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Intel® Server System R1000WT Family Intel® Storage System R1000WT Family Technical Product Specification A document providing an overview of product features, functions, architecture, and support specifications Revision 1.06 November 2016 Intel® Server Boards and Systems

Intel® R1000WT Server System TPS ii November 2016

Revision History

September 2014 1.0 First External Public Release November 2014 1.01

• Added packaging specs and system weight data
• Added DIMM Slot population requirements to maintain system thermals in Section 4.1
• Added section 5.2 System Fan RVI and Hard Disk Drive Storage Performance
• Updated PCIe* SFF SSD (NVMe) feature support
• Added support for dual RMFBU accessory kit
• Updated System Status LED State Definition table
• Added missing cable routing diagram in Appendix E
• Updated Thermal Config Table data December 2014 1.02
• Updated Section 4.1 – Add-in card support requirements
• Updated PCIe* SFF SSD (NVMe) feature support
• Added Appendix F – Statement of Volatility May 2015 1.03
• Update document Legal Disclaimer statements
• Chapter 2 – added OS Support list and defined OS validation test levels and technical support levels
• Section 2.12.1 - Updated product weight information
• Section 5.6.5 - Updated 8 x 2.5” Drive Combo SAS / PCIe* SFF (NVMe) SSD Backplane Accessory Kit March 2016 1.04
• Updated to include “R” in product SKU names.
• Updated Rail kits.
• Updated to include Intel® Storage Server R1000WT family November 2016 1.06 • Appendix F – Added the SOV for 750W power supply module

Intel® R1000WT Server System TPS November 2016 iii Disclaimers Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. Intel, the Intel logo, Xeon, and Xeon Phi are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright © 2016 Intel Corporation. All Rights Reserved.

Intel® R1000WT Server System TPS iv November 2016 Table of Contents

Intel® R1000WT Server System TPS November 2016 v

Intel® R1000WT Server System TPS vi November 2016

Intel® R1000WT Server System TPS November 2016 1 1. Introduction This Technical Product Specification (TPS) provides system level information for the Intel® Server System R1000WT product family. This document describes the embedded functionality and available features of the integrated server system which includes: the chassis layout, system boards, power subsystem, cooling subsystem, storage subsystem options, and available installable options. Note that some system features are provided as configurable options and may not be included standard in every system configuration offered. Please reference the Intel® Server Board S2600WT Product Family Configuration Guide for a list of configured options for all system SKUs made available. Server board specific detail can be obtained by referencing the Intel® Server Board S2600WT Technical Product Specification. In addition, design-level information related to specific server board components/subsystems can be obtained by ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to this server generation. EPS and EDS documents are made available under NDA with Intel and must be ordered through your local Intel representative. See the Reference Documents section at the end of this document for a list of available documents.

1.1 Chapter Outline

This document is divided into the following chapters:  Chapter 1 – Introduction  Chapter 2 – Product Family Overview  Chapter 3 – System Power  Chapter 4 – Thermal Management  Chapter 5 – System Storage and Peripherals Drive Bay Overview  Chapter 6 – Storage Controller Options Overview  Chapter 7 – Front Control Panel and I/O Panel Overview  Chapter 8 – Intel® Local Control Panel  Chapter 9 – PCIe* Riser Card Support  Chapter 10 – Intel® I/O Module Support  Chapter 11 – Basic and Advanced Server Management Features  Appendix A – Integration and Usage Tips  Appendix B – POST Code Diagnostic LED Decoder  Appendix C – Post Code Errors  Appendix D – System Configuration Tables for Thermal Compatibility  Appendix E – System Cable Routing Diagrams  Appendix F – Statement of Volatility  Appendix G – Intel® Storage System R1000WT Family Overview  Glossary  Reference Documents

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1.2 Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel-developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non- operating limits.

1.3 Product Errata

Shipping product may have features or functionality that may deviate from published specifications. These deviations are generally discovered after the product has gone into formal production. Intel terms these deviations as product Errata. Known product Errata will be published in the Monthly Specification Update for the given product family which can be downloaded from the following Intel web site: http://www.intel.com/support

server board: Intel® Server Board S2600WT. option is provided in the following chapters. Table 1. Intel® Server System R1000WT Product Family Feature Set  Maximum supported Thermal Design Power (TDP) of up to 145 W.

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/ headers  One Type-A USB 2.0 connector  One 2x5 pin connector providing front panel support for two USB 2.0 ports  One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports  One 2x15 pin SSI-EEB compliant front panel header  One 2x7pin Front Panel Video connector  One 1x7pin header for optional Intel® Local Control Panel (LCP) support  One DH-10 Serial Port B connector Intel® I/O Module Accessory Options The server board includes a proprietary on-board connector allowing for the installation of a variety of available Intel® I/O modules. An installed I/O module can be supported in addition to standard on-board features and add-in PCIe cards.  AXX4P1GBPWLIOM – Quad port RJ45 1 GbE based on Intel® Ethernet Controller I350  AXX10GBTWLIOM3 – Dual port RJ-45 10GBase-T based on Intel® Ethernet Controller x540  AXX10GBNIAIOM – Dual port SFP+ 10 GbE module based on Intel® 82599 10 GbE controller  AXX1FDRIBIOM – Single port QSFP FDR 56 GT/S speed InfiniBand* module  AXX2FDRIBIOM – Dual port QSFP FDR 56 GT/S speed infiniband* module  AXX1P40FRTIOM – Single port QSFP+ 40 GbE module  AXX2P40FRTIOM – Dual port QSFP+ 40 GbE module System Fans  Six managed 40mm dual rotor system fans  One power supply fan for each installed power supply module Riser Card Support Support for two riser cards:  Riser #1 – PCIe* Gen3 x24 – 1 PCIe slot  Riser #2 – PCIe* Gen3 x24 – 1 PCIe slot With two riser cards installed, up to 2 possible add-in cards can be supported:  2 Full Height / Half Length add-in cards via Risers #1 and #2 Video  Integrated 2D Video Controller  16 MB DDR3 Memory On-board storage controllers and options  10 x SATA 6Gbps ports (6Gb/s, 3 Gb/s and 1.5Gb/s transfer rates are supported) o Two single port SATA connectors capable of supporting up to 6 Gb/sec o Two 4-port mini-SAS HD (SFF-8643) connectors capable of supporting up to 6 Gb/sec /SATA  One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices  Optional SAS IOC/ROC support via on-board Intel® Integrated RAID module connector  Embedded Software SATA RAID o Intel® Rapid Storage RAID Technology (RSTe) 4.1 o Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 with optional RAID 5 key support Security  Intel® Trusted Platform Module (TPM) - AXXTPME5 (1.2), AXXTPME6 (v2.0) and AXXTPME7 (v2.0) (Accessory Option) Server Management  Integrated Baseboard Management Controller, IPMI 2.0 compliant  Support for Intel® Server Management Software  On-board RJ45 management port  Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option) Power Supply Options  The server system can have up to two power supply modules installed, providing support for the following power configurations: 1+0, 1+1 Redundant Power, and 2+0 Combined Power  Two power supply options: o AC 750W Platinum o DC 750W Gold

2.1 Operating System Support

systems. This list will be updated as new operating systems are validated by Intel. Table 2. Operating System Support List Note: The * mark indicates it requires the drive driver to be recognize the drives during installation.

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Table 3. Operating System Validation Levels

2.1.1 OS Validation Levels

peripherals is used for installation purposes only. Add-in adapter cards are not tested. testing only. No heavy stressing of the systems or the cards is performed for CV testing.

Intel® R1000WT Server System TPS November 2016 7 Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour (two days), or a 72-hour (three days) test run without injecting errors. Each configuration passes an installation test and a Network/Disk Stress test. Any fatal errors that occur require a complete test restart.

2.1.2 OS Technical Support Levels

T1: Intel will provide support for issues involving the installation and/or functionality of a specified operating system as configured with or without supported adapters and/or peripherals. T2: Intel will provide and test operating system drivers for each of the server board’s integrated controllers, provided that the controller vendor has a driver available upon request. Vendors will not be required by Intel to develop drivers for operating systems that they do not already support. Intel will NOT provide support for issues related to the use of any add-in adapters or peripherals installed in the server system when an operating system that received only basic installation testing is in use. T3: Intel will not provide technical support for an open source operating system. All questions and issues related to an open source operating system must be submitted to and supported by the open source community supporting the given operating system.

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2.2 System Features Overview

Figure 1. System Components Overview Figure 2. Top Cover Features

240 VA UL

safety requirements of some countries.

2.3 Server Board Features Overview

Figure 3. Server Board Features

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following illustrations define each Diagnostic LED and identify their location. Figure 4. On-board Light Guided Diagnostics

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2.4 Back Panel Features

Figure 7. Back Panel Feature Identification

2.5 Front Control Panel

Figure 8. Front Control Panel Options

2.6 Front Drive Bay Options

Figure 9. 3.5" Drive Bay – 4 Drive Configuration (Model R1304WTxxxxx) Figure 10. 2.5" Drive Bay – 8 Drive Configuration (Model R1208WTxxxxx)

2.7 Locking Front Bezel

Figure 11. Front Bezel Figure 12. Front Bezel accessory with optionally installed wave feature Figure 13. Front Bezel accessory with optionally installed wave and ID badge (1)

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Figure 14. Front Bezel accessory with optionally installed wave and ID badge (2) Figure 15. Front Bezel accessory ID Badge mechanical drawings

2.8 System Dimensions

2.8.1 Chassis Dimensions

Figure 16. Chassis Dimensions

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2.8.2 Label Emboss Dimensions

Figure 17. Label Emboss Dimensions

2.8.3 Pull-out Tab Label Emboss Dimensions

Figure 18. Pull-out Tab Label Emboss Dimensions

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2.9 System Cable Routing Channels

The 1U system provides a cable routing channel (front-to-back / back–to-front) along each chassis sidewall. between the memory slots and CPU sockets. See Appendix E. for system cable routing diagrams. Figure 19. System Cable Routing Channels

Intel® R1000WT Server System TPS November 2016 19

2.10 Available Rack and Cabinet Mounting Kit Options

Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the server system while installed in a rack. If you chose to do so, Intel advises you verify your shipping configuration with appropriate shock and vibration testing, before shipment. Intel does not perform shipping tests which cover the complex combination of unique rack offerings and custom packaging options. Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the rack may result in failure of the rack rails, resulting in damage to the system or personal injury. Two people or the use of a mechanical assist tool to install and align the server into the rack is highly recommended.  AXXPRAIL – Tool-less rack mount rail kit - 1U and 2U compatible - 800mm max travel length - 54 lbs (24 Kgs) max support weight - Tool-less installation - Full extension from rack - Drop in system install - Optional cable management arm support  AXXELVRAIL – Enhanced Value rack mount rail kit - 1U to 4U compatible - 130 lbs (59 Kgs) max support weight - Tool-less chassis attach - Tools required to attach to rails to rack - 2/3 extension from rack - Improved robustness over AXXVRAIL, same mechanical spec  AXX1U2UCMA – Cable Management Arm – *supported with AXXPRAIL only  AXX2POSTBRCKT – 2-Post Fixed mount bracket kit - 1U and 2U compatible - Tools required to attach components to rack  A1USHRTRAIL - 1U Premium quality rails with no CMA support - Travel distance 780mm - Full extension from rack - Kit includes: Rails, screws, installation manual  A1UFULLRAIL - 1U Premium quality rails with CMA support. - Travel distance 780mm - Full extension from rack - Kit includes: Rails, screws, installation manual - For Cable Management arm support – order iPC AXX1U2UCMA

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2.11 System Level Environmental Limits

The following table defines the system level operating and non-operating environmental limits. Table 4. System Environmental Limits Summary ASHRAE Class A3 – Includes operation up to 40C for up to 900 hrs per year. ASHRAE Class A4 – Includes operation up to 45C for up to 90 hrs per year. Operating Support operation up to 3050m with ASHRAE class deratings. Thermal Configuration Tool for system configuration requirements and limitations.

Intel® R1000WT Server System TPS November 2016 21

2.12 System Packaging

The original Intel packaging, in which the server system is delivered, is designed to provide protection to a fully configured system and was tested to meet ISTA (International Safe Transit Association) Test Procedure 3A (2008). The packaging was also designed to be re-used for shipment after system integration has been completed. The original packaging includes two layers of boxes – an inner box and the outer shipping box, and various protective inner packaging components. The boxes and packaging components are designed to function together as a protective packaging system. When reused, all of the original packaging material must be used, including both boxes and each inner packaging component. In addition, all inner packaging components MUST be reinstalled in the proper location to ensure adequate protection of the system for subsequent shipment. NOTE: The design of the inner packaging components does not prevent improper placement within the packaging assembly. There is only one correct packaging assembly that will allow the package to meet the ISTA (International Safe Transit Association) Test Procedure 3A (2008) limits. See the Intel® Server System R1000WT Product Family System Integration and Service Guide for complete packaging assembly instructions. Failure to follow the specified packaging assembly instructions may result in damage to the system during shipment. Outer Shipping Box External Dimensions: Length = 983mm Breadth = 577mm Height = 260mm Inner Box Internal Dimensions: Length = 956mm Breadth = 550mm Height = 202mm

2.12.1 Intel Product Weight Information

(Kg) Packaged Gross Weight (Lbs) Un-packaged Net Weight (Kg) Un-packaged Net Weight (Lbs) R1304WTXXX Chassis Only 19.0 41.9 10.3 22.7 R1208WTXXX Chassis Only 19.0 41.9 10.3 22.7 R1304WTTGSR L6 System 21.3 47.0 12.3 27.1 R1304WT2GSR L6 System 21.3 47.0 12.3 27.1 R1208WTTGSR L6 System 21.1 46.5 12.9 28.4 R1208WT2GSR L6 System 21.1 46.5 12.9 28.4 Note: An L6 system does not include processors, memory, drives, or add-in cards. It is the system configuration as shipped from Intel. Integrated system weights (System configurations that include the items above) will vary depending on the final system configuration. For the 1U product family, a fully integrated un-packaged system can weigh upwards of 40 Lbs (18+ Kg).

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This chapter provides a high level overview of the features and functions related to system power.

3.1 Power Supply Configurations

and Chapter 4 Thermal Management, for details. Caution: Installing two Power Supply Units with different wattage ratings in a system is not supported. connector on the server board. Figure 20. 750W AC Power Supply swap extraction and insertion. The AC input is auto-ranging and power factor corrected.

3.2 Power Supply Module Options

3.2.1 Power Supply Module Efficiency

provided at three different load levels: 100%, 50%, and 20%. The AC power supply efficiency is tested over an AC input voltage range of 115 VAC to 220 VAC. Table 5. 750 Watt AC Power Supply Efficiency (Platinum) The DC power supply efficiency is tested with a -53V DC input. Table 6. 750 Watt DC Power Supply Efficiency (Gold)

3.2.2 Power Supply Module Mechanical Overview

Figure 21. Power Supply Module Overview

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connector in the system. The AC plugs directly into the external face of the power supply. Figure 22. 750W AC Power Supply Module Mechanical Drawing

3.2.3 Power Cord Specification Requirements

The AC power cord used must meet the specification requirements listed in the following table. Table 7. AC Power Cord Specifications Figure 23. AC Power Cord

Figure 24. DC Power Cord Specification Table 8. DC Power Cable Connector Pin-out

2 Safety Ground

3.3 AC Power Supply Input Specifications

3.3.1 Power Factor

Requirements for Computer Servers. These requirements are stated below. Tested at 230Vac, 50Hz and 60Hz and 115VAC, 60Hz.

3.3.2 AC Input Voltage Specification

Table 9. AC Input Voltage Range – 750W Power Supply

1. Maximum input current at low input voltage range shall be measured at 90VAC, at max load.
2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
3. This requirement is not to be used for determining agency input current markings.

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3.3.3 AC Line Isolation Requirements

and primary to ground circuits, must comply with the IEC 950 spacing requirements.

3.3.4 AC Line Dropout / Holdup

length of time. During an AC dropout the power supply must meet dynamic voltage regulation requirements. frequencies. A dropout of the AC line for any duration shall not cause damage to the power supply. Table 10. AC Line Holdup Time – 750W Power Supply

3.3.4.1 AC Line 12VSBHoldup

3.3.5 AC Line Fuse

line fusing shall be acceptable for all safety agency requirements. The input fuse shall be a slow blow type. includes DC output load short conditions.

3.3.6 AC Inrush

than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).

3.3.7 AC Line Transient Specification

The power supply shall meet the requirements under the following AC line sag and surge conditions.

Table 11. AC Line Sag Transient Performance Table 12. AC Line Surge Transient Performance

3.3.8 Susceptibility Requirements

an external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification. Table 13. Performance Criteria A The apparatus shall continue to operate as intended. No degradation of performance. B The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits.

3.3.9 Electrostatic Discharge Susceptibility

61000-4-2: Edition 1.2: 2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.

3.3.10 Fast Transient/Burst

3.3.11 Radiated Immunity

61000-4-3: Edition 2.1: 2002-09 test standard and performance criteria A defined in Annex B of CISPR 24.

3.3.12 Surge Immunity

the test profile; No component damage under any condition.

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61000-4-5: Edition 1.1:2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.

3.3.13 Power Recovery

any loss of AC power that exceeds the dropout criteria.

3.3.14 Voltage Interruptions

3.3.15 Protection Circuits

cycle HIGH for one second reset the power supply.

3.3.15.1 Over-current Protection (OCP)

Table 14. Over Current Protection – 750 Watt Power Supply

3.3.15.2 Over-voltage Protection (OVP)

connector. 12VSB will be auto-recovered after removing OVP limit. Table 15. Over Voltage Protection (OVP) Limits – 750W Power Supply

3.3.15.3 Over-temperature Protection (OTP)

of ambient temperature margin.

3.3.16 Power Supply Status LED

Table 16. LED Indicators power supply in parallel still with AC input power.

3.4 DC Power Supply Input Specifications

connected to separate ground wires while the system is operational.

3.4.1 DC Input Voltage

The power supply must operate within all specified limits over the following input voltage range. Table 17. DC Input Rating

3.4.2 DC Input Fuse

includes DC output load short conditions.

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3.4.3 DC Inrush Current

the DC input line voltage should not damage the power supply or cause the input fuse to blow.

3.4.4 DC Input Under Voltage

supply unit (due to over-heating or otherwise).

3.4.5 DC Holdup Time and Dropout

the DC dropout requirement over rated DC voltages and output loading conditions.

3.4.6 DC Line Surge Voltages (Line Transients)

in Intel Environmental Standards Handbook 2001. Table 18. Line Voltage Transient Limits

3.4.7 Susceptibility Requirements

an external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification.

Intel® R1000WT Server System TPS November 2016 31 Level Description A The apparatus shall continue to operate as intended. No degradation of performance. B The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits. C Temporary loss of function is allowed provided the function is self-recoverable or can be restored by the operation of the controls.

3.4.7.1 Electrostatic Discharge Susceptibility

The power supply shall comply with the limits defined in EN 55024: 1998 using the IEC 61000-4-2:1995 test standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified in the Intel Environmental Standards Handbook.

3.4.7.2 Fast Transient/Burst

The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-4:1995 test standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified in the Intel Environmental Standards Handbook.

3.4.7.3 Radiated Immunity

The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-3:1995 test standard and performance criteria A defined in Annex B of CISPR 24. Limits shall comply with those specified in the Intel Environmental Standards Handbook. Additionally, must also comply with field strength requirements specified in GR 1089 (10V/meter).

3.4.7.4 Surge Immunity

The power supply shall be tested with the system for immunity, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. The pass criteria include: No unsafe operation is allowed under any condition; all power supply output voltage levels to stay within proper spec levels; no change in operating state or loss of data during and after the test profile; no component damage under any condition. The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-5:1995 test standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified in the Intel Environmental Standards Handbook.

3.4.8 Protection Circuits

Protection circuits inside the power supply shall cause only the power supply’s main outputs to shut down. If the power supply latches off due to a protection circuit tripping, a DC cycle OFF for 15sec and a PSON# cycle HIGH for 1sec shall be able to reset the power supply.

3.4.8.1 Current Limit (OCP)

The power supply shall have current limit to prevent the outputs from exceeding the values shown in table below. If the current limits are exceeded the power supply shall shut down and latch off. The latch will be cleared by toggling the PSON# signal or by a DC power interruption. The power supply shall not be damaged from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP limit.

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Table 19. Over Current Protection – 750 Watt Power Supply

3.4.8.2 Over Voltage Protection (OVP)

levels when measured at the power connector. 12VSBwill be auto-recovered after removing OVP limit. Table 20. Over Voltage Protection Limits – 750 Watt Power Supply

3.4.8.3 Over Temperature Protection (OTP)

of ambient temperature margin.

3.5 Cold Redundancy Support

CR_BUS signal causes all power supplies in Cold Standby state to power ON. comparing it to a programmed voltage level via a PMBus command.

Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.

3.5.1 Powering on Cold Standby supplies to maintain best efficiency

Table 21. Example Load Share Threshold for Activating Supplies

1. Maximum load share voltage = 8.0V at 100% of rated output power
2. These are example load share bus thresholds; for a given power supply, these shall be customized to maintain the best

efficiency curve for that specific model.

3.5.2 Powering on Cold Standby Supplies during a Fault or Over Current Condition

standby mode shall power on within 100μsec.

3.5.3 BMC Requirements

redundancy and to turn on/off cold redundancy. 3 power supply. This allows for equal loading across power supply over their life. Events that trigger a re-configuration of the power supplies using the Cold_Redundancy_Config command.

3.5.4 Power Supply Turn On Function

do this each time the system is powered on, a power supply fails, or a power supply is added to the system.

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The system is relied upon to tell each power supply where it resides in the Cold Redundancy scheme.

3.6 Closed Loop System Throttling (CLST)

memory and/or processors to reduce power. System performance will be impacted should this occur.

3.7 Smart Ride Through (SmaRT)

both system memory and CPUs, which in turn reduces the power load during the AC line drop out event.

3.8 Server Board Power Connectors

sub-sections will provide the pin-out definition; and a brief usage description for each.

3.8.1 Power Supply Module Card Edge Connector

signals to the server board. The following table defines the connector pin-out. Table 22. Power Supply Module Output Power Connector Pin-out

3.8.2 Hot Swap Backplane Power Connector

Table 23. Hot Swap Backplane Power Connector Pin-out (“HSBP PWR")

3.8.3 Optical Drive and SSD Power Connector

provides the pin-out for this connector. Table 24. Peripheral Drive Power Connector Pin-out (“Peripheral PWR”)

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overheating and allow the system to operate with best performance. Figure 25. System Air Flow and Fan Identification Table 25. System Volumetric Air Flow

Intel® R1000WT Server System TPS November 2016 37 The Intel® Server System R1000WT product family supports short-term, excursion-based, operation up to 45°C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are described in the configuration matrix found in Appendix D of this document or in the Intel® Server Board S2600WT Product Family Power Budget and Thermal Configuration Tool, available as a download online at http://www.intel.com/support The installation and functionality of several system components are used to maintain system thermals. They include six managed 40mm dual rotor system fans, fans integrated into each installed power supply module, an air duct, populated drive carriers, and installed CPU heats sinks. Drive carriers can be populated with a storage device (SSD or Hard Disk Drive) or supplied drive blank. In addition, it may be necessary to have specific DIMM slots populated with DIMMs or supplied DIMM blanks. Systems configurations that require population of specific DIMM slots will ship from Intel with DIMM blanks pre-installed. Pre-installed DIMM blanks should only be removed when installing a memory module in its place.

4.1 Thermal Operation and Configuration Requirements

To keep the system operating within supported maximum thermal limits, the system must meet the following operating and configuration guidelines:  The system operating ambient is designed for sustained operation up to 35°C (ASHRAE Class A2) with short term excursion based operation up to 45°C (ASHRAE Class A4). - The system can operate up to 40°C (ASHRAE Class A3) for up to 900 hours per year - The system can operate up to 45°C (ASHRAE Class A4) for up to 90 hours per year - System performance may be impacted when operating within the extended operating temperature range - There is no long term system reliability impact when operating at the extended temperature range within the documented limits.  Specific configuration requirements and limitations are documented in the configuration matrix found in Appendix D of this document or in the Intel ® Server Board S2600WT product family Power Budget and Thermal Configuration Tool, available as a download online at http://www.intel.com/support  The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed at all times, with or without a processor installed  Thermally, a system supporting fan redundancy can support the following PCI add-in cards when the system is operating at a maximum operating ambient temperature of 35°C (ASHRAE Class 2). - Add-in cards with a minimum 300 LFM (1.5 m/s) air flow requirement or lower can be installed in available add-in card slots in Riser Card #1 and Riser Card #2 - Add-in cards with an air flow requirement greater than 300 LFM cannot be supported in any PCIe slot on any riser - Note: Most PCI add-in cards have minimum air flow requirements of 100 LFM (0.5m/s). Some high power add-in cards have minimum air flow requirements of 300 LFM (1.5 m/s) or higher. System integrators should verify PCI add-in card air flow requirements from vendor specifications when integrating add-in cards into the system.

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 Memory Slot population requirements –  NOTE: Some system configurations may come with pre-installed DIMM blanks in some memory slots. DIMM blanks should only be removed when installing a DIMM in the same DIMM slot. Memory population rules apply when installing DIMMs - DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C, and D. Start with the 1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only remove factory installed DIMM blanks when populating the slot with memory - DIMM Population Rules on CPU-2 – Install DIMMs in order; Channels E, F, G, and H. Start with the 1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3. Only remove factory installed DIMM blanks when populating the slot with memory - The 3rd DIMM slot for each memory channel must be populated with a DIMM or supplied DIMM blank for all R1304WTxxxx and R1208WTxxxx based system configurations  All externally accessed drive bays must be populated. Drive carriers can be populated with a storage device (SSD or HDD) or supplied drive blank  With the system operating, the air duct must be installed at all times  In single power supply configurations, the 2nd power supply bay must have the supplied filler blank installed at all times  The system must be configured with dual power supplies for the system to support system fan redundancy  Fan redundancy is lost if more than one system fan rotor is in a failed state  System fan redundancy is not supported with systems operating at ASHRAE A3 or A4 thermal limits  The system top cover must be installed at all times when the system is in operation

4.2 Thermal Management Overview

In order to maintain the necessary airflow within the system, all of the previously listed components and top cover need to be properly installed. For best system performance, the external ambient temperature should remain below 35°C and all system fans (all rotors) should be operational. The system is designed for fan redundancy when the system is configured with two power supplies, all system fans are present and operational, and ambient air remains at or below ASHRAE class 2 limits (See table 2). In fan redundancy mode, should a single system fan rotor failure occur, integrated platform management will: change the state of the System Status LED to flashing Green, report an error to the system event log, and automatically adjust remaining fan speeds as needed to maintain system temperatures below maximum thermal limits. Note: All system fans are controlled independent of each other. The fan control system may adjust fan speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the chassis. In the event that system temperatures should continue to increase with the system fans operating at their maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or the processors or both, in order to keep components from overheating and keep the system operational. Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed limits. The power supply will be protected against over temperature conditions caused by excessive ambient temperature. In an over-temperature protection condition, the power supply module will shut down.

Intel® R1000WT Server System TPS November 2016 39 Should system thermals increase to a point beyond the maximum thermal limits, the system will shut down, the System Status LED will change to a solid Amber state, and the event will be logged to the system event log. Should power supply thermals increase to a point beyond its maximum thermal limit or if a power supply fan should fail, the power supply will shut down. Note: For proper system thermal management, Sensor Data Records (SDRs) for any given system configuration must be loaded by the system integrator as part of the initial system integration process. SDRs are loaded using the FRUSDR utility which is part of the System Update Package (SUP) or One-boot Firmware Update (OFU) package which can be downloaded from the following Intel website: http://downloadcenter.intel.com

4.2.1 Fan Speed Control

The baseboard management controller (BMC) controls and monitors the system fans. Each fan is associated with a fan speed sensor that detects fan failure. For redundant fan configurations, the fan failure and presence status determines the fan redundancy sensor state. The system fans are divided into fan domains, each of which has a separate fan speed control signal and a separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors associated with it. These are used to determine the current fan domain state. A fan domain has three states:

• The sleep and boost states have fixed (but configurable through OEM SDRs) fan speeds associated with them
• The nominal state has a variable speed determined by the fan domain policy. An OEM SDR record is used to configure the fan domain policy The fan domain state is controlled by several factors. They are listed below in order of precedence, high to low:  Boost o Associated fan is in a critical state or missing. The SDR describes which fan domains are boosted in response to a fan failure or removal in each domain. If a fan is removed when the system is in ‘Fans-off’ mode it will not be detected and there will not be any fan boost till system comes out of ‘Fans-off; mode. o Any associated temperature sensor is in a critical state. The SDR describes which temperature threshold violations cause fan boost for each fan domain. o The BMC is in firmware update mode, or the operational firmware is corrupted. o If any of the above conditions apply, the fans are set to a fixed boost state speed.  Nominal o A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one or more associated temperature sensors.

4.2.1.1 Programmable Fan PWM Offset

The system provides a BIOS Setup option to boost the system fan speed by a programmable positive offset or a “Max” setting. Setting the programmable offset causes the BMC to add the offset to the fan speeds to which it would otherwise be driving the fans. The Max setting causes the BMC to replace the domain minimum speed with alternate domain minimums that also are programmable through SDRs.

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This capability is offered to provide system administrators the option to manually configure fan speeds in instances where the fan speed optimized for a given platform may not be sufficient when a high end add-in adapter is configured into the system. This enables easier usage of the fan speed control to support Intel as well as third party chassis and better support of ambient temperatures higher than 35°C.

4.2.1.2 Fan Redundancy Detection

The BMC supports redundant fan monitoring and implements a fan redundancy sensor. A fan redundancy sensor generates events when it is associated set of fans transitions between redundant and non-redundant states, as determined by the number and health of the fans. The definition of fan redundancy is configuration dependent. The BMC allows redundancy to be configured on a per fan redundancy sensor basis through OEM SDR records. A fan failure up to the number of redundant fans specified in the SDR in a fan configuration is a non-critical failure and is reflected in the front panel status. A fan failure or removal that exceeds the number of redundant fans is a non-fatal, insufficient-resources condition and is reflected in the front panel status as a non-fatal error. Redundancy is checked only when the system is in the DC-on state. Fan redundancy changes that occur when the system is DC-off or when AC is removed will not be logged until the system is turned on.

4.2.1.3 Fan Domains

System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven separately for each domain by integrated PWM hardware. Fan speed is changed by adjusting the duty cycle, which is the percentage of time the signal is driven high in each pulse. The BMC controls the average duty cycle of each PWM signal through direct manipulation of the integrated PWM control registers. The same device may drive multiple PWM signals.

4.2.1.4 Nominal Fan Speed

A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one or more associated temperature sensors. OEM SDR records are used to configure which temperature sensors are associated with which fan control domains and the algorithmic relationship between the temperature and fan speed. Multiple OEM SDRs can reference or control the same fan control domain; and multiple OEM SDRs can reference the same temperature sensors. The PWM duty-cycle value for a domain is computed as a percentage using one or more instances of a stepwise linear algorithm and a clamp algorithm. The transition from one computed nominal fan speed (PWM value) to another is ramped over time to minimize audible transitions. The ramp rate is configurable by means of the OEM SDR. Multiple stepwise linear and clamp controls can be defined for each fan domain and used simultaneously. For each domain, the BMC uses the maximum of the domain’s stepwise linear control contributions and the sum of the domain’s clamp control contributions to compute the domain’s PWM value, except that a stepwise linear instance can be configured to provide the domain maximum.

Intel® R1000WT Server System TPS November 2016 41 Hysteresis can be specified to minimize fan speed oscillation and to smooth fan speed transitions. If a Tcontrol SDR record does not contain a hysteresis definition, for example, an SDR adhering to a legacy format, the BMC assumes a hysteresis value of zero.

4.2.1.5 Thermal and Acoustic Management

This feature refers to enhanced fan management to keep the system optimally cooled while reducing the amount of noise generated by the system fans. Aggressive acoustics standards might require a trade-off between fan speed and system performance parameters that contribute to the cooling requirements and primarily memory bandwidth. The BIOS, BMC, and SDRs work together to provide control over how this trade-off is determined. This capability requires the BMC to access temperature sensors on the individual memory DIMMs. Additionally, closed-loop thermal throttling is only supported with buffered DIMMs.

4.2.1.6 Thermal Sensor Input to Fan Speed Control

The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI models of actual physical sensors whereas some are “virtual” sensors whose values are derived from physical sensors using calculations and/or tabular information. The following IPMI thermal sensors are used as input to fan speed control:

• Front Panel Temperature Sensor1
• CPU Margin Sensors2,4,5
• DIMM Thermal Margin Sensors2,4
• Exit Air Temperature Sensor1, 7, 9
• PCH Temperature Sensor3,5
• On-board Ethernet Controller Temperature Sensors3, 5
• Add-In Intel SAS Module Temperature Sensors3, 5
• PSU Thermal Sensor3, 8
• CPU VR Temperature Sensors3, 6
• DIMM VR Temperature Sensors3, 6
• BMC Temperature Sensor3, 6
• Global Aggregate Thermal Margin Sensors 7
• Hot Swap Backplane Temperature Sensors
• I/O Module Temperature Sensor (With option installed)
• Intel® SAS Module (With option installed)
• Riser Card Temperature Sensors (2U system only)
• Intel® Xeon Phi™ coprocessor (2U system only with option installed) Notes: 1. For fan speed control in Intel chassis 2. Temperature margin from throttling threshold 3. Absolute temperature 4. PECI value or margin value 5. On-die sensor 6. On-board sensor 7. Virtual sensor 8. Available only when PSU has PMBus 9. Calculated estimate

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Figure 26. Fan Control Model

4.3 System Fans

primary airflow for the system. system fan rotor is in a failed state. place by fitting them over mounting pins coming up from the chassis base.

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Table 26. System Fan Connector Pin-out

4.4 Power Supply Module Fans

fan fail, the power supply will shut down.

4.5 FRUSDR Utility

used to communicate system health to supported platform management software and support mechanisms. configuration data, and the appropriate sensor data records (SDRs), for use by these management features. SDR data should be updated to the latest available as part of a planned system software update.

Intel® R1000WT Server System TPS November 2016 45 The FRUSDR utility for the given server platform can be downloaded as part of the System Update Package (SUP) or One-boot Firmware Update (OFU) package from the following Intel web site: http://downloadcenter.intel.com Note: The embedded platform management system may not operate as expected if the platform is not updated with accurate system configuration data. The FRUSDR utility must be run with the system fully configured during the initial system integration process for accurate system monitoring and event reporting.

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1. System Storage and Peripheral Drive Bay Overview

available accessory options installed. This section will provide an overview of each available option.

5.1 Front Mount Drive Support

system options provide front panel I/O and front control panel support. Figure 29. 8x2.5" Drive Bay Configuration (Model R1208xxxxx)

Figure 30. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx)

5.2 System Fan RVI and Hard Disk Drive Storage Performance

at or below the platform ambient thermal limit of 35°C (95°F). devices at higher risk of performance degradation.

• Avoid sustained server operation in extreme operating environments. Doing so will cause the system fans to operate at their upper speed limits and produce higher levels of RVI which could affect hard drive performance. Note: Solid State Drive (SSD) performance is not impacted by the effects of system fan RVI.

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5.3 Hot Swap Storage Device Carriers

carrier. Drive carriers include a latching mechanism used to assist with drive extraction and drive insertion. tray. Drive trays must be installed with either a drive or supplied drive blank. blanks used with the 3.5” drive carrier can also be used to mount a 2.5” SSD into it as shown below. Figure 31. 2.5" SSD mounted to 3.5" Drive Tray

drive blank cannot be supported. backplane to the drive carrier faceplate, making them visible from the front of the system. Figure 32. Drive Tray LED Identification Table 27. Drive Status LED States Table 28. Drive Activity LED States

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5.4 Peripheral Power Sources

“HSBP_PWR” and “Peripheral_PWR” on the server board as illustrated below. Figure 33. Server Board Peripheral Power Connectors Peripheral Power – The “Peripheral_PWR” connector is used to provide power to the optical SATA drive.

5.5 Optical Drive Support

Figure 34. Optical Drive Support be replaced with a SATA optical drive. SATA connectors on the server board. Figure 35. Optical Drive Installation

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5.6 Storage Backplane Options

The 1U systtem has support for several backplane options. Figure 36. Backplane Installation

5.6.1 SGPIO Functionality

that in turn are monitored by the server board BMC for generating corresponding SEL events.

5.6.2 I2C Functionality

microcontroller for DRIVE PRESENCE, FAULT, and RAID REBUILD in progress. can be supported within a common backplane. Each backplane can support either SATA or SAS devices. However, mixing of SATA and SAS devices within a common hot swap backplane is not supported. are routed to a single multi-port mini-SAS HD connector on the back side of the backplane. Figure 37. 4 x 3.5” Drive Hot-Swap Backplane – front view On the backside of the backplane are several connectors. The following illustration identifies each.

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Figure 38. 4 x 3.5” Drive Hot-Swap Backplane – rear view A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane. Power is routed to the backplane via a power cable harness from the server board. connectors on the server board or add-in SAS/SATA RAID cards. can be supported within a common backplane. Each backplane can support either SATA or SAS devices. However, mixing of SATA and SAS devices within a common hot swap backplane is not supported. Figure 39. 8 x 2.5” Drive SAS/SATA Backplane – front view

On the backside of each backplane there are several connectors. The following illustration identifies each. Figure 40. 8 x 2.5” Drive SAS/SATA Backplane – rear view A – Power Harness Connector – The backplane includes a 2x2 connector supplying power to the backplane. Power is routed to the backplane via a power cable harness from the server board.

1 GND P12V 3

2 GND P12V 4

1 SMB_3V3SB_DAT

2 GND

3 SMB_3V3SB_CLK

4 SMB_ADD0

5 SMB_ADD1

routed from matching connectors on the server board or add-in SAS/SATA RAID cards.

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SAS/SATA drives and up to four PCIe* SFF (Small Form Factor) (NVMe) SSD drives. https://serverconfigurator.intel.com for a list of supported PCIe* storage devices.

• This kit is only supported in dual processor configurations
• The backplane is capable of supporting 12 Gb/s SAS or 6 Gb SAS/SATA drives. The SAS/SATA drives are hot-swappable. However, mixing of SATA and SAS drives within a common hot swap backplane is not recommended.
• PCIe* SFF (NVMe) SSDs are hot swap / hot plug capable. Support and usage is OS dependent (See Table 37). The server system must have the following System Software installed. o System BIOS version R01.01.1008 or later o BMC Firmware version 01.18.7601 or later o FRUSDR version 1.06 or later System software updates can be downloaded from the following Intel web site: http://downloadcenter.intel.com/
• To identify a PCIe* SFF drive from a SAS / SATA drive, two different drive carriers are included in the kit. Drive carriers with a Blue latch are used to identify PCIe* SFF (NVMe) drives. Drives carriers with a Green latch are used to identify SAS / SATA drives

Figure 41. Combo Backplane Kit Device Carrier Identification

• Each drive carrier includes separate LED indicators for drive Activity and drive Status. However, their functionality may differ depending on the drive type. For SAS and SATA LED support, see section 6.3. PCIe* SFF (NVMe) LED support is as follows:
• Any combination and number of drives up to eight can be supported as long as the number of PCIe* SFF (NVMe) devices does not exceed four and they are installed into any of the first four drive connectors on the backplane. The remaining drives can be SAS or SATA. NOTE: Mixing of PCIe* SFF and SAS/SATA devices in an alternating manner (as identified in the following example) is not a recommended configuration. Example – “SAS/SATA” + “PCIe* SFF” + “SAS/SATA” + “PCIe* SFF”.
• The front side of the backplane includes eight drive interface connectors: four SFF-8639 PCIe/SAS/SATA capable, and four SFF-8680 SAS/SATA only. All eight connectors can support SATA or SAS drives, but only the last four on the backplane are capable of supporting PCIe* SFF (NVMe) drives. Labels Description A SAS/SATA_0 B SAS/SATA_1 C SAS/SATA_2 D SAS/SATA_3 E PCIe* SFF_0 or SAS/SATA_4 F PCIe* SFF _1 or SAS/SATA_5 G PCIe* SFF _2 or SAS/SATA_6 H PCIe* SFF _3 or SAS/SATA_7

**Figure 42. 8 x 2.5" Combo SAS / PCIe* SFF (NVMe) Backplane – Front View**

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On the backside of the backplane are several connectors. The following illustration identifies each. Figure 43. Combo Backplane Rear Connector Identification management interface between the server board and the installed backplane. RAID cards, or optionally installed SAS expander cards for drive configurations of greater than 8 hard drives. directly to an add-in PCIe* SFF SFF controller card installed in one of the riser card slots on the server board.

• The PCIe* SFF add-in re-driver card is ONLY supported when configured in Riser Slot #2 of the server board. The PCIe* SFF add-in re-driver card will not be identified or configured by the system BIOS when installed in Riser Slot #1.

**Figure 44. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SAS**

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**Figure 45. Combo Backplane Cable Routing – PCIe* SFF (NVMe) + SATA**

5.6.5.1 Intel® Accessory Kit A2U44X25NVMEDK Operating System Support List

systems. This list will be updated as new operating systems are validated with this kit by Intel. Table 29. Intel® Accessory Kit A2U44X25NVMEDK Operating System Support List

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5.7 Low Profile eUSB SSD Support

“eUSB SSD” near the rear I/O section of the server board is used to plug this small flash storage device into. Figure 46. Low Profile eUSB SSD Support Visit https//serverconfigurator.intel.com for a list of supported devices.

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5.8 SATA DOM Support

The system has support for up to two vertical low profile Disk-on-Module (DOM) devices. Supported SATADOMs for this server board include those from Apacer* or Innodisk*. Note: In this server system, SATADOMs from Innodisk* must have firmware version S130710 or later. Each installed SATA DOM plugs directly into one of the white single port SATA connectors on the server board, which provide both power and I/O signals. SATA Port 5 SATA Port 4 Innodisk* Apacer*

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Each single port SATA connector has the following 7 + 2 pin-out. PIN SIGNAL PWR 2 GND

1 GND

2 SATAx_TX_DP

3 SATAx_TX_DN

4 GND

5 SATAx_RX_DN

6 SATAx_RX_DP

7 GND

Note: With a SATADOM device installed, only low profile PCIe* add-in cards can be used in Riser Slot #2 Visit https://serverconfigurator.intel.com for a list of supported SATA DOM devices.

1. Storage Controller Options Overview

6.1 Embedded SATA/SATA RAID Support

providing for up to ten 6 Gb/sec Serial ATA (SATA) ports. The following diagram identifies the location of all on-board SATA features. Figure 47. On-board SATA Features Note: the onboard SATA controllers are not compatible with and cannot be used with RAID Expander Cards.

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Table 30. SATA and sSATA Controller Feature Support

6 Gb/s Transfer Rate Capable of data transfers up to 6 Gb/s Supported Supported

following table identifies supported setup options. Table 31. SATA and sSATA Controller BIOS Utility Setup Options

Intel® R1000WT Server System TPS November 2016 67 SATA Controller sSATA Controller Supported RSTe Enhanced Yes RSTe Disabled Yes RSTe RSTe Yes RSTe ESRT2 No ESRT2 AHCI Microsoft* Windows Only ESRT2 Enhanced Yes ESRT2 Disabled Yes ESRT2 RSTe No ESRT2 ESRT2 Yes

6.1.1 Staggered Disk Spin-Up

Because of the high density of disk drives that can be attached to the Intel® C610 Onboard AHCI SATA Controller and the sSATA Controller, the combined startup power demand surge for all drives at once can be much higher than the normal running power requirements and could require a much larger power supply for startup than for normal operations. In order to mitigate this and lessen the peak power demand during system startup, both the AHCI SATA Controller and the sSATA Controller implement a Staggered Spin-Up capability for the attached drives. This means that the drives are started up separately, with a certain delay between disk drives starting. For the Onboard SATA Controller, Staggered Spin-Up is an option – AHCI HDD Staggered Spin-Up – in the Setup Mass Storage Controller Configuration screen found in the <F2> BIOS Setup Utility.

6.2 Embedded SATA SW-RAID support

The server board has embedded support for two SATA SW-RAID options:  Intel® Rapid Storage Technology (RSTe) 4.1  Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 based on LSI* MegaRAID SW RAID technology Using the <F2> BIOS Setup Utility, accessed during system POST, options are available to enable/disable SW RAID, and select which embedded software RAID option to use. Note: RAID partitions created using either RSTe or ESRT2 cannot span across the two embedded SATA controllers. Only drives attached to a common SATA controller can be included in a RAID partition. See Table 2 for a list of supported Operating Systems. 6.2.1 Intel® Rapid Storage Technology (RSTe) 4.1 Intel® Rapid Storage Technology offers several options for RAID (Redundant Array of Independent Disks) to meet the needs of the end user. AHCI support provides higher performance and alleviates disk bottlenecks by taking advantage of the independent DMA engines that each SATA port offers in the chipset.  RAID Level 0 – Non-redundant striping of drive volumes with performance scaling of up to 6 drives, enabling higher throughput for data intensive applications such as video editing.  Data security is offered through RAID Level 1, which performs mirroring.

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 RAID Level 10 provides high levels of storage performance with data protection, combining the fault- tolerance of RAID Level 1 with the performance of RAID Level 0. By striping RAID Level 1 segments, high I/O rates can be achieved on systems that require both performance and fault-tolerance. RAID Level 10 requires 4 hard drives, and provides the capacity of two drives.  RAID Level 5 provides highly efficient storage while maintaining fault-tolerance on 3 or more drives. By striping parity, and rotating it across all disks, fault tolerance of any single drive is achieved while only consuming 1 drive worth of capacity. That is, a 3 drive RAID 5 has the capacity of 2 drives, or a 4 drive RAID 5 has the capacity of 3 drives. RAID 5 has high read transaction rates, with a medium write rate. RAID 5 is well suited for applications that require high amounts of storage while maintaining fault tolerance. Note: RAID configurations cannot span across the two embedded AHCI SATA controllers. By using Intel® RSTe, there is no loss of PCI resources (request/grant pair) or add-in card slot. Intel® RSTe functionality requires the following:  The SW-RAID option must be enable in <F2> BIOS Setup  Intel® RSTe option must be selected in <F2> BIOS Setup  Intel® RSTe drivers must be loaded for the installed operating system  At least two SATA drives needed to support RAID levels 0 or 1  At least three SATA drives needed to support RAID level 5  At least four SATA drives needed to support RAID level 10 With Intel ® RSTe SW-RAID enabled, the following features are made available:  A boot-time, pre-operating system environment, text mode user interface that allows the user to manage the RAID configuration on the system. Its feature set is kept simple to keep size to a minimum, but allows the user to create and delete RAID volumes and select recovery options when problems occur. The user interface can be accessed by pressing the <CTRL-I> keys during system POST.  Provides boot support when using a RAID volume as a boot disk. It does this by providing Int13 services when a RAID volume needs to be accessed by MS-DOS applications (such as NTLDR) and by exporting the RAID volumes to the System BIOS for selection in the boot order  At each boot up, provides the user with a status of the RAID volumes 6.2.2 Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 Features of ESRT2 include the following:  Based on LSI* MegaRAID Software Stack  Software RAID with system providing memory and CPU utilization  RAID Level 0 - Non-redundant striping of drive volumes with performance scaling up to 6 drives, enabling higher throughput for data intensive applications such as video editing.  Data security is offered through RAID Level 1, which performs mirroring.  RAID Level 10 provides high levels of storage performance with data protection, combining the fault- tolerance of RAID Level 1 with the performance of RAID Level 0. By striping RAID Level 1 segments, high I/O rates can be achieved on systems that require both performance and fault-tolerance. RAID Level 10 requires 4 hard drives, and provides the capacity of two drives  Optional support for RAID Level 5

Figure 48. SATA RAID 5 Upgrade Key Note: RAID configurations cannot span across the two embedded AHCI SATA controllers.

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6.3 Intel® Integrated RAID Module Support

Figure 49. Intel® Integrated RAID Module connector (labeled “SAS Module”) on the server board.

6.3.1 Intel® RAID Maintenance Free Backup Unit (RMFBU) Support

The 1U system has support for one or two Intel® RAID Maintenance Free Backup Units (RMFBU). Figure 50. Support for single Intel® RAID Maintenance Free Backup Unit (Standard Option)

Support for two RMFBUs will require the use of an optional bracket capable of supporting stacked RMFBUs. Figure 51. Support for dual Intel® RAID Maintenance Free Backup Units (Optional Accessory)

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1. Front Control Panel and I/O Panel Overview

support 8x2.5” drives, the I/O Panel can be replaced with a SATA optical drive.

7.1 I/O Panel Features

Figure 52. Front I/O Panel Features 2x5 connector on the server board labeled “FP_USB”. Intel® Server Board S2600WT cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel.

7.2 Control Panel Features

for each front control panel feature. Figure 53. Front Control Panel Options Identify” command which will cause the LED to blink for 15 seconds. accessible with the use of a small tipped tool like a pin or paper clip. faceplate where it is only accessible with the use of a small tipped tool like a pin or paper clip.

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Table 32. System Status LED State Definitions Not ready • System is powered off (AC and/or DC).

• System is in EuP Lot6 Off Mode.
• System is in S5 Soft-Off State. Green Solid on Ok Indicates that the System is running (in S0 State) and its status is ‘Healthy’. The system is not exhibiting any errors. AC power is present and BMC has booted and manageability functionality is up and running. After a BMC reset, and in conjuction with the Chassis ID solid ON, the BMC is booting Linux*. Control has been passed from BMC uBoot to BMC Linux* itself. It will be in this state for ~10-~20 seconds Green ~1 Hz blink Degraded - system is operating in a degraded state although still functional, or system is operating in a redundant state but with an impending failure warning System degraded:
• Redundancy loss such as power-supply or fan. Applies only if the associated platform sub-system has redundancy capabilities.
• Fan warning or failure when the number of fully operational fans is less than minimum number needed to cool the system.
• Non-critical threshold crossed – Temperature (including HSBP temp), voltage, input power to power supply, output current for main power rail from power supply and Processor Thermal Control (Therm Ctrl) sensors.
• Power supply predictive failure occurred while redundant power supply configuration was present.
• Unable to use all of the installed memory (more than 1 DIMM installed).
• Correctable Errors over a threshold and migrating to a spare DIMM (memory sparing). This indicates that the system no longer has spared DIMMs (a redundancy lost condition). Corresponding DIMM LED lit.
• In mirrored memory mode, when memory mirroring takes place and system loses memory redundancy.
• In mirrored memory mode, and threshold for correctable errors has been crossed
• Battery failure.
• BMC executing in uBoot. (Indicated by Chassis ID blinking at 3Hz). System in degraded state (no manageability). BMC uBoot is running but has not transferred control to BMC Linux*. Server will be in this state 6-8 seconds after BMC reset while it pulls the Linux* image into flash.
• BMC Watchdog has reset the BMC.
• Power Unit sensor offset for configuration error is asserted.
• HDD HSC is off-line or degraded.

Intel® R1000WT Server System TPS November 2016 75 Color State Criticality Description Amber ~1 Hz blink Non-critical - System is operating in a degraded state with an impending failure warning, although still functioning Non-fatal alarm – system is likely to fail:

• Critical threshold crossed – Voltage, temperature (including HSBP temp), input power to power supply, output current for main power rail from power supply and PROCHOT (Therm Ctrl) sensors.
• VRD Hot asserted.
• Minimum number of fans to cool the system not present or failed
• Hard drive fault
• Power Unit Redundancy sensor – Insufficient resources offset (indicates not enough power supplies present)
• In memory non-sparing and non-mirroring mode, if the threshold of correctable errors is crossed within the window
• In mirrored memory mode, and a correctable error takes place after memory has already lost redundancy Amber Solid on Critical, non- recoverable – System is halted Fatal alarm – system has failed or shutdown:
• CPU CATERR signal asserted
• MSID mismatch detected (CATERR also asserts for this case).
• CPU 1 is missing
• CPU Thermal Trip
• No power good – power fault
• DIMM failure when there is only 1 DIMM present and hence no good memory present.
• Runtime memory uncorrectable error in non-redundant mode.
• DIMM Thermal Trip or equivalent
• SSB Thermal Trip or equivalent
• CPU ERR2 signal asserted
• BMC/Video memory test failed. (Chassis ID shows blue/solid-on for this condition)
• Both uBoot BMC FW images are bad. (Chassis ID shows blue/solid-on for this condition)
• 240VA fault
• Fatal Error in processor initialization: o Processor family not identical o Processor model not identical o Processor core/thread counts not identical o Processor cache size not identical o Unable to synchronize processor frequency o Unable to synchronize QPI link frequency
• Uncorrectable memory error in a non-redundant mode

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capable of supporting different indicator states as defined in the following table. Table 33. Power/Sleep LED Functional States Power-off Non-ACPI Off System power is off, and the BIOS has not initialized the chipset. S0 ACPI Steady on System and the operating system are up and running. storage controllers. The server board also provides a header giving access to this LED for add-in controllers.

1. Intel® Local Control Panel

control buttons and LCD display to provide system accessibility and monitoring. Figure 54. Intel Local Control Panel Option Intel® Server Board S2600WT cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel. The LCD (Local Control Display) is a one line character display that resides on the front panel of the chassis. Technical Product Specification (Intel document order number G83726-001).

78 November 2016

The system includes two riser card slots on the server board. Available riser cards can be used in either slot. architecture supporting them. a 1U system, only Riser Slot #1 and Riser Slot #2 can be used. Riser Slot #3 is for 2U system use only. following tables provide the PCIe* bus routing for all supported risers cards. Note: Riser Slot #2 can only be used in dual processor configurations. Table 34. Riser Slot #1 – Riser Card Options Table 35. Riser Slot #2 – Riser Card Options a bracket assembly which is inserted into a riser card slot on the server board.

80 November 2016

1. Intel® I/O Module Support

Figure 57. Intel® I/O Module Placement Table 36. Supported Intel® I/O Modules

1. Basic and Advanced Server Management Features

optionally installed Remote Management Module 4 Lite (RMM4 Lite) key. Table 37. Intel® Remote Management Module 4 (RMM4) Options lite is successful, then the BMC activates the Advanced features. The following table identifies both Basic and Advanced server management features. Table 38. Basic and Advanced Server Management Features Overview

82 November 2016

On the server board the Intel® RMM4 Lite key is installed at the following location. Figure 58. Intel® RMM4 Lite Activation Key Installation

11.1.1 Dedicated Management Port

without the RMM4 Lite key installed.

11.1.2 Embedded Web Server

128-bit SSL is supported. User authentication is based on user id and password.

Intel® R1000WT Server System TPS November 2016 83 The GUI presented by the embedded web server authenticates the user before allowing a web session to be initiated. It presents all functions to all users but grays-out those functions that the user does not have privilege to execute. For example, if a user does not have privilege to power control, then the item shall be displayed in grey-out font in that user’s UI display. The web GUI also provides a launch point for some of the advanced features, such as KVM and media redirection. These features are grayed out in the GUI unless the system has been updated to support these advanced features. The embedded web server only displays US English or Chinese language output. Additional features supported by the web GUI includes:  Presents all the Basic features to the users  Power on/off/reset the server and view current power state  Displays BIOS, BMC, ME and SDR version information  Display overall system health.  Configuration of various IPMI over LAN parameters for both IPV4 and IPV6  Configuration of alerting (SNMP and SMTP)  Display system asset information for the product, board, and chassis.  Display of BMC-owned sensors (name, status, current reading, enabled thresholds), including color- code status of sensors.  Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan and Power supply related)  Automatic refresh of sensor data with a configurable refresh rate  On-line help  Display/clear SEL (display is in easily understandable human readable format)  Supports major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*)  The GUI session automatically times-out after a user-configurable inactivity period. By default, this inactivity period is 30 minutes.  Embedded Platform Debug feature - Allow the user to initiate a “debug dump” to a file that can be sent to Intel for debug purposes.  Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local front panel. The displayed LEDs match the current state of the local panel LEDs. The displayed buttons (for example, power button) can be used in the same manner as the local buttons.  Display of ME sensor data. Only sensors that have associated SDRs loaded will be displayed.  Ability to save the SEL to a file  Ability to force HTTPS connectivity for greater security. This is provided through a configuration option in the UI.  Display of processor and memory information as is available over IPMI over LAN.  Ability to get and set Node Manager (NM) power policies  Display of power consumed by the server  Ability to view and configure VLAN settings  Warn user the reconfiguration of IP address will cause disconnect.

Intel® R1000WT Server System TPS

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 Capability to block logins for a period of time after several consecutive failed login attempts. The lock-out period and the number of failed logins that initiates the lock-out period are configurable by the user.  Server Power Control – Ability to force into Setup on a reset  System POST results – The web server provides the system’s Power-On Self Test (POST) sequence for the previous two boot cycles, including timestamps. The timestamps may be viewed in relative to the start of POST or the previous POST code.  Customizable ports – The web server provides the ability to customize the port numbers used for SMASH, http, https, KVM, secure KVM, remote media, and secure remote media. For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web Console Users Guide.

11.1.3 Advanced Management Feature Support (RMM4 Lite)

The integrated baseboard management controller has support for advanced management features which are enabled when an optional Intel® Remote Management Module 4 Lite (RMM4 Lite) is installed. The Intel RMM4 add-on offers convenient, remote KVM access and control through LAN and internet. It captures, digitizes, and compresses video and transmits it with keyboard and mouse signals to and from a remote computer. Remote access and control software runs in the integrated baseboard management controller, utilizing expanded capabilities enabled by the Intel RMM4 hardware. Key Features of the RMM4 add-on are:  KVM redirection from either the dedicated management NIC or the server board NICs used for management traffic; upto to two KVM sessions  Media Redirection – The media redirection feature is intended to allow system administrators or users to mount a remote IDE or USB CDROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote device appears just like a local device to the server allowing system administrators or users to install software (including operating systems), copy files, update BIOS, or boot the server from this device.  KVM – Automatically senses video resolution for best possible screen capture, high performance mouse tracking and synchronization. It allows remote viewing and configuration in pre-boot POST and BIOS setup.

11.1.3.1 Keyboard, Video, Mouse (KVM) Redirection

The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature is available remotely from the embedded web server as a Java applet. This feature is only enabled when the Intel ® RMM4 lite is present. The client system must have a Java Runtime Environment (JRE) version 6.0 or later to run the KVM or media redirection applets. The BMC supports an embedded KVM application (Remote Console) that can be launched from the embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard redirection are supported. It is also possible to use the KVM-redirection (KVM-r) session concurrently with media-redirection (media-r). This feature allows a user to interactively use the keyboard, video, and mouse (KVM) functions of the remote server as if the user were physically at the managed server. KVM redirection console supports the following keyboard layouts: English, Dutch, French, German, Italian, Russian, and Spanish.

Intel® R1000WT Server System TPS November 2016 85 KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an entire keyboard that is connected to the remote system. The “soft keyboard” functionality supports the following layouts: English, Dutch, French, German, Italian, Russian, and Spanish. The KVM-redirection feature automatically senses video resolution for best possible screen capture and provides high-performance mouse tracking and synchronization. It allows remote viewing and configuration in pre-boot POST and BIOS setup, once BIOS has initialized video. Other attributes of this feature include:  Encryption of the redirected screen, keyboard, and mouse  Compression of the redirected screen.  Ability to select a mouse configuration based on the OS type.  Supports user definable keyboard macros. KVM redirection feature supports the following resolutions and refresh rates:  640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz  800x600 at 60Hz, 72Hz, 75Hz, 85Hz  1024x768 at 60Hx, 72Hz, 75Hz, 85Hz  1280x960 at 60Hz  1280x1024 at 60Hz  1600x1200 at 60Hz  1920x1080 (1080p),  1920x1200 (WUXGA)  1650x1080 (WSXGA+)

11.1.3.2 Remote Console

The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To use the Remote Console window of your managed host system, the browser must include a Java* Runtime Environment plug-in. If the browser has no Java support, such as with a small handheld device, the user can maintain the remote host system using the administration forms displayed by the browser. The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The protocol that is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses ports #7578 for KVM, #5120 for CDROM media redirection, and #5123 for Floppy/USB media redirection. When encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CDROM media redirection, and #5127 for Floppy/USB media redirection. The local network environment must permit these connections to be made, that is, the firewall and, in case of a private internal network, the NAT (Network Address Translation) settings have to be configured accordingly.

11.1.3.3 Performance

The remote display accurately represents the local display. The feature adapts to changes to the video resolution of the local display and continues to work smoothly when the system transitions from graphics to text or vice-versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of the network.

Intel® R1000WT Server System TPS

86 November 2016

Enabling KVM and/or media encryption will degrade performance. Enabling video compression provides the fastest response while disabling compression provides better video quality. For the best possible KVM performance, a 2Mb/sec link or higher is recommended. The redirection of KVM over IP is performed in parallel with the local KVM without affecting the local KVM operation.

11.1.3.4 Security

The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual algorithm that is used is negotiated with the client based on the client’s capabilities.

11.1.3.5 Availability

The remote KVM session is available even when the server is powered-off (in stand-by mode). No re-start of the remote KVM session shall be required during a server reset or power on/off. A BMC reset (for example, due to an BMC Watchdog initiated reset or BMC reset after BMC FW update) will require the session to be re- established. KVM sessions persist across system reset, but not across an AC power loss.

11.1.3.6 Usage

As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is able interact with BIOS setup, change and save settings as well as enter and interact with option ROM configuration screens. At least two concurrent remote KVM sessions are supported. It is possible for at least two different users to connect to same server and start remote KVM sessions.

11.1.3.7 Force-enter BIOS Setup

KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter F2 setup while booting which is often missed by the time the remote console redirects the video.

11.1.3.8 Media Redirection

The embedded web server provides a Java applet to enable remote media redirection. This may be used in conjunction with the remote KVM feature, or as a standalone applet. The media redirection feature is intended to allow system administrators or users to mount a remote IDE or USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote device appears just like a local device to the server, allowing system administrators or users to install software (including operating systems), copy files, update BIOS, and so on, or boot the server from this device. The following capabilities are supported:  The operation of remotely mounted devices is independent of the local devices on the server. Both remote and local devices are useable in parallel.  Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.  It is possible to boot all supported operating systems from the remotely mounted device and to boot from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the Tested/supported Operating System List for more information.

Intel® R1000WT Server System TPS November 2016 87  Media redirection supports redirection for both a virtual CD device and a virtual Floppy/USB device concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB device may be a local Floppy drive, a local USB device, or a disk image file.  The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual algorithm that is used is negotiated with the client based on the client’s capabilities.  A remote media session is maintained even when the server is powered-off (in standby mode). No restart of the remote media session is required during a server reset or power on/off. An BMC reset (for example, due to an BMC reset after BMC FW update) will require the session to be re-established  The mounted device is visible to (and useable by) managed system’s OS and BIOS in both pre-boot and post-boot states.  The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot order to boot from this remote device.  It is possible to install an operating system on a bare metal server (no OS present) using the remotely mounted device. This may also require the use of KVM-r to configure the OS during install. USB storage devices will appear as floppy disks over media redirection. This allows for the installation of device drivers during OS installation. If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE and virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted device type to the system BIOS.

11.1.3.8.1 Availability

The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist across system reset but not across an AC power loss or BMC reset.

11.1.3.8.2 Network Port Usage

The KVM and media redirection features use the following ports:  5120 – CD Redirection  5123 – FD Redirection  5124 – CD Redirection (Secure)  5127 – FD Redirection (Secure)  7578 – Video Redirection  7582 – Video Redirection (Secure) For additional information, reference the Intel ® Remote Management Module 4 and Integrated BMC Web Console Users Guide.

Intel® Storage System R1000WT Family TPS

88 November 2016

Appendix A: Integration and Usage Tips This section provides a list of useful information that is unique to the Intel® Server System R1000WT Product Family and should be kept in mind while configuring your server system.  When adding or removing components or peripherals, power cords must be disconnected from the server. With power applied to the server, standby voltages are still present even though the server board is powered off.  This server board supports the Intel® Xeon® Processor E5-2600 v3 and v4 product family with a Thermal Design Power (TDP) of up to and including 145 Watts. Previous generations of the Intel® Xeon® processors are not supported. Server systems using this server board may or may not meet the TDP design limits of the server board. Validate the TDP limits of the server system before selecting a processor.  Processors must be installed in order. CPU 1 must be populated for the server board to operate  The riser card slots are specifically designed to support riser cards only. Attempting to install a PCIe* add-in card directly into a riser card slot on the server board may damage the server board, the add-in card, or both.  This server board only supports DDR4 ECC RDIMM – Registered (Buffered) DIMMS and DDR4 ECC LRDIMM – Load Reduced DIMMs  For the best performance, the number of DDR4 DIMMs installed should be balanced across both processor sockets and memory channels  On the back edge of the server board are eight diagnostic LEDs that display a sequence of amber POST codes during the boot process. If the server board hangs during POST, the LEDs display the last POST event run before the hang.  The System Status LED will be set to a steady Amber color for all Fatal Errors that are detected during processor initialization. A steady Amber System Status LED indicates that an unrecoverable system failure condition has occurred  RAID partitions created using either embedded software RAID option, RSTe or ESRT2, cannot span across the two embedded SATA controllers. Only drives attached to a common SATA controller can be included in a RAID partition  The FRUSDR utility must be run as part of the initial platform integration process before it is deployed into a live operating environment. Once the initial FRU and SDR data is loaded on to the system, all subsequent system configuration changes will automatically update SDR data using the BMC auto configuration feature, without having to run the FRUSDR utility again. However, to ensure the latest sensor data is installed, the SDR data should be updated to the latest available as part of a planned system software update.  Make sure the latest system software is loaded on the server. This includes System BIOS, BMC Firmware, ME Firmware and FRUSDR. The latest system software can be downloaded from http://downloadcenter.intel.com

Diagnostic LEDs on the back edge of the server board. run prior to the error occurring, helping to isolate the possible cause of the hang condition. LEDs #4, #5, #6, and #7. The lower nibble bits are represented by Green Diagnostics LEDs #0, #1, #2, and #3. Figure 59. POST Diagnostic LED Location Table 39. POST Progress Code LED Example Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh.

Intel® R1000WT Server System TPS

90 November 2016

Early POST Memory Initialization MRC Diagnostic Codes Memory Initialization at the beginning of POST includes multiple functions, including: discovery, channel training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other hardware settings, and initialization of applicable RAS configurations. The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in the MRC operational path at each step. Table 40. MRC Progress Codes

Description

1 = LED On, 0 = LED Off Upper Nibble Lower Nibble MSB LSB 8h 4h 2h 1h 8h 4h 2h 1h MRC Progress Codes B0h 1 0 1 1 0 0 0 0 Detect DIMM population B1h 1 0 1 1 0 0 0 1 Set DDR3 frequency B2h 1 0 1 1 0 0 1 0 Gather remaining SPD data B3h 1 0 1 1 0 0 1 1 Program registers on the memory controller level B4h 1 0 1 1 0 1 0 0 Evaluate RAS modes and save rank information B5h 1 0 1 1 0 1 0 1 Program registers on the channel level B6h 1 0 1 1 0 1 1 0 Perform the JEDEC defined initialization sequence B7h 1 0 1 1 0 1 1 1 Train DDR3 ranks B8h 1 0 1 1 1 0 0 0 Initialize CLTT/OLTT B9h 1 0 1 1 1 0 0 1 Hardware memory test and init BAh 1 0 1 1 1 0 1 0 Execute software memory init BBh 1 0 1 1 1 0 1 1 Program memory map and interleaving BCh 1 0 1 1 1 1 0 0 Program RAS configuration BFh 1 0 1 1 1 1 1 1 MRC is done Should a major memory initialization error occur, preventing the system from booting with data integrity, a beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system halt command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and they do NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to the Diagnostic LEDs. NOTE: Fatal MRC errors will display POST error codes that may be the same as BIOS POST progress codes displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS POST progress codes by the accompanying memory failure beep code of 3 long beeps as identified in Table 39.

Intel® R1000WT Server System TPS November 2016 91 Table 41. MRC Fatal Error Codes 1 = LED On, 0 = LED Off Upper Nibble Lower Nibble MSB LSB 8h 4h 2h 1h 8h 4h 2h 1h MRC Fatal Error Codes E8h 1 1 1 0 1 0 0 0 No usable memory error 01h = No memory was detected from SPD read, or invalid config that causes no operable memory. 02h = Memory DIMMs on all channels of all sockets are disabled due to hardware memtest error. 3h = No memory installed. All channels are disabled. E9h 1 1 1 0 1 0 0 1 Memory is locked by Intel Trusted Execution Technology and is inaccessible EAh 1 1 1 0 1 0 1 0 DDR3 channel training error 01h = Error on read DQ/DQS (Data/Data Strobe) init 02h = Error on Receive Enable 3h = Error on Write Leveling 04h = Error on write DQ/DQS (Data/Data Strobe EBh 1 1 1 0 1 0 1 1 Memory test failure 01h = Software memtest failure. 02h = Hardware memtest failed. 03h = Hardware Memtest failure in Lockstep Channel mode requiring a channel to be disabled. This is a fatal error which requires a reset and calling MRC with a different RAS mode to retry. EDh 1 1 1 0 1 1 0 1 DIMM configuration population error 01h = Different DIMM types (UDIMM, RDIMM, LRDIMM) are detected installed in the system. 02h = Violation of DIMM population rules. 03h = The 3rd DIMM slot cannot be populated when QR DIMMs are installed. 04h = UDIMMs are not supported in the 3rd DIMM slot. 05h = Unsupported DIMM Voltage. EFh 1 1 1 0 1 1 1 1 Indicates a CLTT table structure error

92 November 2016

System Management applications, including Remote and Out of Band (OOB) management. initialization of processors and memory, and they are handed by a Diagnostic LED display with a system halt. will displays the error code on the Error Manager screen.  Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error found. Pause option setting in the BIOS setup does not have any effect with this class of error. unless the error is resolved. The user needs to replace the faulty part and restart the system. Table 42. POST Error Messages and Handling

0012 System RTC date/time not set Major

0048 Password check failed Major

0140 PCI component encountered a PERR error Major

0141 PCI resource conflict Major

0146 PCI out of resources error Major

0191 Processor core/thread count mismatch detected Fatal

0192 Processor cache size mismatch detected Fatal

0194 Processor family mismatch detected Fatal

Intel® R1000WT Server System TPS November 2016 93 Error Code Error Message Response

0195 Processor Intel(R) QPI link frequencies unable to synchronize Fatal

0196 Processor model mismatch detected Fatal

0197 Processor frequencies unable to synchronize Fatal

5220 BIOS Settings reset to default settings Major

5221 Passwords cleared by jumper Major

5224 Password clear jumper is Set Major

8130 Processor 01 disabled Major

8131 Processor 02 disabled Major

8160 Processor 01 unable to apply microcode update Major

8161 Processor 02 unable to apply microcode update Major

8170 Processor 01 failed Self Test (BIST) Major

8171 Processor 02 failed Self Test (BIST) Major

8180 Processor 01 microcode update not found Minor

8181 Processor 02 microcode update not found Minor

8190 Watchdog timer failed on last boot Major

8198 OS boot watchdog timer failure Major

8300 Baseboard management controller failed self test Major

8305 Hot Swap Controller failure Major

83A0 Management Engine (ME) failed self test Major 83A1 Management Engine (ME) Failed to respond. Major 84F2 Baseboard management controller failed to respond Major 84F3 Baseboard management controller in update mode Major 84F4 Sensor data record empty Major 84FF System event log full Minor

8500 Memory component could not be configured in the selected RAS mode Major

8501 DIMM Population Error Major

8520 DIMM_A1 failed test/initialization Major

8521 DIMM_A2 failed test/initialization Major

8522 DIMM_A3 failed test/initialization Major

8523 DIMM_B1 failed test/initialization Major

8524 DIMM_B2 failed test/initialization Major

8525 DIMM_B3 failed test/initialization Major

8526 DIMM_C1 failed test/initialization Major

8527 DIMM_C2 failed test/initialization Major

8528 DIMM_C3 failed test/initialization Major

8529 DIMM_D1 failed test/initialization Major

852A DIMM_D2 failed test/initialization Major 852B DIMM_D3 failed test/initialization Major 852C DIMM_E1 failed test/initialization Major 852D DIMM_E2 failed test/initialization Major 852E DIMM_E3 failed test/initialization Major 852F DIMM_F1 failed test/initialization Major

8530 DIMM_F2 failed test/initialization Major

8531 DIMM_F3 failed test/initialization Major

8532 DIMM_G1 failed test/initialization Major

8533 DIMM_G2 failed test/initialization Major

Intel® R1000WT Server System TPS

94 November 2016

Error Code Error Message Response

8534 DIMM_G3 failed test/initialization Major

8535 DIMM_H1 failed test/initialization Major

8536 DIMM_H2 failed test/initialization Major

8537 DIMM_H3 failed test/initialization Major

8538 DIMM_J1 failed test/initialization Major

8539 DIMM_J2 failed test/initialization Major

853A DIMM_J3 failed test/initialization Major 853B DIMM_K1 failed test/initialization Major 853C DIMM_K2 failed test/initialization Major 853D DIMM_K3 failed test/initialization Major 853E DIMM_L1 failed test/initialization Major 853F (Go to 85C0) DIMM_L2 failed test/initialization Major

8540 DIMM_A1 disabled Major

8541 DIMM_A2 disabled Major

8542 DIMM_A3 disabled Major

8543 DIMM_B1 disabled Major

8544 DIMM_B2 disabled Major

8545 DIMM_B3 disabled Major

8546 DIMM_C1 disabled Major

8547 DIMM_C2 disabled Major

8548 DIMM_C3 disabled Major

8549 DIMM_D1 disabled Major

854A DIMM_D2 disabled Major 854B DIMM_D3 disabled Major 854C DIMM_E1 disabled Major 854D DIMM_E2 disabled Major 854E DIMM_E3 disabled Major 854F DIMM_F1 disabled Major

8550 DIMM_F2 disabled Major

8551 DIMM_F3 disabled Major

8552 DIMM_G1 disabled Major

8553 DIMM_G2 disabled Major

8554 DIMM_G3 disabled Major

8555 DIMM_H1 disabled Major

8556 DIMM_H2 disabled Major

8557 DIMM_H3 disabled Major

8558 DIMM_J1 disabled Major

8559 DIMM_J2 disabled Major

855A DIMM_J3 disabled Major 855B DIMM_K1 disabled Major 855C DIMM_K2 disabled Major 855D DIMM_K3 disabled Major 855E DIMM_L1 disabled Major

Intel® R1000WT Server System TPS November 2016 95 Error Code Error Message Response 855F (Go to 85D0) DIMM_L2 disabled Major

8560 DIMM_A1 encountered a Serial Presence Detection (SPD) failure Major

8561 DIMM_A2 encountered a Serial Presence Detection (SPD) failure Major

8562 DIMM_A3 encountered a Serial Presence Detection (SPD) failure Major

8563 DIMM_B1 encountered a Serial Presence Detection (SPD) failure Major

8564 DIMM_B2 encountered a Serial Presence Detection (SPD) failure Major

8565 DIMM_B3 encountered a Serial Presence Detection (SPD) failure Major

8566 DIMM_C1 encountered a Serial Presence Detection (SPD) failure Major

8567 DIMM_C2 encountered a Serial Presence Detection (SPD) failure Major

8568 DIMM_C3 encountered a Serial Presence Detection (SPD) failure Major

8569 DIMM_D1 encountered a Serial Presence Detection (SPD) failure Major

856A DIMM_D2 encountered a Serial Presence Detection (SPD) failure Major 856B DIMM_D3 encountered a Serial Presence Detection (SPD) failure Major 856C DIMM_E1 encountered a Serial Presence Detection (SPD) failure Major 856D DIMM_E2 encountered a Serial Presence Detection (SPD) failure Major 856E DIMM_E3 encountered a Serial Presence Detection (SPD) failure Major 856F DIMM_F1 encountered a Serial Presence Detection (SPD) failure Major

8570 DIMM_F2 encountered a Serial Presence Detection (SPD) failure Major

8571 DIMM_F3 encountered a Serial Presence Detection (SPD) failure Major

8572 DIMM_G1 encountered a Serial Presence Detection (SPD) failure Major

8573 DIMM_G2 encountered a Serial Presence Detection (SPD) failure Major

8574 DIMM_G3 encountered a Serial Presence Detection (SPD) failure Major

8575 DIMM_H1 encountered a Serial Presence Detection (SPD) failure Major

8576 DIMM_H2 encountered a Serial Presence Detection (SPD) failure Major

8577 DIMM_H3 encountered a Serial Presence Detection (SPD) failure Major

8578 DIMM_J1 encountered a Serial Presence Detection (SPD) failure Major

8579 DIMM_J2 encountered a Serial Presence Detection (SPD) failure Major

857A DIMM_J3 encountered a Serial Presence Detection (SPD) failure Major 857B DIMM_K1 encountered a Serial Presence Detection (SPD) failure Major 857C DIMM_K2 encountered a Serial Presence Detection (SPD) failure Major 857D DIMM_K3 encountered a Serial Presence Detection (SPD) failure Major 857E DIMM_L1 encountered a Serial Presence Detection (SPD) failure Major 857F (Go to 85E0) DIMM_L2 encountered a Serial Presence Detection (SPD) failure Major 85C0 DIMM_L3 failed test/initialization Major 85C1 DIMM_M1 failed test/initialization Major 85C2 DIMM_M2 failed test/initialization Major 85C3 DIMM_M3 failed test/initialization Major 85C4 DIMM_N1 failed test/initialization Major 85C5 DIMM_N2 failed test/initialization Major 85C6 DIMM_N3 failed test/initialization Major 85C7 DIMM_P1 failed test/initialization Major 85C8 DIMM_P2 failed test/initialization Major 85C9 DIMM_P3 failed test/initialization Major

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Error Code Error Message Response 85CA DIMM_R1 failed test/initialization Major 85CB DIMM_R2 failed test/initialization Major 85CC DIMM_R3 failed test/initialization Major 85CD DIMM_T1 failed test/initialization Major 85CE DIMM_T2 failed test/initialization Major 85CF DIMM_T3 failed test/initialization Major 85D0 DIMM_L3 disabled Major 85D1 DIMM_M1 disabled Major 85D2 DIMM_M2 disabled Major 85D3 DIMM_M3 disabled Major 85D4 DIMM_N1 disabled Major 85D5 DIMM_N2 disabled Major 85D6 DIMM_N3 disabled Major 85D7 DIMM_P1 disabled Major 85D8 DIMM_P2 disabled Major 85D9 DIMM_P3 disabled Major 85DA DIMM_R1 disabled Major 85DB DIMM_R2 disabled Major 85DC DIMM_R3 disabled Major 85DD DIMM_T1 disabled Major 85DE DIMM_T2 disabled Major 85DF DIMM_T3 disabled Major 85E0 DIMM_L3 encountered a Serial Presence Detection (SPD) failure Major 85E1 DIMM_M1 encountered a Serial Presence Detection (SPD) failure Major 85E2 DIMM_M2 encountered a Serial Presence Detection (SPD) failure Major 85E3 DIMM_M3 encountered a Serial Presence Detection (SPD) failure Major 85E4 DIMM_N1 encountered a Serial Presence Detection (SPD) failure Major 85E5 DIMM_N2 encountered a Serial Presence Detection (SPD) failure Major 85E6 DIMM_N3 encountered a Serial Presence Detection (SPD) failure Major 85E7 DIMM_P1 encountered a Serial Presence Detection (SPD) failure Major 85E8 DIMM_P2 encountered a Serial Presence Detection (SPD) failure Major 85E9 DIMM_P3 encountered a Serial Presence Detection (SPD) failure Major 85EA DIMM_R1 encountered a Serial Presence Detection (SPD) failure Major 85EB DIMM_R2 encountered a Serial Presence Detection (SPD) failure Major 85EC DIMM_R3 encountered a Serial Presence Detection (SPD) failure Major 85ED DIMM_T1 encountered a Serial Presence Detection (SPD) failure Major 85EE DIMM_T2 encountered a Serial Presence Detection (SPD) failure Major 85EF DIMM_T3 encountered a Serial Presence Detection (SPD) failure Major

8604 POST Reclaim of non-critical NVRAM variables Minor

8605 BIOS Settings are corrupted Major

8606 NVRAM variable space was corrupted and has been reinitialized Major

Recovery boot has been initiated. Note: The Primary BIOS image may be corrupted or the system may hang during POST. A BIOS update is required. Fatal 92A3 Serial port component was not detected Major 92A9 Serial port component encountered a resource conflict error Major

Table 43. POST Error Beep Codes

1 USB device action N/A Short beep sounded whenever USB device is

3 Memory error Multiple System halted because a fatal error related to the

CPU family/core/cache mismatch was detected. The following Beep Codes are sounded during BIOS Recovery. 2 Recovery started N/A Recovery boot has been initiated.

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each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously. Table 44. Integrated BMC Beep Codes CPU1 must be populated before CPU2. more other PSUs in the system.

Intel® R1000WT Server System TPS November 2016 99 Appendix D: System Configuration Table for Thermal Compatibility This section provides system configuration compatibility data based on various supported system operating thermal limits. Two tables are provided. The first table identifies supported system configurations while the system is in “normal” operating mode; all systems fans are present, on-line, and operational. The second table identifies supported system configurations while the system is in a “fan fail” mode; one system fan or system fan rotor, is no longer on-line or operational, fan redundancy is lost. The following notes communicate support criteria associated with specific configurations identified in the following tables. Each relevant note to a configuration is identified by reference number in the table. Listed notes that are not specified in the table will reflect support criteria for a similar 2U based system within the Intel® Server Board S2600WT product family, details of which can be found in the Intel® Server System R2000WT Technical Product Specification. Thermal Configuration Table Notes: 1. The 27°C configuration alone is limited to elevations of 900m or less. Altitudes higher than 900m need to be de-rated to ASHRAE Class 2 levels. 2. To support system fan redundancy, the system must be configured with two power supplies to maintain sufficient cooling. Concurrent system and power supply fan failures is not supported. 3. Processor throttling may occur which may impact system performance. CPU reliability is not impacted 4. In fan fail mode, Intel® I/O Modules AXX10GBTWLIOM and AXX2FDRIBIOM are only supported in the specified base system model configured with 120W processors and DRx4 memory. 5. Use of the designated PCIe* slot is limited to add-in cards that have air flow requirements of 100 LFM or less. See add-in card specs for air flow requirements. 6. For ASHRAE Class 3 and Class 4 support, the following power supply margining is required to meet thermal specifications: a) For dual power supply configurations, the power budget must fit within a single power supply rated load and be installed in a dual configuration, or b) For single power supply configurations, the power budget must be sized with 30% margin to single power supply rated load. 7. Intel® Xeon Phi™ or non-Intel GPGPU cards may have performance impact during ASHRAE Class 3 and Class 4 ambient air excursions 8. PCIe* SSD AIC SFF devices can only be supported in the top add-in card slot on Riser Slot #1 and Riser Slot #2. 9. The Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) can support a case temperature of up to 45°C with the system operating in normal mode and up to 55°C with the system operating in a fan fail mode. The case temperature of Intel® Smart RAID Battery (AXXRSBBUx) can support up to 45°C in both normal and fan fail mode. Excursions over these specs may result in a reliability impact. 10. The 2U system must be configured with Intel® accessory kits AWTCOPRODUCT and A2UL16RISER2 in order to support Intel® Xeon Phi™ or Non-Intel GPGPU add-in cards with passive cooling solutions.

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Thermal Configuration Table – System in “Normal” Operating Mode "●" = Full Support without limitation "4,5" (Cell with number) = Conditional support for configuration with limitations. See notes Section " " (Blank Cell) = Configuration Not supported Intel® Server System Base System Models: R1304WTxxxx R1208WTxxxx ASHRAE (See note 1) Classifications 27C A2 A3 A4 Max Ambient 27°C (1) 35° C 40° C 45° C PS (See note 6) 1100W AC ● ● ● ● 750W AC ● ● ● ● 750W DC ● ● ● ● EP Processors ( See Notes 3) EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3) ● ● ● ● EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3) ● ● ● ● EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3) ● ● ● ● EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3) ● ● ● ● EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3E5-2620 V3, E5-2609 V3, EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637 V3) ● ● 3 3 EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3) ● ● ● ● EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3) ● ● ● 3 EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3) ● ● ● 3 EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3) ● ● 3 3 EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3) ● ● ● ● EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3) ● ● ● ● Memory Type RDIMM-2Rx8,1Rx4, 1Rx8 ● ● ● ● RDIMM-DRx4 ● ● ● ● LRDIMM-QRx4 DDP ● ● ● ● Add-in Cards (See note 5) Riser #1 - Bottom Slot (1U riser and 2U riser) ● ● ● ● Riser #1 - Middle Slot (2U riser) Riser #1 - Top Slot (2U riser) Riser #2 - Bottom Slot (1U riser and 2U riser) ● ● ● ● Riser #2 - Middle Slot (2U riser) Riser #2 - Top Slot (2U riser) 3rd PCI Riser Riser #3 - Bottom Slot Riser #3 - Top Slot SAS and I/O Modules (See Note 4) Intel® Integrated RAID Modules (Mezzanine cards) ● ● ● ● AXX10GBTWLIOM - Dual 10GBASE-T IO Module ● ● ● ● AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module ● ● ● ● AXX1FDRIBIOM - Single Port FDR Infiniband IO Module ● ● ● ● AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module ● ● ● ● AXX4P1GBPWLIOM - Quad Port 1GbE IO Module ● ● ● ● AXX1P40FRTIOM - Single Port 40GbE IO Module ● ● ● ● AXX2P40FRTIOM - Dual Port 40GbE IO Module ● ● ● ● Battery Backup (See note 9) AXXRSBBUx (rated to 45C) ● ● ● AXXRMFBUx (rated to 55C) ● ● ● Cache Offload Module (rated to 55C) ● ● ● ●

Intel® R1000WT Server System TPS November 2016 101 Intel® Server System Base System Models: R1304WTxxxx R1208WTxxxx ASHRAE (See note 1) Classifications 27C A2 A3 A4 Max Ambient 27°C (1) 35° C 40° C 45° C Internal SSD Rated to 60C Rated to 70C Rear SSD Rated to 60C Rated to 70C PCIe* SFF SSD (DC P3700/P3500) 1600GB/2TB ● ● ● ● 800GB ● ● ● ● 600GB ● ● ● ● 400GB ● ● ● ● 200GB ● ● ● ● PCIe* SSD AIC FF (DC P3700/P3500) (See note 8) 1600GB/2TB ● ● ● ● 800GB ● ● ● ● 600GB ● ● ● ● 400GB ● ● ● ● 200GB ● ● ● ● Intel® Xeon Phi™ (See Note 7, 10 ) Active Cooling up to 300W Active Cooling up to 225W Intel® Xeon Phi™ w/Passive Cooling up to 225W Intel® Xeon Phi™ w/Passive Cooling up to 245W Intel® Xeon Phi™ w/Passive Cooling up to 300W

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Thermal Configuration Table – System in “Fan Fail” Operating Mode "●" = Full Support without limitation "4,5" (Cell with number) = Conditional support for configuration with limitations. See notes Section " " (Blank Cell) = Configuration Not supported Base System SKUs: R1304WTxxxx R1208WTxxxx ASHRAE (See note 1) Classifications 27C A2 A3 A4 Max Ambient 27°C (1) 35° C 40° C 45° C PS (See note 6) 1100W AC 2 2 750W AC 2 2 750W DC 2 2 EP Processors ( See Notes 3) EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3) ● ● EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3 ) ● ● EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3) ● ● EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3) ● ● EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E5-2620 V3, E5-2609 V3, E5-2603 V3) ● ● EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637 V3) 3 3 EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3) ● ● EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3) ● ● EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3) ● ● EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3) 3 3 EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3) ● ● EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3) ● ● Memory Type RDIMM-2Rx8,1Rx4 ● ● RDIMM-DRx4 ● ● LRDIMM-QRx4 DDP ● ● Add-in Cards (See note 5) Riser #1 - Bottom Slot (1U riser and 2U riser) ● ● Riser #1 - Middle Slot (2U riser) Riser #1 - Top Slot (2U riser) Riser #2 - Bottom Slot (1U riser and 2U riser) ● ● Riser #2 - Middle Slot (2U riser) Riser #2 - Top Slot (2U riser) 3rd PCI Riser Riser #3 - Bottom Slot Riser #3 - Top Slot SAS and I/O Modules (See Note 4) Intel® Integrated RAID Modules (Mezzanine cards) ● ● AXX10GBTWLIOM - Dual 10GBASE-T IO Module ● ● AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module ● ● AXX1FDRIBIOM - Single Port FDR Infiniband IO Module ● ● AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module ● ● AXX4P1GBPWLIOM - Quad Port 1GbE IO Module ● ● AXX1P40FRTIOM - Single Port 40GbE IO Module ● ● AXX2P40FRTIOM - Dual Port 40GbE IO Module ● ● Battery Backup (See note 9) AXXRSBBUx (rated to 45C) ● ● AXXRMFBUx (rated to 55C) ● ● Cache Offload Module (rated to 55C) ● ●

Intel® R1000WT Server System TPS November 2016 103 Base System SKUs: R1304WTxxxx R1208WTxxxx ASHRAE (See note 1) Classifications 27C A2 A3 A4 Max Ambient 27°C (1) 35° C 40° C 45° C Internal SSD Rated to 60C Rated to 70C Rear SSD Rated to 60C Rated to 70C PCIe* SFF SSD (DC P3700/P3500) 1600GB/2TB ● ● 800GB ● ● 600GB ● ● 400GB ● ● 200GB ● ● PCIe* SSD AIC FF (DC P3700/P3500) (See note 8) 1600GB/2TB ● ● 800GB ● ● 600GB ● ● 400GB ● ● 200GB ● ● Intel® Xeon Phi™ (See Note 7, 10 ) Active Cooling up to 300W Active Cooling up to 225W Intel® Xeon Phi™ w/Passive Cooling up to 225W Intel® Xeon Phi™ w/Passive Cooling up to 245W Intel® Xeon Phi™ w/Passive Cooling up to 300W

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Appendix E: System Cable Routing Diagrams

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Appendix F: Statement of Volatility The tables in this section are used to identify the volatile and non-volatile memory components for system boards used within the Intel® Server System R1000WT product family. The tables provide the following data for each identified component. Component Type Three types of memory components are used on the server board assembly. These include:  Non-volatile: Non-volatile memory is persistent, and is not cleared when power is removed from the system. Non-Volatile memory must be erased to clear data. The exact method of clearing these areas varies by the specific component. Some areas are required for normal operation of the server, and clearing these areas may render the server board inoperable.  Volatile: Volatile memory is cleared automatically when power is removed from the system.  Battery powered RAM: Battery powered RAM is similar to volatile memory, but is powered by a battery on the server board. Data in Battery powered Ram is persistent until the battery is removed from the server board. Size The size of each component includes sizes in bits, Kbits, bytes, kilobytes (KB) or megabytes (MB). Board Location The physical location of each component is specified in the Board Location column. The board location information corresponds to information on the server board silkscreen. User Data The flash components on the server boards do not store user data from the operating system. No operating system level data is retained in any listed components after AC power is removed. The persistence of information written to each component is determined by its type as described in the table. Each component stores data specific to its function. Some components may contain passwords that provide access to that device’s configuration or functionality. These passwords are specific to the device and are unique and unrelated to operating system passwords. The specific components that may contain password data are:  BIOS: The server board BIOS provides the capability to prevent unauthorized users from configuring BIOS settings when a BIOS password is set. This password is stored in BIOS flash, and is only used to set BIOS configuration access restrictions.  BMC: The server boards support an Intelligent Platform Management Interface (IPMI) 2.0 conformant baseboard management controller (BMC). The BMC provides health monitoring, alerting and remote power control capabilities for the Intel® server board. The BMC does not have access to operating system level data. The BMC supports the capability for remote software to connect over the network and perform health monitoring and power control. This access can be configured to require authentication by a password. If configured, the BMC will maintain user passwords to control this access. These passwords are stored in the BMC flash.

Intel® R1000WT Server System TPS November 2016 107 Intel® Server Board S2600WT (iPN - H21573-xxx and G92187-xxx) Component Type Size Board Location User Data Name Non-Volatile 128Mbit U4F1 No(BIOS) BIOS Flash Non-Volatile 128Mbit U2D2 No(FW) BMC Flash Non-Volatile 16Mbit U5L2 No 10 GB NIC EEPROM (S2600WTTR) Non-Volatile 256K bit U5L3 No 1 GB NIC EEPROM (S2600WT2R) Non-Volatile N/A U1E1 No CPLD Non-Volatile N/A U1C1 No IPLD Volatile 128 MB U1D2 No BMC SDRAM 1U 1 Slot PCIe* Riser Card (iPN – H39531-xxx) Component Type Size Board Location User Data Name N/A N/A None No N/A Front Panel Board (iPN – H29366-xxx) Component Type Size Board Location User Data Name Non-Volatile 256x8 U1A1 Yes PSOC / Microcontroller 1U 4 x 3.5” Hot Swap Back Plane option (iPN – G97162-xxx) Component Type Size Board Location User Data Name Non-Volatile 16384x8 EU7L1 Yes PSOC / Microcontroller / FRU Non-Volatile 1024x8 U1 No SAS Re-Driver Settings 1U 8 x 2.5” SAS Hot Swap Back Plane option (iPN – G97152-xxx) Component Type Size Board Location User Data Name Non-Volatile 16384x8 U8A4 Yes PSOC / Microcontroller / FRU Non-Volatile 1024x8 U25 No SAS Re-Driver Settings

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1U 8 x 2.5” Combo PCIe* SFF (NVMe) / SAS Hot Swap Back Plane Accessory Kit (iPC - A1U44X25NVMEDK) 1U 8 x 2.5” Combo PCIe* SFF (NVMe) / SAS Hot Swap Back Plane (iPN – G97154-xxx) Component Type Size Board Location User Data Name Non-Volatile 16384x8 U8A4 Yes PSOC / Microcontroller / FRU Non-Volatile 1024x8 U25 No SAS Re-Driver Settings PCIe* SFF SSD Add-in Re-driver Card (iPN – G97168-xxx) Component Type Size Board Location User Data Name Non-Volatile 1024x8 U24 No PCIe Re-Timer Settings Non-Volatile 256x8 U3 Yes FRU Intel® Remote Management Module Lite Accessory Option (iPC – AXXRMM4LITE) Component Type Size Board Location User Data Name Non-Volatile 1Mbit U2B1 No RMM Programming 750W power supply module (iPC - FXX750PCRPS & AXX750DCCRPS) Component Type Size Location User Data Name Description Non-Volatile 64K N/A YES 750 power supply IC MCU FLASH 64K*8+1K*8 TQFP-44P SMD / Manufacture Microchip

functions that make them different. Figure 60. Intel® Storage Server R1000WT

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Table 45. Intel® Storage System R1000WT Feature List  Maximum supported Thermal Design Power (TDP) of up to 145 W. features and add-in PCIe cards.

Intel® R1000WT Server System TPS November 2016 111 Feature Description Riser Card Support Support for two riser cards:  Riser #1 – PCIe* Gen3 x24 – 1 PCIe slot  Riser #2 – PCIe* Gen3 x24 – 1 PCIe slot With two riser cards installed, up to 2 possible add-in cards can be supported:  2 Full Height / Half Length add-in cards via Risers #1 and #2 NOTE: Riser card #2 is pre-populated with PCIe* NVMe interface add-in card Video  Integrated 2D Video Controller  16 MB DDR3 Memory On-board storage controllers and options  10 x SATA 6Gbps ports (6Gb/s, 3 Gb/s and 1.5Gb/s transfer rates are supported) o Two single port SATA connectors capable of supporting up to 6 Gb/sec o Two 4-port mini-SAS HD (SFF-8643) connectors capable of supporting up to 6 Gb/sec /SATA  One eUSB 2x5 pin connector to support 2mm low-profile eUSB solid state devices  Optional SAS IOC/ROC support via on-board Intel® Integrated RAID module connector  Embedded Software SATA RAID o Intel® Rapid Storage RAID Technology (RSTe) 4.1 o Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41 with optional RAID 5 key support Security Intel® Trusted Platform Module (TPM) – AXXTPME5, AXXTPME6, AXXTPME7 (Accessory Option) Server Management  Integrated Baseboard Management Controller, IPMI 2.0 compliant  Support for Intel® Server Management Software  On-board RJ45 management port  Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option) Power Supply  The server system can support 1 or 2 power supply modules, providing support for the following power configurations: 1+0 (Single PS), or 1+1 Redundant Power and 2+0 Combined Power (Dual PS)  (1) AC 750W Platinum (Included) Hot Swap Drive Bay R1208WTTA04NVMR (8) – 2.5” Hot-swap drive bays

• Includes (1) Combo (NVMe/SAS) backplane
• Includes (4) 2.5” hot swap drive trays (Green Tab) + drive blanks + SATA/SAS cable
• Includes (4) 2.5” hot swap NVMe drive assemblies (Blue Tab) o Includes (4) 2TB Intel® SSD DC P3700 (SFF NVMe) Drives o Includes (1) PCIe* SSD Interface Card (installed in Riser #2) + cables Hot Swap Drive Bay R1208WTTB04NVMR (8) – 2.5” Hot-swap drive bays
• Includes (1) Combo (NVMe/SAS) backplane
• Includes (4) 2.5” hot swap drive trays (Green Tab) + drive blanks + SATA/SAS cable
• Includes (4) 2.5” hot swap NVMe drive assemblies (Blue Tab) o Includes (4) 800GB Intel® SSD DC P3700 (SFF NVMe) Drives o Includes (1) PCIe* SSD Interface Card (installed in Riser #2) + cables Supported Rack Mount Kit Accessory Options  AXXPRAIL – Tool-less rack mount rail kit – 800mm max travel length  AXXELVRAIL – Enhanced value rack mount rail kit - 424mm max travel length  AXX1U2UCMA – Cable Management Arm – (*supported with AXXPRAIL only)  AXX2POSTBRCKT – 2-post fixed mount bracket kit  A1USHRTRAIL - 1U Premium quality rails with no CMA support  A1UFULLRAIL - 1U Premium quality rails with CMA support

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The Intel® Storage System R1000 includes management features that provide NVMe health monitoring and alerting. Added health sensors give system administrators notification of potential issues with installed NVMe drives.

• NVMe Percentage of life monitoring – Monitors overall wear of the NVMe drive. As this value nears 100%, administrators can prepare to back up data and replace drives as needed.
• NVMe Temperature monitoring – Provides the ability to read and report the case temperature of installed NVMe drives. NVMe drives may operate at higher temperatures as compared to traditional hard drives. With temperature monitoring, if desired, system administrators can modify preprogrammed fan speed control to operate system fans to more aggressive lower or higher operating levels.
• Integrated BMC Web Console – Provides administrators remote access to NVMe drive information

Intel® R1000WT Server System TPS November 2016 113 Glossary Word/Acronym Definition BMC Baseboard Management Controller BIOS Basic Input/Output System CLST Closed Loop System Throttling CMOS Complementary Metal-oxide-semiconductor CPU Central Processing Unit DDR4 Double Data Rate 4th edition DIMM Dual In-line Memory Module DOM Disk-on-module DPC DIMMs per Channel EDS External Design Specification EPS External Product Specification FP Front Panel FRB Fault Resilient Boot FRU Field Replaceable Unit GPGPU General Purpose Graphic Processing Unit HDD Hard Disk Drive I2C Inter-integrated Circuit bus LCD Liquid Crystal Display LCP Local Control Panel LED Light Emitting Diode LFM Linear Feet per Minute – Air Flow measurement LPC Low-pin Count LRDIMM Load Reduced DIMM LSB Least Significant Bit MSB Most Significant Bit MTBF Mean Time Between Failure NIC Network Interface Card NMI Non-maskable Interrupt OCP Over-current Protection OTP Over-temperature Protection OVP Over-voltage Protection PCI Peripheral Component Interconnect PCB Printed Circuit Board PCIe* Peripheral Component Interconnect Express* PCI-X Peripheral Component Interconnect Extended PFC Power Factor Correction POST Power-on Self Test PSU Power Supply Unit RAID Redundant Array of Independent Disks RAM Random Access Memory SSD Solid State Drive TDP Thermal Design Power

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TPM Trusted Platform Module TPS Technical Product Specification USB Universal Serial Bus VLSI Very Large Scale Integration VSB Voltage Standby

Intel® R1000WT Server System TPS November 2016 115 Reference Documents See the following documents for additional information:  Intel® Server Board S2600WT Technical Product Specification  Intel® Server S2600WT Product Configuration Guide and Spares/Accessories List  Intel® Server System R1000WT Product Family System Integration and Service Guide  Intel® S2600WT Product Family Power Budget and Thermal Configuration Tool  Advanced Configuration and Power Interface Specification, Revision 3.0, http://www.acpi.info/.  Intelligent Platform Management Bus Communications Protocol Specification, Version 1.0. 1998. Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.  Intelligent Platform Management Interface Specification, Version 2.0. 2004. Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer Corporation.  Platform Support for Serial-over-LAN (SOL), TMode, and Terminal Mode External Architecture Specification, Version 1.1, 02/01/02, Intel Corporation.  Intel® Remote Management Module User’s Guide, Intel Corporation.  Alert Standard Format (ASF) Specification, Version 2.0, 23 April 2003, ©2000-2003, Distributed Management Task Force, Inc., http://www.dmtf.org.  Intel® Server System BIOS External Product Specification for Intel® Servers Systems supporting the Intel® Xeon® processor E5-2600 V3 and v4 product family – (Intel NDA Required)  Intel® Server System BIOS Setup Utility Guide for Intel® Servers Systems supporting the Intel® Xeon® processor E5-2600 V3 and v4 product family  Intel® Server System BMC Firmware External Product Specification for Intel® Servers Systems supporting the Intel® Xeon® processor E5-2600 V3 and v4 product family – (Intel NDA Required)  SmaRT & CLST Architecture on Intel Systems and Power Supplies Specification (Doc Reference # 461024)  Intel Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and RMS25CB040 Hardware Users Guide  Intel® Remote Management Module 4 Technical Product Specification  Intel® Remote Management Module 4 and Integrated BMC Web Console Users Guide  Intel® Ethernet Controller I350 Family Product Brief  Intel® Ethernet Controller X540 Family Product Brief  Intel® Chipset C610 product family (“Wellsburg”) External Design Specification – (Intel NDA Required)  Intel® Xeon® Processor E5-4600/2600/2400/1600 v3 and v4 Product Families (“Haswell”) and (“Broadwell”) External Design Specification – (Intel NDA Required)

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