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5000Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 8-Pin Package Machine Insertable, Wave Solderable Surface Mount, Tape & Reel Versions Available Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls e3Pb Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD tontoff + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Approvals UL Recognized Component: File E76270 CSA Certified Component: Certificate 1175739 EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 PBB190 is a dual single-pole, normally closed (1-Form-B) solid state relay with two independently controlled switches that use optically coupled MOSFET technology to provide 5000V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package.
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R02 PBB190 Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Ratings Units Blocking Voltage 400 V P Reverse Input Voltage 5 V LED Forward Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output (60 Seconds) 5000 V rms ESD Rating, Human Body Model 8 kV Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current 1 Continuous I F=0mA IL - - 130 mA rms / mADC Peak I F=0mA, t=10ms - - ±400 mA P On-Resistance 2 IF=0mA, IL=130mA R ON --2 5 Off-State Leakage Current I F=2mA, VL=400VP ILEAK -- 1 A Switching Speeds T urn-On I F=5 mA, VL=10V ton -- 1 ms T urn-Off t off - - 2.5 Output Capacitance I F=5mA, VL=50V , f=1MHz C OUT -1 1 - p F Input Characteristics LED Forward Current T o Activate
3 IL=130mA IF
- 0.38 2 mA T o Deactivate - 0.2 0.35 - Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance - C I/O -3 - p F 1 If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is no t exceeded. 2 Measurement taken within 1 second of on-time. 3 For high temperature operation (>60ºC), a LED forward current of 4mA is recommended.
INTEGRATED CIRCUITS DIVISION PBB190 www.ixysic.com 3R02 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * LED Forward Voltage (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) LED Forward Current (mA) Device Count (N) Typical LED Forward Current to Activate (N=50, IL=100mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) Blocking Voltage (VP) 460 465 470 475 480 485 490 495 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=2mA) LED Forward Voltage (V) LED Forward Current (mA) LED Forward Voltage vs. LED Forward Current LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 710 715 720 725 730 735 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (Ps) 1000 2000 3000 4000 5000 6000 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 300 400 500 600 700 800 900 Turn-On Time vs. Temperature (IL=75mA) IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 1000 1500 2000 2500 3000 3500 4000 4500 5000 Turn-Off Time vs. Temperature (IL=75mA) IF=2mA IF=5mA Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA)
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R02 PBB190 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Current (mA) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 LED Forward Current to Activate vs. Temperature (IL=75mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On Resistance (:) On-Resistance vs. Temperature (IF=0mA, IL=75mA) Load Voltage (V) Load Current (A) -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 Typical Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.08 0.09 0.10 0.11 0.12 0.13 0.14 Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 440 445 450 455 460 465 470 475 480 Typical Blocking Voltage vs. Temperature (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (nA) 100 150 200 250 300 350 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (IF=5mA, VL=400V) Load Voltage (V) 0 50 100 150 200 Output Capacitance (pF) 100 120 140 Output Capacitance vs. Load Voltage (IF=5mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.0 0.2 0.4 0.6 0.8 1.0 Energy Rating Curve
INTEGRATED CIRCUITS DIVISION PBB190 www.ixysic.com 5R02 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PBB190 / PBB190S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PBB190 / PBB190S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R02 PBB190 PBB190 PBB190S Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP . (0.285) 7.620 ± 0.254 (0.300 ± 0.010)
4.064 TYP
(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION Specification: DS-PBB190-R02 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com PBB190 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Dimensions mm (inches) User Direction of Feed NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1 =4.20 (0.165) 0 K =4.90 (0.193) P=12.00 (0.472) W=16.00 (0.63)Bo=10.30 (0.406) Ao=10.30 (0.406) PBB190STR Tape & Reel