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 Meters (Watt-Hour, Water, Gas)  Industrial Controls  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Medical Equipment—Patient/Equipment Isolation  7mm Separation of Output Pins  800VP Blocking Voltage  5000Vrms Input/Output Isolation  Low Drive Power Requirements  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Surface Mount Package  Flammability Rating UL 94 V-0 Switching Characteristics of Normally Closed Devices Approvals  UL Certified Component: File E76270  EN/IEC 60950 Certified Component: TUV Certificate B 13 12 82667 003 Specially designed to provide 7mm of separation between the two output pins, IXYS Integrated Circuits Division's PLB171 is a single-pole, normally closed (1-Form-B) Solid State Relay that uses optically coupled MOSFET technology to provide an en hanced input-to-output isolation of 5000V rms. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The PLB171 is designed to replace, and offers superior reliability over, electromechanical relays. This device provides bounce-free switching in a compact surface-mount package. Form-B IF 10% 90% ILOAD ton toff + Control – Control NC Load Load NC

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R02 PLB171 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 800 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW ESD, Human Body Model 8 kV Isolation Voltage, Input to Output (60 Seconds) 5000 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 IF=0mA I L - - 80 mA rms / mADC Peak I F=0mA , t=10ms I LPK - - ±250 mA P On-Resistance 2 IF=0mA, IL= 10mA RON - 58 90 IF=0mA, IL= 80mA - 38 55 Off-State Leakage Current I F=5mA, VL=800VP ILEAK --1 A Switching Speeds T urn-On I F=5mA, IL=80mA (See Timing Diagram) ton - 0.42 5 ms T urn-Off t off - 0.5 5 Output Capacitance I F=2mA, VL=20VDC, f=1MHz C OUT -8- p F Input Characteristics Input Control Current to Activate 3 IL=80mA IF - 0.2 2 mA Input Control Current to Deactivate 3 IF 50 - - A Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance V IO=0, f=1MHz C IO -3- p F 1 Load derates linearly from 80mA @ 25oC to 59mA @85oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 5mA is recommended. Timing Diagram 10% 90% toffton 0 mAIL IF 0 mA

INTEGRATED CIRCUITS DIVISION PLB171 www.ixysic.com 3R02 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage Drop vs. Temperature IL=10mA IL=5mA IL=2mA IL=50mA IL=25mA LED Forward Current (mA) 0 5 10 15 20 25 30 Turn-On Time (ms) 0.0 0.5 1.0 1.5 2.0 Turn-On Time vs. LED Forward Current (IL=80mA) LED Forward Current (mA) 0 5 10 15 20 25 30 Turn-Off Time (ms) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Turn-Off Time vs. LED Forward Current (IL=80mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Current (mA) 0.00 0.25 0.50 0.75 LED Current to Activate vs. Temperature Activate Deactivate Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Turn-On Time vs. Temperature (IL=55mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Turn-Off Time vs. Temperature (IL=55mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 100 On-Resistance vs. Temperature (IF=0mA) IL=80mA IL=2mA Load Voltage (V) -4 -3 -2 -1 0 1 2 3 4 Load Current (mA) -120 -80 -40 120 Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 100 Maximum Load Current vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 800 850 900 950 1000 1050 1100 Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 Typical Leakage Current vs. Temperature Load Voltage (VDC) 0 5 10 15 20 Output Capacitance (pF) Output Capacitance vs. Load Voltage (IF=2mA) PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R02 PLB171 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation PLB171P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles PLB171P 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION Specification: DS-PLB171-R02 ©Copyright 2016, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/18/2016 For additional information please visit our website at: www.ixysic.com PLB171 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Notes: 1. Coplanarity = 0.102mm (0.004”) MAX 2. Leadframe thickness does not include solder plating (1000 microinches MAX) 3. Sum of package height, standoff, and coplanarity shall not exceed 2.286mm (0.090”) 9.398 ± 0.127 (0.370 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005)

7.620 TYP

(0.300) TYP 7.620 ± 0.254 (0.300 ± 0.010)

2.286 MAX

(0.090) MAX See Note 3 0.203 ± 0.025 (0.008 ± 0.001) 0.635 ± 0.127 (0.380 ± 0.015) 0.457 ± 0.076 (0.018 ± 0.003) Recommended PCB Land Pattern Dimensions mm (inches) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 7.62 (0.30) 2.159 ± 0.025 (0.085 ± 0.001) Pin 1 0.864 ± 0.102 (0.034 ± 0.004) Leadframe to package standoff MIN=0.000 MAX=0.102 (0.004) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) User Direction of Feed P = 12.00 (0.472) W = 16.00 (0.63) Bo = 10.30 (0.406) Ao = 10.30 (0.406) K1 = 2.00 (0.079) K0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) PLB171PTR Tape & Reel PLB171P Mechanical Dimensions