PC506BA NIKOSEM | Alldatasheet

Document overview

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Technical content

Features

  • Pb−Free, Halogen Free and RoHS compliant.
  • Low RDS(on) to Minimize Conduction Losses.
  • Ohmic Region Good RDS(on) Ratio.
  • Optimized Gate Charge to Minimize Switching Losses.

Applications

  • Protection Circuits Applications.
  • Logic/Load Switch Circuits Applications. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Gate-Source Voltage VGS ±20 V Continuous Drain Current TA = 25 °C ID 5.5 A TA = 70 °C 4.4 Pulsed Drain Current1 IDM 20 Avalanche Current IAS 12.4 Avalanche Energy L = 0.1mH EAS 7.7 mJ Power Dissipation3 TA = 25 °C PD W TA = 70 °C 2 Operating Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C THERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Ambient2 t ≦10s RJA 40 °C / W Junction-to-Ambient2 Steady-State RJA 64 Junction-to-Case RJc 14 1Pulse width limited by maximum junction temperature. 2The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. 3The Power dissipation is based on RJA t ≦10s value. 1. GATE 2. DRAIN 3. SOURCE PRODUCT SUMMARY V(BR)DSS RDS(ON) ID 30V 60mΩ 5.5A G D S

REV1.0 G-14-2 NIKO-SEM N-Channel Enhancement Mode Field Effect Transistor PC506BA SOT-89 Halogen-Free & Lead-Free ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted) PARAMETER SYMBOL TEST CONDITIONS LIMITS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250A 30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 0.8 1.6 2.5 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±100 nA Zero Gate Voltage Drain Current IDSS VDS = 24V, VGS = 0V 1 VDS = 24V, VGS = 0V, TJ = 55 °C 10 Drain-Source On-State Resistance1 RDS(ON) VGS = 4.5V, ID = 1.5A 61 100 mΩ VGS = 10V, ID = 3A 42 60 Forward Transconductance1 gfs VDS = 5V, ID = 3A 6 S DYNAMIC Input Capacitance Ciss VGS = 0V, VDS = 15V, f = 1MHz 243 pF Output Capacitance Coss 46 Reverse Transfer Capacitance Crss 30 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 2 Ω Total Gate Charge2 Qg(VGS=10V) VDS = 15V, ID = 3A 5.4 nC Qg(VGS=4.5V) 3.1 Gate-Source Charge2 Qgs 0.8 Gate-Drain Charge2 Qgd 1.6 Turn-On Delay Time2 td(on) VDS = 15V ID  3A, VGS = 10V, RGS = 6Ω nS Rise Time2 tr 21 Turn-Off Delay Time2 td(off) 18 Fall Time2 tf 3 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 2 A Forward Voltage1 VSD IF = 3A, VGS = 0V 1.5 V Reverse Recovery Time trr IF = 3A, dI/dt = 100 A/μs 11 nS Reverse Recovery Charge Qrr 3 nC 1Pulse test : Pulse Width  300 sec, Duty Cycle  2％. 2Independent of operating temperature.

REV1.0 G-14-2 NIKO-SEM N-Channel Enhancement Mode Field Effect Transistor PC506BA SOT-89 Halogen-Free & Lead-Free 0 1 2 3 4 5 VGS=10V VGS=9V VGS=8V VGS=7V VGS=6V VGS=5V VGS=4.5V CRSS 100 150 200 250 300 0 5 10 15 20 25 30 CISS COSS 0 2 4 6 8 10 VDS=15V ID=3A 0 1 2 3 4 5 On-Resistance VS Gate-To-Source Voltage RDS(ON)ON-Resistance(OHM) On-Resistance VS Drain Current RDS(ON)ON-Resistance(OHM) ID , Drain-To-Source Current(A) VGS, Gate-To-Source Voltage(V) Output Characteristics ID, Drain-To-Source Current(A) Transfer Characteristics ID, Drain-To-Source Current(A) VGS, Gate-To-Source Voltage(V) VDS, Drain-To-Source Voltage(V) Capacitance Characteristic C , Capacitance(pF) VDS, Drain-To-Source Voltage(V) Gate charge Characteristics Characteristics VGS , Gate-To-Source Voltage(V) Qg , Total Gate Charge(nC) 25℃ 125℃ -20℃ 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 2 4 6 8 10 ID=3A 0.00 0.02 0.04 0.06 0.08 0.10 0 2 4 6 8 10 VGS=10V VGS=4.5V

REV1.0 G-14-2 NIKO-SEM N-Channel Enhancement Mode Field Effect Transistor PC506BA SOT-89 Halogen-Free & Lead-Free 25℃ 150℃ 0.1 100 On-Resistance VS Temperature Normalized Drain to Source ON-Resistance TJ , Junction Temperature(˚C) Source-Drain Diode Forward Voltage IS , Source Current(A) Safe Operating Area Single Pulse Maximum Power Dissipation ID , Drain Current(A) Power(W) Single Pulse Time(s) VDS, Drain-To-Source Voltage(V) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance T1 , Square Wave Pulse Duration[sec] VSD, Source-To-Drain Voltage(V) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 VGS=10V ID=3A 0.001 0.01 0.1 1 10 100 Single Pulse RθJA = 64˚C/W TA=25˚C DC 100ms 10ms 1ms 0.01 0.1 100 0.01 0.1 1 10 100 NOTE : 1.VGS= 10V 2.TA=25˚C 3.RθJA = 64˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON) single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJA = 64 ℃/W 3.TJ-TA = P*RthJA(t) 4.RthJA(t) = r(t)*RthJA