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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
Features
- Pb−Free, Halogen Free and RoHS compliant.
- Low R DS(on) to Minimize Conduction Losses.
- Ohmic Region Good RDS(on) Ratio.
- Optimized Gate Charge to Minimize Switching Losses.
Applications
- Protection Circuits Applications.
- Computer for DC to DC Converters Applications. ABSOLUTE MAXIMUM RATINGS (T A = 25 °C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage V DS 30 V Gate-Source Voltage V GS ±20 V Continuous Drain Current4 TC = 25 °C ID 151 A TC = 100 °C 95 Pulsed Drain Current1 I DM 200 Continuous Drain Current TA = 25 °C ID TA = 70 °C 28 Avalanche Current I AS 57 Avalanche Energy L = 0.1mH E AS 162 mJ Power Dissipation TC = 25 °C PD W TC = 100 °C 29 Power Dissipation3 TA = 25 °C PD 4.1 W TA = 70 °C 2.6 Operating Junction & Storage Temperature Range T j, Tstg -55 to 150 °C G. GATE D. DRAIN S. SOURCE PRODUCT SUMMARY V(BR)DSS R DS(ON) I D 30V 1.6mΩ 151A
REV 1.0 G-48-2 N-Channel Enhancement Mode Field Effect Transistor PKC26BB PDFN 5x6P Halogen-Free & Lead-Free NIKO-SEM THERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient2 t ≦10s RJA 30 °C / W Junction-to-Ambient2 Steady-State RJA 50 Junction-to-Case Steady-State RJC 1.7 1Pulse width limited by maximum junction temperature. 2The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. 3The Power dissipation is based on RJA t ≦10s value. 4The maximum current rating is package limited. ELECTRICAL CHARACTERISTICS (T J = 25 °C, Unless Otherwise Noted) PARAMETER SYMBOL TEST CONDITIONS LIMITS UNITMIN TYP MAX STATIC Drain-Source Breakdown Voltage V (BR)DSS VGS = 0V, ID = 250A 30 V Gate Threshold Voltage V GS(th) VDS = VGS, ID = 250A 1.3 1.6 2.35 Gate-Body Leakage I GSS V DS = 0V, VGS = ±20V ±100 nA Zero Gate Voltage Drain Current I DSS VDS = 24V, VGS = 0V 1 VDS = 20V, VGS = 0V, TJ = 55 °C 10 Drain-Source On-State Resistance1 RDS(ON) VGS = 4.5V, ID = 20A 1.6 2.3 mΩ VGS = 10V, ID = 20A 1.1 1.6 Forward Transconductance1 g fs V DS = 5V, ID = 20A 123 S DYNAMIC Input Capacitance C iss VGS = 0V, VDS = 15V, f = 1MHz 3499 pFOutput Capacitance C oss 625 Reverse Transfer Capacitance C rss 408 Gate Resistance R g V GS = 0V, VDS = 0V, f = 1MHz 1.1 Ω Total Gate Charge2 Q g VGS = 10V VDS = 15V , VGS = 10V, ID = 20A nC VGS = 4.5V 36 Gate-Source Charge2 Q gs 9.2 Gate-Drain Charge2 Q gd 17 Turn-On Delay Time2 t d(on) VDS = 15V , ID 20A, VGS = 10V, RGEN =6Ω nS Rise Time2 t r 120 Turn-Off Delay Time2 t d(off) 97 Fall Time2 t f 150
REV 1.0 G-48-2 N-Channel Enhancement Mode Field Effect Transistor PKC26BB PDFN 5x6P Halogen-Free & Lead-Free NIKO-SEM SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current3 I S 73 A Forward Voltage1 V SD I F = 20A, VGS = 0V 1 V Reverse Recovery Time t rr IF = 20A, dlF/dt = 100A / S 28 nS Reverse Recovery Charge Q rr 13 nC 1Pulse test : Pulse Width 300 sec, Duty Cycle 2％. 2Independent of operating temperature. 3The maximum current rating is package limited.
REV 1.0 G-48-2 N-Channel Enhancement Mode Field Effect Transistor PKC26BB PDFN 5x6P Halogen-Free & Lead-Free NIKO-SEM 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 VGS=10V ID=20A CISS COSS CRSS 500 1000 1500 2000 2500 3000 3500 4000 4500 0 5 10 15 20 25 30 0.0008 0.0016 0.0024 0.0032 0.004 0 6 12 18 24 30 VGS=10V VGS=4.5V 0.002 0.004 0.006 0.008 2468 1 0 ID=20A 0123456 VGS=10V VGS=9V VGS=8V VGS=7V VGS=6V VGS=5V VGS=4.5V VGS=3V VGS=2.5V VGS=2.7V 25℃ 125℃ -20℃ 012345 Output Characteristics ID, Drain-To-Source Current(A) Transfer Characteristics ID, Drain-To-Source Current(A) VGS, Gate-To-Source Voltage(V) VDS, Drain-To-Source Voltage(V) Normalized Drain to Source ON-Resistance TJ , Junction Temperature(˚C) Capacitance Characteristic C , Capacitance(pF) VDS, Drain-To-Source Voltage(V) On-Resistance VS Temperature On-Resistance VS Gate-To-Source RDS(ON)ON-Resistance(OHM) VGS, Gate-To-Source Voltage(V) On-Resistance VS Drain Current RDS(ON)ON-Resistance(OHM) ID , Drain-To-Source Current(A)
REV 1.0 G-48-2 N-Channel Enhancement Mode Field Effect Transistor PKC26BB PDFN 5x6P Halogen-Free & Lead-Free NIKO-SEM single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJA = 50 ℃/W 3.TJ-TA = P*RthJA(t) 4.RthJA(t) = r(t)*RthJA 120 150 0.001 0.01 0.1 1 10 100 Single Pulse RθJA = 50 ˚C/W TA = 25˚C DC 100ms 10ms 1ms 0.01 0.1 100 1000 0.01 0.1 1 10 100 NOTE : 1.VGS = 10V 2.TA = 25˚C 3.RθJA = 50 ˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) 25℃150℃ 0.1 100 1000 0 2 04 06 08 0 1 0 0 VDS=15V ID=20A Gate charge Characteristics Qg , Total Gate Charge(nC) VGS , Gate-To-Source Voltage(V) Source-Drain Diode Forward Voltage VSD, Source-To-Drain Voltage(V) IS , Source Current(A) Safe Operating Area Single Pulse Maximum Power Dissipation ID , Drain Current(A) Power(W) Single Pulse Time(s) VDS, Drain-To-Source Voltage(V) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance T1 , Square Wave Pulse Duration[sec]