºC) Load Current Free Air RTJA=60ºC/W Load Current (Arms) -40 05 58 5 Load Current Heat Sink Ambient Temperature (ºC) Load Current (Arms) PS with Thermal Clip attached to 3ºC/W heat sink PS with Thermal Clip freestanding 16 50 100 Max. Surge Current Non-Repetitive Pulse Duration (ms) Peak Surge Current (A) NOTE: Values apply to TJ=50ºC before Surge 1.3 1.2 1.1 1.0 10 25 40 55 70 85
0.9 Forward Voltage (V)
Ambient Temperature (ºC) Typical Forward Voltage vs. Temperature Critical Rate of Rise (V/µs) 800 600 400 200 1200 1000 25 50 85 1400 Ambient Temperature (ºC) Typical dV/dt vs. Temperature Vo 63% 10% RC dV/dt Method In accordance with EIA/NARM Standards RS-443 for Solid State Relays Vo = 300V dV dt 0.63 x 300V RC RC 189==
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R14 PS1201 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PS1201 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PS1201 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
INTEGRATED CIRCUITS DIVISION Specification: DS-PS1201-R14 ©Copyright 2013, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/21/2013 For additional information please visit our website at: www.ixysic.com PS1201 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. MECHANICAL DIMENSIONS PS1201 Dimensions mm (inches) 6.350 ± 0.127 (0.250 ± 0.005) 5.944 ± 0.127 (0.234 ± 0.005) 19.202 ± 0.381 (0.756 ± 0.015) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Pin 8 0.254 ± 0.013 (0.010 ± 0.0005) 2.642 ± 0.127 (0.104 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.100 ± 0.005) 5.08 ± 0.127 (0.200 ± 0.005) 10.160 ± 0.127 (0.400 ± 0.005) 0.711 ± 0.102 (0.028 ± 0.004) 0.800 DIA. x4 (0.031 DIA. x4) 2.540 (0.100) Pin 1 10.160 (0.400) 5.080 (0.200) 1.30 (0.051) PCB Hole Pattern