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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, PocketSize) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Security Aerospace Industrial Controls UL Recognized Component: File E76270 CSA Certified Component: Certificate 1175739 EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 3750Vrms Input to Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation FCC Compatible VDE Compatible Small 6-Pin Package Machine Insertable, Wave Solderable Switching Characteristics of Normally Open Devices Form-A IF ILOAD 10% 90% ton toff + Control - Control NC Load Do Not Use Load AC/DC Configuration + Control - Control NC + Load - Load DC Only Configuration PLA110 is a normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The PLA110 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package.
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R07 PLA110 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Min Max Units Blocking Voltage - 400 V P Reverse Input Voltage - 5 V Input Control Current - 50 mA Peak (10ms) - 1 A Input Power Dissipation 1 - 150 mW T otal Package Dissipation 2 - 800 mW Isolation Voltage, Input to Output 3750 - V rms Operational T emperature -40 +85 ºC Storage T emperature -40 +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous, AC/DC Configuration - IL - - 150 mA rms / mADC Continuous, DC Configuration - - - 250 mA DC Peak t =10ms I LPK - - ±400 mA P On-Resistance AC/DC Configuration I L=150mA RON --2 2 DC Configuration I L=250mA - - 7 Off-State Leakage Current V L=400VP ILEAK -- 1 A Switching Speeds T urn-On I F=5mA, VL=10V ton -- 1 ms T urn-Off t off - - 0.5 Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L=150mA I F -- 5 m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R --1 0 A Common Characteristics Input to Output Capacitance - C I/O -3 - p F
INTEGRATED CIRCUITS DIVISION PLA110 www.ixysic.com 3R07 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) Turn-On Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) Turn-Off Time (ms) Device Count (N) Typical IF for Switch Operation (N=50, IL=150mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50) LED Current (mA) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 16 18 2015 17 19 On-Resistance (:) Device Count (N) Typical Blocking Voltage Distribution (N=50) Blocking Voltage (V Device Count (N) Typical LED Forward Voltage Drop vs. Temperature Temperature (ºC) LED Forward Voltage Drop (V) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=10mA IF=5mA Typical Turn-On Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.12 0.10 0.08 0.06 0.04 0.02
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R07 PLA110 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical On-Resistance vs. Temperature AC/DC Configuration (IL=150mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 IF=5mA IF=10mA Typical Turn-On Time vs. Temperature (IL=100mADC) Temperature (ºC) Turn-On Time (ms) -40 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 120 100 IF=5mA IF=10mA Typical Turn-Off Time vs. Temperature (IF=5mA, IL=100mADC) Temperature (ºC) Turn-Off Time (ms) -40 0.35 0.3 0.25 0.2 0.15 0.1 0.05 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature - DC Configuration (IL=150mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 IF=5mA IF=10mA Typical IF for Switch Operation vs. Temperature (IL=100mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=100mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical On Resistance vs. Temperature (IF=5mA; IL=100mA Instantaneous) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 120 100 Typical Load Current vs. Load Voltage (IF=5mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Maximum Load Current vs. Temperature (N=50) Temperature (ºC) Load Current (mA) 300 250 200 150 100 -40 -20 0 20 40 60 80 120 100 IF=10mA IF=5mA DC Configuration AC/DC Configuration IF=10mA IF=5mA Typical Blocking Voltage vs. Temperature Temperature (ºC) Blocking Voltage (VP) -40 480 475 470 465 460 455 450 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured across Pins 4&6 Temperature (ºC) Leakage (PA) -40 0.035 0.030 0.025 0.020 0.015 0.010 0.005 -20 0 20 40 60 80 100 Energy Rating Curve Time Load Current (A) 10Ps 1.2 1.0 0.8 0.6 0.4 0.2 1ms100Ps 100ms 1s10ms 10s 100s
INTEGRATED CIRCUITS DIVISION PLA110 www.ixysic.com 5R07 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PLA110 / PLA110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PLA110 / PLA110S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R07 PLA110 Dimensions mm (inches) PCB Hole Pattern 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254 ± 0.0127 (0.010 ± 0.0005) 9.144 ± 0.508 (0.360 ± 0.020)
7.239 TYP
(0.285 TYP) 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002)
4.064 TYP
(0.160 TYP) 0.457 ± 0.076 (0.018 ± 0.003) 8.382 ± 0.381 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 Dimensions mm (inches) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382 ± 0.381 (0.100 ± 0.005) 9.524 ± 0.508 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 PLA110 PLA110S Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION Specification: DS-PLA110-R07 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com PLA110 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed PLA110STR Tape & Reel