PECH1EU NIKOSEM | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Pb−Free, Halogen Free and RoHS compliant.
  • Low RDS(on) to Minimize Conduction Losses.
  • Ohmic Region Good RDS(on) Ratio.
  • Optimized Gate Charge to Minimize Switching Losses.
  • 100% UIS and Rg Tested.
  • Products Integrated ESD diode with ESD Protected.

Applications

  • Protection Circuits Applications.
  • Logic/Load Switch Circuits Applications. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±25 V Continuous Drain Current4 TC = 25 °C ID -50 A TC = 100 °C -46 TA = 25 °C -17 TA = 70 °C -13 Pulsed Drain Current1 IDM -187 Avalanche Current IAS -54 Avalanche Energy L = 0.1mH EAS 145 mJ Power Dissipation3 TC = 25 °C PD W TC = 100 °C 23 TA = 25 °C 3.1 TA = 70 °C 2 Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C PRODUCT SUMMARY V(BR)DSS RDS(ON) ID -30V 6.1mΩ -50A G. GATE D. DRAIN S. SOURCE

P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.1 N-21-4 PECH1EU PDFN 3.3x3.3S Halogen-free & Lead-Free NIKO-SEM THERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient2 t ≦10s RJA 40 °C / W Junction-to-Ambient2 Steady-State RJA 58 Junction-to-Case Steady-State RJC 2.2 1Pulse width limited by maximum junction temperature. 2The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. 3The Power dissipation is based on RJA t ≦10s value. 4The maximum current rating is Package limited. ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted) PARAMETER SYMBOL TEST CONDITIONS LIMITS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250A -30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250A -1.3 -1.7 -2.3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±25V ±10 uA Zero Gate Voltage Drain Current IDSS VDS = -30V, VGS = 0V -1 VDS = -30V, VGS = 0V, TJ = 55 °C -10 Drain-Source On-State Resistance5 RDS(ON) VGS = -10V, ID = -12A 4.7 6.1 mΩ VGS = -4.5V, ID = -12A 7.6 11 Forward Transconductance5 gfs VDS = -5V, ID = -12A 45 S DYNAMIC Input Capacitance Ciss VGS = 0V, VDS = -15V, f = 1MHz 3265 pF Output Capacitance Coss 511 Reverse Transfer Capacitance Crss 397 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 4.3 Ω Total Gate Charge6 Qg(VGS=-10V) VDS = -15V , ID = -12A nC Qg(VGS=-4.5V) 33 Gate-Source Charge6 Qgs 9 Gate-Drain Charge6 Qgd 14

P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.1 N-21-4 PECH1EU PDFN 3.3x3.3S Halogen-free & Lead-Free NIKO-SEM Turn-On Delay Time6 td(on) VDD = -15V ID  -8.8A, VGS = -10V, RGEN = 2.6Ω nS Rise Time6 tr 47 Turn-Off Delay Time6 td(off) 87 Fall Time6 tf 78 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS -48 A Forward Voltage5 VSD IF = -12A, VGS = 0V -1.3 V Reverse Recovery Time trr IF = -12A, dI/dt = 100A/μs 14 nS Reverse Recovery Charge Qrr 2 nC 5Pulse test : Pulse Width  300 sec, Duty Cycle  2%. 6Independent of operating temperature.

P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.1 N-21-4 PECH1EU PDFN 3.3x3.3S Halogen-free & Lead-Free NIKO-SEM Output Characteristics Transfer Characteristics -ID, Drain-To-Source Current(A) -ID, Drain-To-Source Current(A) -VGS, Gate-To-Source Voltage(V) -VDS, Drain-To-Source Voltage(V) On-Resistance VS Drain Current On-Resistance VS Gate-To-Source Voltage RDS(ON)ON-Resistance(OHM) RDS(ON)ON-Resistance(OHM) -ID , Drain-To-Source Current(A) -VGS, Gate-To-Source Voltage(V) Capacitance Characteristic On-Resistance VS Temperature C , Capacitance(pF) Normalized Drain to Source ON-Resistance -VDS, Drain-To-Source Voltage(V) TJ , Junction Temperature(˚C) 25℃ 125℃ -20℃ 0 1 2 3 4 5 0 1 2 3 4 5 6 VGS=-10V VGS=-9V VGS=-8V VGS=-7V VGS=-6V VGS=-5V VGS=-4.5V VGS=-2.9V VGS=-2.5V VGS=-2.7V 0.003 0.006 0.009 0.012 0.015 0 6 12 18 24 30 VGS=-10V VGS=-4.5V 0.004 0.008 0.012 0.016 0.02 2 4 6 8 10 ID=-12A CISS COSS CRSS 500 1000 1500 2000 2500 3000 3500 4000 0 5 10 15 20 25 30 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 VGS=-10V ID=-12A

P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.1 N-21-4 PECH1EU PDFN 3.3x3.3S Halogen-free & Lead-Free NIKO-SEM Source-Drain Diode Forward Voltage Safe Operating Area Single Pulse Maximum Power Dissipation Single Pulse Time(s) -VDS, Drain-To-Source Voltage(V) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance T1 , Square Wave Pulse Duration(S) -VSD, Source-To-Drain Voltage(V) Gate charge Characteristics Characteristics Qg , Total Gate Charge(nC) -VGS , Gate-To-Source Voltage(V) 0 20 40 60 80 VDS=-15V ID=-12A 150℃ 25℃ 0.1 100 1000 DC 100ms 10ms 1ms 0.01 0.1 100 1000 0.1 1 10 100 NOTE : 1.VGS = -10V 2.TA =25˚C 3.RθJA = 58 ˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) 120 160 200 0.001 0.01 0.1 1 10 100 Single Pulse RθJA = 58 ˚C/W TA = 25˚C single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.001 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJA = 58 ℃/W 3.TJ-TA = P*RthJA(t) 4.RthJA(t) = r(t)*RthJA -IS , Source Current(A) -ID , Drain Current(A) Power(W)

P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.1 N-21-4 PECH1EU PDFN 3.3x3.3S Halogen-free & Lead-Free NIKO-SEM Safe Operating Area Single Pulse Maximum Power Dissipation Single Pulse Time(s) -VDS, Drain-To-Source Voltage(V) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance T1 , Square Wave Pulse Duration(S) 200 400 600 800 0.001 0.01 0.1 1 10 100 Single Pulse RθJC = 2.2 ˚C/W TC = 25˚C DC 100ms 10ms 1ms 100 1000 0.1 1 10 100 NOTE : 1.VGS = 10V 2.TC =25˚C 3.RθJC = 2.2 ˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJC = 2.2 ℃/W 3.TJ-TC = P*RthJC(t) 4.RthJC(t) = r(t)*RthJC -ID , Drain Current(A) Power(W)