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Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment—Patient/Equipment Isolation Security Aerospace Industrial Controls Automotive Low Input Control Current: 2mA 3750Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Machine Insertable, Wave Solderable Surface Mount Tape & Reel Version Available Switching Characteristics of Normally Open Devices Approvals Form-A IF ILOAD 10% 90% ton toff + Control – Control Do Not Use Load Do Not Use Load AC/DC Configuration + Control – Control Do Not Use + Load – Load DC Only Configuration UL Recognized Component: File E76270 CSA Certified Component: Certificate 1175739 EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 PLA132 is a single-pole, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The PLA132 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package.
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R04 PLA132 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current IL AC/DC Confi guration, Continuous - - - 600 mA rms / mADC DC Confi guration, Continuous - - 1.2 A DC Peak Load Current t ≤10ms I LPK - - ±2 A P On-Resistance RON AC/DC Confi guration I L=600mA - 0.85 1 DC Confi guration I L=1A - - 0.3 Off-State Leakage Current V L=60VP ILEAK --1 A Switching Speeds T urn-On IF = 5mA, VL = 10V ton --5 m s T urn-Off t off --2 m s Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L = 600mA I F --2 m A Input Control Current to Deactivate - I F 0.2 - - mA Input Voltage Drop I F = 5mA V F 0.9 1.2 1.4 V Reverse Input Current V R = 5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output - C I/O -3 - p F Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION PLA132 www.ixysic.com 3R04 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=600mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=600mADC) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=600mA) On-Resistance (:) Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50) Temperature (ºC) -40 -20 0 20 40 60 80 100 120 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage vs. Temperature IF=50mA IF=1mA IF=2mA IF=5mA IF=10mA IF=20mA LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-On Time vs. LED Forward Current (IL=80mA) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-Off Time vs. LED Forward Current (IL=80mA)
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R04 PLA132 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * IF =5mA IF =10mA Turn-On Time (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IL=80mA) Temperature (ºC) Turn-Off Time (ms) -40 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -20 0 20 40 60 80 100 IF =10mA IF =5mA Temperature (ºC) Typical Turn-Off Time vs. Temperature (IL=80mA) -40 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -20 0 20 40 60 80 100 On-Resistance (:) Temperature (ºC) Typical On-Resistance vs. Temperature (IF=2mA, IL=600mADC) LED Current (mA) -40 -20 0 20 40 60 80 100 1.2 1.0 0.8 0.6 0.4 0.2 Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=300mA) LED Current (mA) -40 1.2 1.0 0.8 0.6 0.4 0.2 -20 0 20 40 60 80 100 Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=300mA) Load Voltage (V) Load Current (mA) 600 400 200 -200 -400 -600 Typical Load Current vs. Load Voltage (IF=2mA) Load Current (A) 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 -40 -20 0 20 40 60 80 120 100 DC AC/DC Maximum Load Current vs. Temperature (IF=2mA) Temperature (ºC) Blocking Voltage (VP) -40 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 4&6 (VL=60V) Temperature (ºC) Time Load Current (A) 10Ps 2.2 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve 2.0 0.2
INTEGRATED CIRCUITS DIVISION PLA132 www.ixysic.com 5R04 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PLA132 / PLA132S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PLA132 / PLA132S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R04 PLA132 Dimensions mm (inches) PCB Hole Pattern 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254 ± 0.0127 (0.010 ± 0.0005) 9.144 ± 0.508 (0.360 ± 0.020)
7.239 TYP
(0.285 TYP) 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002)
4.064 TYP
(0.160 TYP) 0.457 ± 0.076 (0.018 ± 0.003) 8.382 ± 0.381 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 Dimensions mm (inches) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382 ± 0.381 (0.100 ± 0.005) 9.524 ± 0.508 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 PLA132 PLA132S Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION Specification: DS-PLA132-R04 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com PLA132 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed PLA132STR Tape & Reel