PE527BA NIKOSEM | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
- Pb−Free, Halogen Free and RoHS compliant.
- Low RDS(on) to Minimize Conduction Losses.
- Ohmic Region Good RDS(on) Ratio.
- Optimized Gate Charge to Minimize Switching Losses.
Applications
- Protection Circuits Applications.
- Logic/Load Switch Circuits Applications. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS -30 V Gate-Source Voltage VGS ±25 V Continuous Drain Current4 TC = 25 °C ID -38 A TC = 100 °C -24 TA = 25 °C -10 TA = 70 °C -8 Pulsed Drain Current1 IDM -67 Avalanche Current IAS -26 Avalanche Energy L = 0.1mH EAS 33.8 mJ Power Dissipation3 TC = 25 °C PD W TC = 100 °C 14 TA = 25 °C 2.4 TA = 70 °C 1.5 Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C PRODUCT SUMMARY V(BR)DSS RDS(ON) ID -30V 14mΩ -38A G. GATE D. DRAIN S. SOURCE
P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.0 K-39-5 PE527BA PDFN 3x3P Halogen-free & Lead-Free NIKO-SEM THERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient2 t ≦10s RJA 52 °C / W Junction-to-Ambient2 Steady-State RJA 87 Junction-to-Case Steady-State RJC 3.5 1Pulse width limited by maximum junction temperature. 2The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. 3The Power dissipation is based on RJA t ≦10s value. 4Package limitation current is 33A. ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted) PARAMETER SYMBOL TEST CONDITIONS LIMITS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = -250A -30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250A -1.1 -1.6 -2.1 Gate-Body Leakage IGSS VDS = 0V, VGS = ±25V ±100 nA Zero Gate Voltage Drain Current IDSS VDS = -30V, VGS = 0V -1 VDS = -30V, VGS = 0V, TJ = 55 °C -10 Drain-Source On-State Resistance1 RDS(ON) VGS = -4.5V, ID = -9A 15.3 22 mΩ VGS = -10V, ID = -9.5A 9.8 14 Forward Transconductance1 gfs VDS = -10V, ID = -9.5A 25 S DYNAMIC Input Capacitance Ciss VGS = 0V, VDS = -15V, f = 1MHz 1579 pF Output Capacitance Coss 248 Reverse Transfer Capacitance Crss 189 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 3.7 Ω Total Gate Charge2 Qg(VGS=-10V) VDS = -15V , ID = -9.5A nC Qg(VGS=-4.5V) 16 Gate-Source Charge2 Qgs 3.8 Gate-Drain Charge2 Qgd 7.2
P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.0 K-39-5 PE527BA PDFN 3x3P Halogen-free & Lead-Free NIKO-SEM Turn-On Delay Time2 td(on) VDD = -15V ID -9.5A, VGS = -10V, RGEN = 6Ω 8.6 nS Rise Time2 tr 47 Turn-Off Delay Time2 td(off) 54 Fall Time2 tf 79 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS -29 A Forward Voltage1 VSD IF = -9.5A, VGS = 0V -1.2 V Reverse Recovery Time trr IF=-9.5A, dI/dt=100A/μs 12 nS Reverse Recovery Charge Qrr 4 nC 1Pulse test : Pulse Width 300 sec, Duty Cycle 2％. 2Independent of operating temperature.
P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.0 K-39-5 PE527BA PDFN 3x3P Halogen-free & Lead-Free NIKO-SEM Output Characteristics Transfer Characteristics -VGS, Gate-To-Source Voltage(V) -VDS, Drain-To-Source Voltage(V) Capacitance Characteristic C , Capacitance(pF) -VDS, Drain-To-Source Voltage(V) Gate charge Characteristics Characteristics -VGS , Gate-To-Source Voltage(V) Qg , Total Gate Charge(nC) On-Resistance VS Drain Current RDS(ON)ON-Resistance(OHM) -ID , Drain-To-Source Current(A) On-Resistance VS Gate-To-Source Voltage RDS(ON)ON-Resistance(OHM) -VGS, Gate-To-Source Voltage(V) 25℃ 125℃ -20℃ 0 1 2 3 4 5 0 1 2 3 4 5 VGS=-10V VGS=-9V VGS=-8V VGS=-7V VGS=-6V VGS=-5V VGS=-4.5V VGS=-2.9V VGS=-3.1V VGS=-3.3V VGS=-2.7V CISS COSS CRSS 200 400 600 800 1000 1200 1400 1600 1800 2000 0 5 10 15 20 25 30 0 7 14 21 28 35 VDS=-15V ID=-9.5A 0.01 0.02 0.03 0.04 0.05 0 3 6 9 12 15 VGS=-10V VGS=-4.5V 0.02 0.04 0.06 0.08 2 4 6 8 10 ID=-9.5A -ID, Drain-To-Source Current(A) -ID, Drain-To-Source Current(A)
P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.0 K-39-5 PE527BA PDFN 3x3P Halogen-free & Lead-Free NIKO-SEM Normalized Drain to Source ON-Resistance TJ , Junction Temperature(˚C) Source-Drain Diode Forward Voltage -IS , Source Current(A) Safe Operating Area Single Pulse Maximum Power Dissipation -ID , Drain Current(A) Single Pulse Time(s) -VDS, Drain-To-Source Voltage(V) T1 , Square Wave Pulse Duration(sec) -VSD, Source-To-Drain Voltage(V) On-Resistance VS Temperature 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 VGS=-10V ID=-9.5A 150℃ 25℃ 0.1 100 0.001 0.01 0.1 1 10 100 Single Pulse RθJA = 87 ˚C/W TA = 25˚C DC 100ms 10ms 1ms 0.01 0.1 100 0.1 1 10 100 NOTE : 1.VGS = -10V 2.TA =25˚C 3.RθJA = 87 ˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJA = 87 ℃/W 3.TJ-TA = P*RthJA(t) 4.RthJA(t) = r(t)*RthJA Power(W) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance
P-Channel Logic Level Enhancement Mode Field Effect Transistor REV 1.0 K-39-5 PE527BA PDFN 3x3P Halogen-free & Lead-Free NIKO-SEM Safe Operating Area Single Pulse Maximum Power Dissipation -ID , Drain Current(A) Single Pulse Time(s) -VDS, Drain-To-Source Voltage(V) T1 , Square Wave Pulse Duration(sec) 100 200 300 400 500 0.001 0.01 0.1 1 10 100 Single Pulse RθJC = 3.5 ˚C/W TC = 25˚C DC 100ms 10ms 1ms 100 0.1 1 10 100 NOTE : 1.VGS = -10V 2.TC =25˚C 3.RθJC = 3.5 ˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJC = 3.5 ℃/W 3.TJ-TC = P*RthJC(t) 4.RthJC(t) = r(t)*RthJC Power(W) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance