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REV 0.9 C-49-2 N-Channel Enhancement Mode Field Effect Transistor P3710BTF TO-220F Halogen-Free & Lead-Free NIKO-SEM 231 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted) PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage V DS 100 V Gate-Source Voltage V GS ±20 V Continuous Drain Current TC = 25 °C ID A TC = 100 °C 12 Pulsed Drain Current1 I DM 75 Avalanche Current I AS 15.3 Avalanche Energy2 E AS 117 mJ Power Dissipation TC = 25 °C PD 31 W TC = 100 °C 12.5 Junction & Storage Temperature Range T J, Tstg -55 to 150 °C THERMAL RESISTANCE RATINGS THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RJC 4 °C / W 1Pulse width limited by maximum junction temperature. 2Starting Tj =25 °C,L=1mH,VDD=50V ELECTRICAL CHARACTERISTICS (T J = 25 °C, Unless Otherwise Noted) PARAMETER SYMBOL TEST CONDITIONS LIMITS UNITMIN TYP MAX STATIC Drain-Source Breakdown Voltage V (BR)DSS VGS = 0V, ID = 250A 100 V Gate Threshold Voltage V GS(th) VDS = VGS, ID = 250A 1 1.8 3 Gate-Body Leakage I GSS V DS = 0V, VGS = ±20V ±100 nA Zero Gate Voltage Drain Current I DSS VDS = 80V, VGS = 0V 1 VDS=80V, VGS=0V, TJ=125 °C 10 Drain-Source On-State Resistance1 RDS(ON) VGS = 4.5V, ID = 10A 30 48 mΩ VGS = 10V, ID = 10A 27 37 mΩ Forward Transconductance1 g fs V DS = 10V, ID = 10A 35 S 1. GATE 2. DRAIN 3. SOURCE PRODUCT SUMMARY V(BR)DSS R DS(ON) I D 100V 37mΩ 19A G D S

REV 0.9 C-49-2 N-Channel Enhancement Mode Field Effect Transistor P3710BTF TO-220F Halogen-Free & Lead-Free NIKO-SEM DYNAMIC Input Capacitance C iss VGS = 0V, VDS = 25V, f = 1MHz 1070 pF Output Capacitance C oss 146 Reverse Transfer Capacitance C rss 59 Total Gate Charge2 Q g VDS = 50V, ID = 10A VGS = 10V nC Gate-Source Charge2 Q gs 3.7 Gate-Drain Charge2 Q gd 8.8 Turn-On Delay Time2 t d(on) 30 nS Rise Time2 t r V DD = 50V 21 Turn-Off Delay Time2 td(off) ID  10A, VGS = 10V, RGS = 6Ω 45 Fall Time2 t f 21 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 19 A Forward Voltage1 VSD I F = 10A, VGS = 0V 1.2 V Reverse Recovery Time trr IF = 10A, dlF/dt = 100A / S 39 nS Reverse Recovery Charge Qrr 55 nC 1Pulse test : Pulse Width  300 sec, Duty Cycle  2％. 2Independent of operating temperature.

REV 0.9 C-49-2 N-Channel Enhancement Mode Field Effect Transistor P3710BTF TO-220F Halogen-Free & Lead-Free NIKO-SEM TJ , Junction Temperature(˚C) Capacitance Characteristic VDS, Drain-To-Source Voltage(V) Qg , Total Gate Charge(nC) Source-Drain Diode Forward Voltage VSD, Source-To-Drain Voltage(V) On-Resistance VS Temperature Output Characteristics ID, Drain-To-Source Current(A) Transfer Characteristics ID, Drain-To-Source Current(A) VGS, Gate-To-Source Voltage(V) VDS, Drain-To-Source Voltage(V) Normalized Drain to Source ON-Resistance C , Capacitance(pF) Gate charge Characteristics VGS , Gate-To-Source Voltage(V) IS , Source Current(A) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -50 -25 0 25 50 75 100 125 150 VGS=10V ID=10A CISS COSS CRSS 200 400 600 800 1000 1200 1400 0 5 10 15 20 25 30 0 5 10 15 20 25 VDS=50V ID=10A 012345 VGS=10V VGS=9V VGS=8V VGS=7V VGS=6V VGS=5V VGS=4.5V VGS=3V VGS=3.5V 012345 25℃150℃ 0.1 100 25℃ 125℃ -20℃

REV 0.9 C-49-2 N-Channel Enhancement Mode Field Effect Transistor P3710BTF TO-220F Halogen-Free & Lead-Free NIKO-SEM Safe Operating Area Single Pulse Maximum Power Dissipation Single Pulse Time(s) VDS, Drain-To-Source Voltage(V) Transient Thermal Response Curve r(t) , Normalized Effective Transient Thermal Resistance T1 , Square Wave Pulse Duration[sec] ID , Drain Current(A) Power(W) single pulse Duty cycle=0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 Notes 1.Duty cycle, D= t1 / t2 2.RthJC = 4 ℃/W 3.TJ-TC = P*RthJC(t) 4.RthJC(t) = r(t)*RthJC 100 150 200 250 0.001 0.01 0.1 1 10 100 Single Pulse RθJC = 4˚C/W TC=25˚C DC 100ms 10ms 1ms 0.1 100 1 10 100 NOTE : 1.VGS= 10V 2.TC=25˚C 3.RθJC = 4˚C/W 4.Single Pulse Operation in This Area is Limited by RDS(ON)