T261 INTEL | Alldatasheet
Document overview
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Technical content
Datasheet sections
- 1 Description and Features
- 2 Introduction
- 2.1 Purpose and Scope of this Document
- 2.2 Terminology
- 2.3 Tracking Camera Technology Overview
- 2.4 Tracking System
- 2.5 Intel® RealSense™ Tracking Module T261
- 2.6 Intel® RealSense™ Tracking Camera T265
- 3 Component Specification
- 3.1 Tracking Camera system Components
- 3.2 Intel® RealSense™ Tracking Module T261
- 3.2.1 Inertial Measurement Unit
- 3.2.2 Fisheye Imagers
- 3.2.3 Tracking Module Connector Plug
- 3.2.4 Tracking Module Label
- 3.2.5 Stiffener
- 3.2.6 Mechanical Dimensions
- 3.2.7 Tracking Module Storage and Operating Conditions
- 3.2.8 Tracking Module Power Requirements
- 3.3 Intel® RealSense™ Tracking Camera T265 Device
- 3.3.1 Intel® RealSense™ Tracking Camera T265 Mechanical
- 3.3.2 Intel® RealSense™ Tracking Camera T265 Thermals
- 3.3.3 Intel® RealSense™ Tracking Camera T265 Storage and
- 3.3.4 Product Identifier and Material Code
- 4 Functional Specification
Document Number: 572522-004 Intel® RealSense™ Tracking Camera Datasheet Intel® RealSense™ Tracking Camera T265, Intel® RealSense™ Tracking Module T261 September 2019 Revision 004
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Table 6-1: Intel® RealSense™ Tracking Module T261 – Component Power and TDP at Table 6-2: Intel® RealSense™ Tracking Module T261 - Case Temperature Limits (Still Air) 22
Revision History
572522 001 Initial Release Jan 2019 002 Table 3-3. Inertial Measurement Specifications Figure 6-3. Center of Tracking Location Table 4-5. Boot Device Vendor and Product IDs 7.1 Manufacturer’s Information 7.2 NRTL Statement Mar 2019 003 Table 3-3. Inertial Measurement Unit Apr 2019 004 Intel® RealSense™ Tracking Module T261 4.1 Boot Device Information Figure 6-3. T261 Module Screw Mount Figure 6 8. Intel® RealSense™ Tracking Camera T265 Center of Tracking Location Sept 2019 § §
1 Description and Features
Description
Intel® RealSense™ Tracking Camera T265 and Intel® RealSense™ Tracking Module T261 are tracking capable devices based on visual and inertial sensor fusion. The assembly contains fisheye cameras, IMU module and a processing ASIC (Intel® Movidius™ Myriad™ 2 MA215x) with USB 3.0 interface to host processor SoC. Usages/Markets Robots Drones Augmented Reality and Virtual Reality
Features
Tracking feature using Fisheye Camera and Inertial Measurement Unit (IMU) Intel® Movidius™ Myriad™ 2 ASIC Middleware processed on Myriad 2 ASIC; Enabling higher CPU performance 6DoF data streaming to host Low latency Minimum System Requirements Windows* 10/Linux* USB 3.0 (without video streaming USB 2.0 is sufficient) Please check with your Intel representative for platform and OS combination supported and enablement timelines § §
2 Introduction
2.1 Purpose and Scope of this Document
This document captures the specifications for the Intel® RealSense™ Tracking Camera T265 and Intel® RealSense™ Tracking Module T261.
2.2 Terminology
6DoF 6 Degrees of Freedom refers to the freedom of movement in three dimensional space. Movement such as forward/backward, up/down, left/right, pitch, roll and yaw. Fisheye camera Also referred as wide angle camera FOV Field Of View describes the angular extent of a given scene that is imaged by a camera. A camera's FOV can be measured horizontally, vertically, or diagonally Lens This refers to the optical component of an imager. Its purpose is to focus the incoming light rays onto the CMOS chip in the imager. System On Chip (SoC) Integrated circuit (IC) that integrates all components of a computer or referred in this document as host processor SOC Imaging or Optical module This refers to a stiffened module containing at least two imagers. The distance between the imagers, which is referred to as the baseline or intraocular spacing, is typically in the range of 20 mm to 70 mm. IMU Inertial Measurement Unit B2B Board to Board connector IR Cut Filter Filter designed to prevent infrared (IR) light reaching the imagers. TBD To Be Determined. In the context of this document, information will be available in a later revision.
2.3 Tracking Camera Technology Overview
The tracking camera and module are a computer vision solution that outputs 6DoF data to the host system for immersive experience, navigation and mapping. T265/T261 uses inputs from dual fisheye cameras (OV9282) and an IMU (BMI055) along with processing capabilities from the Movidius MA215x ASIC in order to provide the host system 6DoF poses.
2.4 Tracking System
The T265 and T261 have one main board which includes all components on a single board. T265 comprises a T261 module, an interposer card with a USB connector and a peripheral envelope. The T261 module requires an external interposer card to allow USB connection, in case it is used outside the T265 peripheral.
2.5 Intel® RealSense™ Tracking Module T261
Table below describes main components that make up the module SKU Table 2-1. Tracking Module Product SKU Descriptions Component T261 Movidius Myriad 2 ASIC √ Fisheye Imagers √ IMU √
2.6 Intel® RealSense™ Tracking Camera T265
T265 is a tracking camera peripheral including T261, interposer card and industrial design. § §
3 Component Specification
3.1 Tracking Camera system Components
The device components are described in Table 3-1. The form factor module includes two fisheye image sensors, an Inertial Measurement Unit (IMU) and VPU processing ASIC. Table 3-1. Component Descriptions Component Description BMI055 IMU Accelerometer and Gyroscope in a single package OV9282 Fisheye Camera Monochrome image sensor with wide field of view Movidius MA215x VPU Processing ASIC Stiffener Reinforcement housing to keep imagers aligned Label Manufacture and product identifier information Other Components IR Cut Filter, Voltage Regulators, etc.
3.2 Intel® RealSense™ Tracking Module T261
Figure 3-1. Intel® RealSense™ Tracking Module T261 Front View Table 3-2. Tracking Module Properties Imaging Module Intel® RealSense™ Tracking Module T261 Baseline (mm) 64±0.15 Left/Right Fisheye Imagers OV9282 Shutter Type Global Fisheye FOV (degrees) D:173
H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z – Thickness
3.2.1 Inertial Measurement Unit
The IMU is a system-in-package for the detection of acceleration in 3 dimensions and rotations in 3 dimensions. Table 3-3. Inertial Measurement Specifications Parameter Properties Degrees of Freedom 6 Acceleration Range ±4g Accelerometer Sample Rate 62.5Hz Gyroscope Range ±2000 Deg/s Gyroscope Sample Rate 200Hz NOTES: 1. 6DoF pose data provided to host platform at a sample rate of 200Hz. The sample rate indicates average number of samples per second and might not imply a uniform distribution of the samples.
3.2.2 Fisheye Imagers
The fisheye imagers are used in the process of producing 6DoF data streamed to the host platform. The imagers provide monochrome images at 30FPS. Table 3-4. Fisheye Image Sensor Properties Parameter Camera Sensor Properties Active Pixels 848 X 800 Sensor Aspect Ratio 1.06 Format 8bit, 10-bit RAW Filter Type IR Cut Filter Focus Fixed Shutter Type Global Shutter Signal Interface MIPI CSI-2, 2 X Lanes
3.2.3 Tracking Module Connector Plug
The tracking module connector plug provides signal and power interface to the tracking module. Table 3-5. Module Contact Plug Details Parameter Description Diagram Number of Contacts 38 Product Name NOVASTACK* 35-P Board- to-Board Connector Part Number 20708-034E-1 Manufacturer Website www.i-pex.com Figure 3-2. Board to Board Receptacle Pin Map on T261 Module
Table 3-6. Board to Board Connector Pin List Pin Number Description
1 Reserved
2 USB3_RX+
3 Reserved
4 USB3_RX-
5 Reserved
6 Ground
7 Reserved
8 USB3_TX+
9 Reserved
10 USB3_TX-
11 Reserved
12 Ground
13 Reserved
14 USB2+
15 Reserved
16 USB2-
17 Reserved
18 Ground
19 Reserved
20 Reserved
21 Reserved
22 Reserved
23 Reserved
24 Ground
25 Ground
26 Reserved
27 Reserved
28 Reserved
29 Reserved
30 Ground
31 Ground
32 Reserved
33 Reserved
34 Reserved
35 VBUS (Power), VDD_5V
36 VBUS (Power), VDD_5V
37 Ground
38 Ground
3.2.4 Tracking Module Label
Table 3-7. Tracking Module Product Labeling For illustration purpose only, subject to change Dimension Value Unit A Label Width 17±0.2 mm B Label Height 6.9±0.2 mm C Scan Code Width 5±0.2 mm D Scan Code Height 5±0.2 mm Scan Code Format XXXXXXXXXXXXOOOOOOXXXXXX-XXX Table 3-8. Tracking Module Label Fields Group Field Description Type Company Intel Manufacturer Static Model Number T261 Camera Model Number Static Product Assembly Number XXXXXX Product Identifier Code Static -XXX Manufacture Configuration Code Dynamic OOOOOO Product Material Code Static Serial Number XXXXXXXXXXXX Manufacture Unit Code Dynamic Table 3-9. Intel® RealSense™ Tracking Module T261 Product Identifier Code and Product Material Code Production Product Material Code Intel® RealSense™ Tracking Module T261 999AXH
3.2.5 Stiffener
The stiffener maintains the precise alignment of the camera sensors and assists in subassembly rigidity. The stiffener consists of a bottom and a top plate. The stiffener is made of stainless steel grade AISI 304.
3.2.6 Mechanical Dimensions
Table 3-10. Intel® RealSense™ Tracking Module T261 Mechanical Dimensions Dimension Min Nominal Max Unit Width 93.1 93.35 93.5 mm Height 17.45 17.60 17.75 mm Depth 6.83 7.13 7.43 mm Flatness Tolerance - 0.25 - mm Weight - 22 - gr
3.2.7 Tracking Module Storage and Operating Conditions
Table 3-11. Tracking Module Storage and Operating Conditions Condition Description Min Max Unit Storage (Ambient), Not Operating Temperature (Sustained, Controlled)(1) 0 40 oC Temperature (Short Exposure)(2) -30 65 oC Humidity 90% RH, 30oC Case/Stiffener Temperature (Still Air) (3)(4)(5) Temperature 0 55 oC NOTE: (1) Controlled conditions should be used for long term storage of product. (2) Short exposure represents temporary max limits acceptable for transportation conditions. (3) Case temperature limits must be met for all operating temperatures. (4) Case temperature is specified for the overall tracking module (5) Case temperature 0° minimum and lower temperatures is non-condensing
3.2.8 Tracking Module Power Requirements
The tracking module is powered through USB VBUS power.
Table 3-12. Tracking Module Power Requirements Parameter Min Nom Max Unit VCC Supply Voltage 4.5 5 5.25 V ICC Supply Current 300 300 mA
3.3 Intel® RealSense™ Tracking Camera T265 Device
Figure 3-3. Intel® RealSense™ Tracking Camera T265 Note: Figure may differ from final production images
3.3.1 Intel® RealSense™ Tracking Camera T265 Mechanical Dimensions
Table 3-13. Intel® RealSense™ Tracking Camera T265 Mechanical Dimensions Dimension Min Nominal Max Unit Width 107.85 108.00 108.15 mm Height 24.35 24.50 24.65 mm Depth 12.35 12.50 12.65 mm Flatness Tolerance - 0.15 - mm Weight 57 60 63 gr
3.3.2 Intel® RealSense™ Tracking Camera T265 Thermals
Table 3-14. Max Skin Temperature Tracking Camera Max Skin Temperature (25oC Ambient in Open Environment) T265 40oC
3.3.3 Intel® RealSense™ Tracking Camera T265 Storage and Operating Conditions
Table 3-15. Storage and Operating Conditions Condition Description Min Max Unit Storage (Still Air), Not Operating Temperature (Sustained, Controlled)(1) 0 40 oC Temperature (Short Exposure)(2) -30 65 oC Humidity, Non-Condensing 90% RH, 30oC Operating(3) (Still Air) Temperature 0 35 oC NOTES: 1. Controlled conditions should be used for long term storage of product. 2. Short exposure represents temporary max limits acceptable for transportation conditions. 3. Component case temperature limits must be met for all operating temperatures.
3.3.4 Product Identifier and Material Code
Table 3-16. Product Identifier and Material Code Production Product Material Code Intel® RealSense™ Tracking Camera T265 999AXJ § §
4 Functional Specification
4.1 Boot Device Information
Table 4-1: Boot Device Vendor and Product IDs Description VID PID Movidius Device 03E7 2150 Intel® RealSense™ Tracking Module T261 8087 0B37 Intel® RealSense™ Tracking Camera T265 8087 0B37 1. If T261/T265 is being connected to host system via USB hub, keep in mind that T261/T265 will enter into USB enumeration protocol as soon as 5V has been provided on VBUS pin. USB protocol is handled by the Movidius MA215x device. Make sure USB hub is connected and enumerated to host system prior to power being supplied to T261/T265. 2. <1% drift observed in repeated testing in multiple use cases and environments. AR/VR use cases were tested with the T261/T265 mounted on the head in indoor living and office areas with typical indoor lighting including sunlight entering the room. Wheeled robot use cases tested with wheel odometer data integrated, in indoor office and home environments. Sufficient visibility of static tracked visual features is required, the device will not work in smoke, fog, or other conditions where the camera cannot observe visual reference points. Performance will vary across use cases and environments, the system will attempt to detect and report degraded performance but may fail to do so. § §
5 Software
5.1 Intel® RealSense™ Software Development Kit 2.0 Intel® RealSense™ SDK 2.0 is a cross-platform library for working with Intel® RealSense™ Tracking Camera T265 and Tracking Module T261. It is open source and available on https://github.com/IntelRealSense/librealsense The SDK at a minimum includes: Intel® RealSense™ Viewer - This application can be used view, record and playback depth streams, set camera configurations and other controls. Debug Tools - These command line tools gather data and generate logs to assist in debug of camera. Code Examples - Examples to demonstrate the use of SDK to include D400 Series camera code snippets into applications. Wrappers -Software wrappers supporting common programming languages and environments such as ROS, Python, Matlab, node.js, LabVIEW, OpenCV, PCL, .NET and more
6 System Integration
6.1 System Level Block Diagram
Figure 6-1. System Block Diagram
6.2 Intel® RealSense™ Tracking Module T261 Module Flex
It is critical that Intel® RealSense™ Tracking Module T261 does not experience flex during system integration or during use after integration. Micron level flexing of the module can render the calibration incorrect and will result in poor performance or nonfunctional data. It is important for system designers to isolate the module from any chassis flex the system may encounter. While the module has a reinforcement housing, the housing is not intended to counter loads from chassis flex.
6.3 Thermals
The system thermal design must ensure the component case temperature and system skin temperature limits are not exceeded.
Table 6-1: Intel® RealSense™ Tracking Module T261 – Component Power and TDP at Max Operating Mode Component Power TDP Unit ASIC 2000 2000 mW Fisheye Camera (Left) 134 150 mW Fisheye Camera (Right) 134 150 mW IMU 17 17 mW All Components 2285 2317 mW Table 6-2: Intel® RealSense™ Tracking Module T261 - Case Temperature Limits (Still Air) Component Min Max Unit ASIC 0 85 ◦C Fisheye Camera (Left) 0 55 ◦C Fisheye Camera (Right) 0 55 ◦C IMU 0 85 ◦C A thermal evaluation should be completed with the Intel® RealSense™ Tracking Module T261 to validate that the system thermal solution ensures temperature limits are not exceeded.
6.3.1 Passive Heat Spreader
To minimize the need or size for an internal passive heat spreader, it is recommended that a metal chassis material with a thermal conductance greater than 20 [W/mK] and an effective thermal resistance of less than 7.7 [K/W] be used. If a plastic chassis material is used, this will generally require a passive heat spreader solution. The recommended passive heat spreader solution for a plastic chassis is as follows: 100mm x 100mm x 0.2mm graphite material with plastic chassis thickness material of 1mm.
Figure 6-2. Passive Heat Spreader
6.4 Cover Design Guidance
The T261 module components such as the fisheye camera lens must be covered to minimize dust, humidity and personal contact such as fingers to lens. All cover materials should be flat to prevent performance loss due to distortion. This is especially important for the fisheye camera sensor where distortion can significantly affect performance. Cover materials placed over the fisheye camera sensor must be carefully selected to avoid impacting tracking performance. Distortion or reduced light sensitivity can make it difficult to track motion optically. The following recommendations should be met in cover design to support tracking performance. Other solutions can be acceptable but careful design and validation work should be done to verify a solution will perform adequately. Table 6-3: Optical Module Cover Material Parameters Specification Recommendation Notes Hardness 6H (Design can be up to 9H with tempered glass) Prevent Scratches Flatness 0.05mm Minimize Distortion Minimum Gap Distance From T261 Lens to Cover Material 0.1mm (min) 0.6mm (max) Lens height tolerance ±0.2mm should be considered Fisheye FOV with Cover Window 170˚ Keep FE FOV under all mechanical and optical design tolerances Cover Window Coatings Dual Side Anti-Reflect Coating Avoid Reflections; Other coating material might have an effect on performance and should be evaluated.
Total Window Transmission Wavelength Range 400 – 900nm Incident Half Angle Typical Trans 0-50˚ 97% 60˚ 95% 70˚ 85% 80˚ 65% 85˚ 45% Cover Window Overall Tilt Tolerance by System Integrator ±0.5˚
6.5 Mounting Guidance
6.5.1 Screw Mount
The Intel® RealSense™ Tracking Module T261 module incorporates a screw hole for module mounting. The module should be mounted on a large heat sink or a heat dissipating structure element using M1.4 screw at the screw hole and thermal adhesive in the middle region (ex: 3M 8810). Thermal interface material should be used on backside region of ASIC and two fisheye imagers between camera module and heat sink or heat dissipating structure element for thermal transfer. Figure 6-3. T261 Module Screw Mount Note: Recommended torque for both M1.4 mounting points is 1.6kgf*cm.
6.5.2 Occlusion Avoidance
In order to improve quality of the 6DoF tracking capability of the Intel® RealSense™ Tracking Module T261 device, it is recommended that the mounting solution, whether integrated into HMD or used as a peripheral attachment, avoid covering, blocking or occluding the camera FOV. Below are images, depictions of possible mounting positions and mounting faults are examples for the VR segment. Other segments for T261 will have its own challenges that may not be depicted below. Figure 6-4. Example for VR: HMD Positioning for Controller Note: Customers own the effort to design their own solution of controllers or gesture control.
Figure 6-5. Example for VR: Front Mounting Advantages Figure 6-6. Example for VR: Top Mounting Challenges
6.6 Gaskets
Gaskets are recommended for providing optical isolation and dust protection. However, gaskets can impede FOV and place unwanted stress on the module or the individual sensor lens holders. Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image quality and permanent damage to the camera. Gaskets placed on the module stiffener
can transfer chassis flex into the camera module causing loss of data. Gasket thickness has a large effect on the static force applied to the module surface. The thinner the seal, the greater the static force applied. Once the gasket is compressed, the static force will increase exponentially.
6.6.1 Dust Protection
Dust particles can accumulate over the camera lenses which can be visually unappealing and degrade image quality.
6.7 Center of Tracking Location
The users of the tracking module and tracking camera must take into consideration the location of tracking as it pertains to the PCB inside chassis and the relationship this location has with respect to the overall system. The center of tracking corresponds to the center location between the right and left imagers on the PCB. The information in the figures below show the different mechanical specifics that help in understanding center of tracking. The center of tracking information also pertains to the coordinate system which will be discussed in future section in this document. Figure 6-7. Intel® RealSense™ Tracking Module T261 Center of Tracking Location
Figure 6-8. Intel® RealSense™ Tracking Camera T265 Center of Tracking Location Note: Recommended torque for both M3 mounting points is 0.4Nm.
6.8 Tracking System Coordinate System
Figure 6-9. Tracking System Coordinate System Notes: 1. Positive X direction is towards right imager (same for world c oordinates) 2. Positive Y direction is upwards toward the top of the device (same for world coordinates) 3. Positive Z direction is inwards toward the back of the devic e (same for world coordinates)
- Coordinate system is the same for both the Intel® RealSense™ Tra cking Module T261 and Intel® RealSense™ Tracking Camera T265 § §
7 Product Regulatory
System integrators should refer to their respective regulatory and compliance owner to finalize regulatory requirements for a specific geography. Do not power on the product if any external damage was observed. Do not try to update camera firmware that is not officially released for specific camera module SKU and revision.
7.1 Manufacturer’s Information
Manufactured by Intel Corporation Attn: Corp. Quality 2200 Mission College Blvd., Santa Clara, CA 95054 USA EU Single Place of Contact: Attn: Corp Quality Intel Deutschland GmbH Am Campeon 10-12 Neubiberg, 85579 - Germany
7.2 NRTL Statement
For the US and Canada market, this product has been tested and certified by Nemko, and found to be compliant with all applicable requirements of the specifications below. UL 60950-1 2nd Edition, CAN/CSA C22.2 No. 60950-1-07, Information Technology Equipment – Safety – Part 1: General Requirements
Nemko is a Nationally Recognized Testing Laboratory (NRTL), recognized by US Occupational Safety and Health Administration (OSHA) as qualified to perform safety testing and certifications covered within its scope of recognition. Figure 7-1. NRTL Certification https://www.nemko.com/certification/product- certification/certificates Certificate #: NA201911024 (for T265 only)
7.3 Ecology Compliance
7.3.1 RoHS Declaration
产品中有毒有害物质的名称及含量 Hazardous Substances Table 部件名称 Component Name 有毒有害物质或元素 Hazardous Substance 铅 Pb 汞 Hg 镉 Cd 六价铬 Cr (VI) 多溴联苯 PBB 多溴二苯醚 PBDE 相机 Camera 印刷电路板组件 Printed Board Assemblies 60950
○：表示该有毒有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。 ○：Indicates that this hazardous substance contained in all homogeneous materials of such component is within the limits specified in GB/T 26572. ×：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。 ×： Indicates that the content of such hazardous substance in at least a homogeneous material of such component exceeds the limits specified in GB/T 26572. 对销售之日的所售产品,本表显示我公司供应链的电子信息产品可能包含这些物质。注意：在所售产品中 可能会也可能不会含有所有所列的部件。 This table shows where these substances may be found in the supply chain of our electronic 除非另外特别的标注,此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个 不同的环保使用期限(例如,电池单元模块). 此环保使用期限只适用于产品在产品手册中所规定的条件下工作 . The Environment-Friendly Use Period (EFUP) for all enclosed products and their parts are per the symbol shown here, unless otherwise marked. Certain field-replaceable parts may have a § §