PLA110L

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 7

Technical content

Features

Description

10% 90% ton toff Part # Description PLA110L 6-Pin Dip (50/T ube) PLA110LS 6-Pin Surface Mount (50/T ube) PLA110LSTR 6-Pin Surface Mount (1000/Reel)

Ordering Information

Switching Characteristics of Normally Open Devices + Control – Control NC Load Do Not Use Load AC/DC Configuration + Control – Control NC + Load – Load DC Only Configuration PLA110L is a current-limited, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The PLA110L can be used to replace mechanical relays. It offers the superior reliability associated with semiconductor devices, it has no moving parts, and it offers faster, bounce-free switching in a more compact surface mount or thru-hole package.

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 PLA110L Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current, Continuous AC/DC Configuration -I L - - 150 mA rms / mADC DC Configuration - - 250 mA DC Peak 10ms I LPK --- m A On-Resistance AC/DC Configuration I L=150mA RON -- 2 5  DC Configuration I L=250mA - - 9 Off-State Leakage Current V L=400VP ILEAK --- µ A Switching Speeds T urn-On I F=5mA, VL=10V ton --1 m s T urn-Off t off - - 0.25 ms Output Capacitance V L=50V , f=1MHz C OUT -2 5- p F Load Current Limiting - I CL 190 235 280 mA Input Characteristics Input Control Current to Activate I L=150mA I F --5 m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance - C I/O -3- p F Parameter Ratings Units Blocking Voltage 400 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC

INTEGRATED CIRCUITS DIVISION PLA110L www.ixysic.com 3R05 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) Turn-On Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) Turn-Off Time (ms) Device Count (N) Typical IF for Switch Operation (N=50, IL=150mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50) LED Current (mA) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) On-Resistance (:) Device Count (N) Typical Blocking Voltage Distribution (N=50) Blocking Voltage (V Device Count (N) Typical LED Forward Voltage Drop vs. Temperature Temperature (ºC) LED Forward Voltage Drop (V) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA Typical Turn-On Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) Forward Current (mA) Turn-Off Time (ms) 0.12 0.10 0.08 0.06 0.04 0.02 0 5 10 15 20 25 30 35 40 45 50

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 PLA110L *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical Turn-On Time vs. Temperature (IL=150mADC) Temperature (ºC) Turn-On Time (ms) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 120 100 IF=5mA IF=10mA IF=20mA Typical Turn-Off Time vs. Temperature (IF=5mA, IL=150mADC) Temperature (ºC) Turn-Off Time (ms) -40 0.14 0.12 0.10 0.08 0.06 0.04 0.02 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature (IF=5mA, IL=150mADC) Temperature (ºC) On-Resistance (:) -40 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=150mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Dropout vs. Temperature (IL=150mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Load Current vs. Load Voltage (IF=5mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Maximum Load Current vs. Temperature Temperature (ºC) Load Current (mA) 300 250 200 150 100 -40 -20 0 20 40 60 80 120 100 IF=20mA IF=10mA IF=5mA Typical Blocking Voltage vs. Temperature Temperature (ºC) Blocking Voltage (VP) -40 480 475 470 465 460 455 450 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 4&6 Temperature (ºC) Leakage (PA) -40 0.035 0.030 0.025 0.020 0.015 0.010 0.005 -20 0 20 40 60 80 100 Energy Rating Curve Time Load Current (A) 10Ps 1.2 1.0 0.8 0.6 0.4 0.2 1ms100Ps 100ms 1s10ms 10s 100s

INTEGRATED CIRCUITS DIVISION PLA110L www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PLA110L / PLA110LS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PLA110L / PLA110LS 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R05 PLA110L Dimensions mm (inches) PCB Hole Pattern 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254 ± 0.0127 (0.010 ± 0.0005) 9.144 ± 0.508 (0.360 ± 0.020)

7.239 TYP

(0.285 TYP) 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002)

4.064 TYP

(0.160 TYP) 0.457 ± 0.076 (0.018 ± 0.003) 8.382 ± 0.381 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 Dimensions mm (inches) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382 ± 0.381 (0.100 ± 0.005) 9.524 ± 0.508 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 PLA110L PLA110LS Mechanical Dimensions

INTEGRATED CIRCUITS DIVISION Specification: DS-PLA110L-R05 © Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com PLA110L IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed PLA110LSTR Tape & Reel