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Load Current 350 mA rms / mADC On-Resistance (max) 3  Pin Configuration Part Number Description PLA134 6-Pin DIP (50/T ube) PLA134S 6-Pin Surface Mount (50/T ube) PLA134STR 6-Pin Surface Mount (1,000/Reel) Switching Characteristics of Normally Open Devices  3750Vrms Input/Output Isolation  Low Drive Power Requirements (TTL/CMOS Compatible)  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Machine Insertable, Wave Solderable  Small 6-Pin Package  Surface Mount Tape & Reel Version Available  Flammability Classification Rating of V-0  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Security  Aerospace  Industrial Controls Approvals Form-A IF ILOAD 10% 90% ton toff + Control – Control N/C Load Do Not Use Load AC/DC Configuration + Control – Control + Load – Load DC Only Configuration N/C  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1175739  EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 The PLA134 is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide 3750V rms of input-to-output isolation. With its combination of low on-resistance and high load current handling, the PLA134 is suitable for a variety of industrial applications. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Because Solid State Relays have no moving parts, they can offer faster, bounce-free switching in a more compact surface mount or though hole package than traditional electromechanical relays.

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 PLA134 Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Ratings Units Blocking Voltage 100 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current (Continuous) AC/DC Configuration -I L - - 350 mA rms / mADC DC Configuration - - 750 mA DC Peak Load Current t=10ms I LPK - - ±1 mA P On-Resistance AC/DC Configuration I F=350mA RON -- 3  DC Configuration I F=750mA - - 0.8 Off-State Leakage Current V L=100VP ILEAK -- 1 µ A Switching Speeds T urn-On I F=5mA, IL=10mA ton -- 5 m s T urn-Off t off Input Characteristics Input Control Current to Activate I L=350mA I F -- 5 m A Input Control Current to Deactivate - I F 0.4 - - mA Input Voltage Drop I F=10mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output - C I/O -3 - p F

INTEGRATED CIRCUITS DIVISION PLA134 www.ixysic.com 3R05 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=350mADC) 0.075 0.0950.085 0.105 Turn-Off Time (ms) Device Count (N) 0.065 Typical Turn-Off Time (N=50, IF=5mA, IL=350mADC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=350mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=350mADC) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=350mADC) On-Resistance (:) 100 110 120 140 130 150 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 Temperature (ºC) IF=50mA IF=5mA IF=10mA LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.30 0.25 0.20 0.15 0.10 0.05 Typical Turn-On Time vs. LED Forward Current (IL=200mADC) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 Typical Turn-Off Time vs. LED Forward Current (IL=200mADC)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 PLA134 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Turn-On Time (ms) -40 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IF=5mA, IL=200mADC) Temperature (ºC) Turn-Off Time (ms) -40 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 -20 0 20 40 60 80 100 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=200mADC) Temperature (ºC) -40 -20 0 20 40 60 80 100 IF=5mA Instantaneous IF=5mA IF=10mA Typical On-Resistance vs. Temperature AC/DC Configuration (IL=350mADC) Temperature (ºC) On-Resistance (:) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=200mADC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=200mADC) Temperature (ºC) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) On-Resistance (:) Typical On-Resistance vs. Temperature DC-Only Configuration (IL=350mADC) IF=10mA IF=5mA Load Voltage (V) Load Current (mA) 400 300 200 100 -100 -200 -300 -400 Typical Load Current vs. Load Voltage (IF=5mA) Load Current (mA) 600 500 400 300 200 100 -40 -20 0 20 40 60 80 120 100 Maximum Load Current vs. Temperature AC/DC Configuration Temperature (ºC) IF=10mA IF=5mA Load Current (mA) 900 800 700 600 500 400 300 200 100 Maximum Load Current vs. Temperature DC Configuration -40 -20 0 20 40 60 80 120 100 IF=5mA IF=10mA Temperature (ºC) Blocking Voltage (VP) -40 175 150 125 100 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 4&6 Temperature (ºC) Time Load Current (A) 2.4 2.0 1.6 1.2 0.8 0.4 10Ps 1ms 100ms 10s100Ps 10ms 1s 100s Energy Rating Curve

INTEGRATED CIRCUITS DIVISION PLA134 www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PLA134 / PLA134S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PLA134 / PLA134S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R05 PLA134 Dimensions mm (inches) PCB Hole Pattern 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254 ± 0.0127 (0.010 ± 0.0005) 9.144 ± 0.508 (0.360 ± 0.020)

7.239 TYP

(0.285 TYP) 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002)

4.064 TYP

(0.160 TYP) 0.457 ± 0.076 (0.018 ± 0.003) 8.382 ± 0.381 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 Dimensions mm (inches) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382 ± 0.381 (0.100 ± 0.005) 9.524 ± 0.508 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 PLA134 PLA134S Mechanical Dimensions

INTEGRATED CIRCUITS DIVISION Specification: DS-PLA134-R05 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com PLA134 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed PLA134STR Tape & Reel