E15155-006 INTEL | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 52
Technical content
Intel® Modular Server System MFSYS25/MFSYS35 Technical Product Specification Intel order number E15155-006 Revision 1.3 November, 2008 Enterprise Platforms and Services Division
Revision History
July, 2007 0.88 Initial release. September, 2007 1.0 Updated. February, 2008 1.1 Updated. June, 2008 1.2 Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive bay information for the Intel® Modular Server System MFSYS35. November, 2008 1.3 Updated System Details, power and heat specifications Disclaimers Information in this document is provided in connection with Intel ® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or impli ed warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applic ations. Intel may make c hanges to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteri stics of any features or instructions marked “reserved” inches or “undefined” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Modular Server System MFSYS25/MFSYS35 may contain design defects or errors known as errata, which may cause the product to deviate fr om published specifications . Current characterized errata are available on request. Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of t hese components when the fully integr ated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating par ameters to determine the amount of airflow required for their specific application and environm ental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the proper ty of others. Copyright © Intel Corporation 2007- 2008 ii Revision 1.3 Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Table of Contents Table of Contents Revision 1.3 Intel order number E15155-005 iii
Table of Contents Intel® Modular Server System MFSYS25/MFSYS35 TPS iv Revision 1.3 Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Overview 1. Product Overview This product specification details the features of the Intel® Modular Server System MFSYS25/MFSYS35. This product is designed to serve the small to medium business environment. Primary design considerations include ease of use, reliability, low cost, modularity, and remote management. The Intel® Modular Server System MFSYS25/MFSYS35 supports up to six dual-processor compute modules, or a total of 12 Multi-Core Intel® Xeon® 5000 sequence processors. The chassis also incorporates features that clearly distinguish it as an easy-to-use and highly available server platform. Building on previous server platforms, the Intel ® Modular Server System MFSYS25/MFSYS35 includes redundant storage and networking, in addition to the enterprise features of hot-swap power, cooling, and hard disk drives. Advanced server management features remotely monitor and manage the server. This document is organized into four sections: Section 1: Product Overview This section provides an overview of the product. Section 2: System Overview This section provides an overview of the system hardware. Section 3: System Details This section provides details of the various hardware components specific to the server platform. Section 4: Product Regulatory Requirements This section describes system compliance to regulatory specifications. Revision 1.3 Intel order number E15155-005
2.1 Introduction
mounted in a pedestal configuration. Table 1. Server Platform Feature List drives in the Intel® Modular Server System MFSYS35. status LEDs that allow local monitoring and managing of the individual compute module.
- I/O module cooling
- Hard drives and power supplies
- Compute modules Each cooling zone contains dedicated hot-swap fan modules. Each fan module contains a status LED to indicate a fan failure. The front- and rear-accessible fan modules connect directly to the system midplane board. Easy to use Full system management via Web browser Configuration wizards assist in setup of storage and network
Figure 1. Intel® Modular Server System MFSYS25 Wiring Diagram
Figure 2. Intel® Modular Server System MFSYS35 Wiring Diagram
2.2 External Chassis Features – Front
Figure 3 shows the front view of the platform with all modules populated. Figure 3. Front View of Server Platform
System Overview Intel® Modular Server System MFSYS25/MFSYS35 TPS
2.2.1 Compute Module
The Intel® Modular Server System MFSYS25/MFSYS35 supports up to six compute modules. Each of these general-purpose servers provides the following minimum features: Processor(s) Memory Integrated Baseboard management controller Network interface Each server connects to the chassis management module, storage controllers and switch modules via the midplane board. The midplane also distributes the 12V power from the power supplies to the compute modules. The servers connect to the shared storage (14 SAS drives in the Intel ® Modular Server System MFSYS25 and 6 SAS/SATA drives in the Intel® Modular Server System MFSYS35) via the storage controller(s) in the rear of the chassis. See the individual Intel® Compute Module Technical Product Specification for model-specific information about your compute module(s).
2.2.2 Storage Enclosure
The Intel® Modular Server System MFSYS25/MFSYS35 supports an optional hard disk drive storage enclosure and has the following minimum features: Bays for 14 hot-swap 2.5-inch SAS hard disk drives in the Intel® Modular Server System MFSYS25 and six (6) 3.5-inch SAS/SATA hard drives in the Intel® Modular Server System MFSYS35 At least one storage controller in an I/O slot Because hard disk drives have different cooling, power, and vibration characteristics, Intel validates specific hard disk drive types in the platforms. See the Intel ® Modular Server System MFSYS25/MFSYS35 Tested Hardware and Operating System List for a list of qualified drives.
2.2.3 I/O Cooling Module
The I/O cooling module consists of six fans that operate in a (3 + 3) cooling redundancy in a hot-swap module with power and failure indicators. These fans provide cooling for all I/O modules. This module is accessible from the front of the system even though it cools the I/O modules in the rear of the system. 6 Revision 1.3 Intel order number E15155-005
2.3 External Chassis Features – Rear
The following figure shows the rear view of the platform with all modules populated. Figure 4. Rear View of Server Platform
2.3.1 Power Supply Module
See Section 3.8 for more details on the power supply module.
2.3.2 I/O Slots
following sections for a description of the two I/O modules currently offered.
2.3.2.1 Ethernet Switch Module
module allowing network redundancy.
System Overview Intel® Modular Server System MFSYS25/MFSYS35 TPS See Section 3.6 for a description of this module.
2.3.2.2 Storage Controller Module
The chassis can accommodate up to two hot-swap storage controller modules to support the external hard disks in the front storage enclosure. One storage controller is the minimum configuration, with a second storage controller allowing storage controller redundancy. Storage controller failures are automatically detected and hard drive access is maintained through the operational storage controller. See Section 3.7 for a description of this system.
2.3.3 Chassis Management Module
The chassis management module, installed in the middle-rear of the chassis amid the four I/O slots, provides an Internet browser interface that allows for configuration and management of the entire Intel ® Modular Server System MFSYS25/MFSYS35. This module is not redundant, but the system continues to operate normally should this module fail although any changes to the system configuration cannot be made until the failed chassis management module is replaced. See Section 3.5 for a description of this module.
2.3.4 Main Cooling Module
Two hot-swap cooling modules are installed on the left rear of the chassis. Each cooling module contains two redundant fans that operate in a (1+1) cooling redundancy. Cooling module 1 cools compute modules 1-3; cooling module 2 cools compute modules 4-6.
2.4 Internal Chassis Features
The following figures provide an internal view of how the Intel® Modular Server System MFSYS25/MFSYS35 system boards are connected. 8 Revision 1.3 Intel order number E15155-005
Figure 5. View of Intel® Modular Server System MFSYS25 System Board Connectivity
Figure 6. View of Intel® Modular Server System MFSYS35 System Board Connectivity
2.4.1 Midplane Board
active components on this board.
Intel® Modular Server System MFSYS25/MFSYS35 TPS System Overview
2.4.2 Storage Interposer Board
The interposer board mounts vertically in the front left of the system and connects the midplane to the hot-swap backplane in the storage enclosure. Each compute module connects to the storage controller with a non-RAID SAS controller, with the storage controller providing the RAID functionality.
2.5 Mounting and Service Features
2.5.1 Chassis
The platform utilizes a standard 19-inch EIA chassis, 6U high by 28 inches deep. The chassis can be rack-mounted or used as a pedestal system. Rack mounting the platform requires a space of 6U high by 19 inches wide by 34 inches deep, with additional six inches required for cable management. When used in a rack, the chassis may be mounted with an optional rail kit. Pedestal operation requires the installation of six rubber feet to the bottom of the chassis. The 6U height is defined by standard EIA rack units, where 1U equals 1.75 inches. The 28-inch depth is measured from the front mounting flange to the back of the I/O slots. This measurement does not include cables or the bezel.
2.5.2 Rails
The platform accommodates rails to mount the chassis into a standard 19-inch rack. The Intel® Modular Server System MFSYS25/MFSYS35 uses fixed rails. All customer-accessible components provide either front or rear access. The rails attach to the rack using a tool-less mechanism. The system rests on the shelves of the rails and attaches to the rack using the integrated thumbscrews on the front flanges of the system. No loose hardware is needed.
2.6 Server Management
The management of all components in the system can be done through the chassis management module. This module provides a browser-based management interface that allows the configuration and management of all modules. As part of the compute module manageability, the chassis management module provides remote access (such as connectivity via Ethernet) to Keyboard-VDU-Mouse (KVM), USB media and serial console. The management subsystem conforms to the IPMI v2.0 Specification for communication within the chassis (such as between the chassis management module and other system components). SNMP is supported by the chassis management module for external system management. Revision 1.3 Intel order number E15155-005
7 Busses
5 Used w/ SMB
Figure 7. Server Management Connectivity
2.6.1 Chassis Management Module
to manage the system over Ethernet. See Section 3.5 for a description of this board.
2.6.2 Compute Module Management
management before providing any of these management features.
Intel® Modular Server System MFSYS25/MFSYS35 TPS System Overview
2.7 Reliability, Availability, Serviceability, Usability, Manageability
(RASUM) The platform supports the following reliability, availability, serviceability, usability and manageability (RASUM) features: Reliability features Voltage and temperature monitoring throughout the system Availability features Hot-plug compute modules Hot-spare compute modules Redundant hot-swap power supply modules Redundant hot-swap system fans Hot-swap SAS hard drives Optional teaming and failover Ethernet ports Serviceability features Tool-less installation and removal of major sub-assemblies Color-coded parts to identify serviceable components Green: To identify hot-swap or hot-plug components Blue: To identify non-hot-swap components Compute module ID buttons and LEDs LED indicators for system health, configured options, and activity Usability features Tool-less design features External access to hot-swap hard disk drives, power supplies, LEDs and switches Front viewable compute module ID LEDs Color-coded parts to identify hot-swap and non-hot-swap serviceable components Manageability features Remote management via serial and LAN IPMI 2.0 compliance Remote management via KVM and dedicated LAN All subsystems are connected by a server management I2C bus to satisfy the system RASUM requirements. Revision 1.3 Intel order number E15155-005
3.1 Specifications
3.1.1 Environmental Specifications Summary
Table 2. Environmental Specifications Summary
3.1.2 Physical Specifications Summary
Table 3. Physical Specifications of Chassis MFSYS25/MFSYS35 and all components.
Table 4. Physical Dimensions of Hardware Components
3.1.3 Power Specifications Summary
Modular Server System MFSYS25/MFSYS35. Table 5. Power Budget of Hardware Components Intel® Modular Server System MFSYS25/MFSYS35. Table 6. Power and Heat Dissipation Specifications of Chassis
3.2 Chassis
technologies become available. the empty compute module bay area. Figure 8. Front View of Empty Intel® Modular Server System MFSYS25
Figure 9. Front View of Empty Intel® Modular Server System MFSYS35
3.3 Midplane Board
3.3.1 Mechanical Outline
The following figure shows the mechanical outline drawing of the platform’s midplane board. Figure 12. Midplane Board Mechanical Outline (Front View)
This section contains perspective views of the midplane board. Figure 13. Front View of Midplane Board
Figure 14. Rear View of Midplane Board
3.4 Compute Module
Compute Module MFS5000SI Technical Product Specification for additional details.
3.4.1 Introduction
updated more often than other components in the system.
3.4.2 Drawings
This section contains perspective views of the compute module. The following figure shows the front view of the module. Figure 15. Front View of Compute Module
3.5 Chassis Management Module
3.5.1 Introduction
® Ethernet Switch Module(s), and indirectly to the compute modules. expansion among other functionality.
3.5.2 Mechanical Outline
Figure 16. Chassis Management Module Board Outline (Top View)
3.5.3 Block Diagram
Figure 17. Chassis Management Module Block Diagram
3.5.4 Drawings
The following figure shows the front view of the CMM.
Figure 18. Front View of Chassis Management Module
3.5.5 Architectural Overview
® Modular Server System MFSYS25/MFSYS35. application. Through the GUI, the customer can configure and manage any system component. poll and retrieve the present status of the platform.
versions stored in the SD (secure digital) card on the midplane.
3.6 Ethernet Switch Module
3.6.1 Introduction
compute modules and for the compute modules to an external network.
3.6.2 Mechanical Outline
The following figure shows the mechanical outline of the ESM. Figure 19. Ethernet Switch Module Mechanical Outline (Top View)
3.6.3 Block Diagram
Figure 20. Ethernet Switch Module Block Diagram
3.6.4 Architectural Overview
module is capable of accessing up to two ESMs via point-to-point links across the midplane. configure and control the ESM).
3.7 Storage Controller Module
3.7.1 Storage Subsystem Introduction
3.7.2 Mechanical Outline
Figure 21. Mechanical Outline of Storage Controller Module Board
3.7.3 Storage Controller Module View
Figure 22. Front View of Storage Controller Module
3.7.4 Architectural Overview
3.7.4.1 Storage Controller Module Interface
expanders, which are connected via I²C to these devices. RAID status LED is also sent via SES and exported to a single LED. Expander firmware can be downloaded from the SCM.
3.7.4.2 Interposer Card Functionality
System Details Intel® Modular Server System MFSYS25/MFSYS35 TPS 12 V bulk power is provided by the midplane. The Interposer has a power converter function for internal needs, and also supplies the disk drive power (12 V boost may be required). The VPD SEEPROM contains a WW (World Wide) unique address which the SCM uses to derive a SAS WWN (World Wide Name). It also contains manufacturing data, such as serial and version numbers for the Interposer. Hardware monitoring on the Interposer includes a temperature sensor. The data is passed back to the SCM via expander SES pages. Disk drive status LEDs are driven by expander GPIO signals, and collaboration logic must be present on the Interposer since either SCM (and either expander) can drive the status LEDs.
3.7.4.3 Drive Backplane Interface
The Interposer converts bulk 12 V from the midplane to provide +5 V and +12 V for disk drive power. Sufficient current is supplied for sequenced spin-up of drives in groups of 4-4-2-2-2 (for 2.5-inch configurations). Supported drive types include 15K RPM SAS drives. Signals are provided for single-color status LEDs for each disk drive. An expander sourced I²C bus is connected to the drive backplane IDROM. Expanders send appropriate command/signal to an optional SATA active/active MUX dongle card on disk drive carriers to control 5 V and 12 V power.
3.8 Power Supply Module
The power supply module in Intel® Modular Server System MFSYS25/MFSYS35 is a 1000-W DC output supply with 110-240V AC input. Each power supply includes two fans that provide cooling for optional hot-swap disk drives. The power subsystem is configured as follows: With four power supply modules installed, a fully configured system has (3+1) power redundancy. With three power supply modules installed, a fully configured system would not have redundant power. Three power supply modules are capable of handling the maximum power requirements for fully configured platforms, which includes six compute modules, 192 GB of memory, two storage controllers, two Ethernet switch modules, one chassis management module, and fourteen hot- swap 2.5-inch hard disk drives or six hot-swap 3.5-inch hard disk drives. When four power supply modules are installed, the user can replace a failed power supply module without affecting system functionality. Power supplies have two LEDs to identify failure, power good and AC OK. The power subsystem receives AC power through four power cords. Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS System Details Note: The total power requirement for the platforms exceeds the 240 VA energy hazard limits that define an operator accessible area. As a result, only qualified technical individuals should access the processor and non-hot-plug I/O areas while the system is energized. Power cords should be removed from the system before accessing non-hot-plug areas.
3.9 Jumpers and LEDs
The compute module is the only module with jumper headers. Refer to the Intel® Compute Module MFS5000SI Technical Product Specification for details on the function and location of the server jumpers. Revision 1.3 Intel order number E15155-005
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS Intel order number E15155-005 4. Product Regulatory Requirements
4.1 Product Regulatory Compliance
The Server Chassis product, when correctly integrated per this document, complies with the following safety, electromagnetic compatibility (EMC, and Product Ecology regulations and requirements. Intended Application - This product was evaluated as Information Technology Equipment (ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.
4.1.1 Product Safety Compliance
UL60950 - CSA 60950(USA / Canada) EN60950 (Europe) IEC60950 (International) CB Certificate & Report, IEC60950 (report to include all country national deviations) GS Certification (Germany) GOST R 50377-92 - Certification (Russia) Belarus Certification (Belarus) Ukraine Certification (Ukraine) CE - Low Voltage Directive 73/23/EEE (Europe) IRAM Certification (Argentina) GB4943- CNCA Certification (China)
4.1.2 Product EMC Compliance - Class A Compliance
FCC /ICES-003 - Emissions (USA/Canada) Verification CISPR 22 - Emissions (International) EN55022 - Emissions (Europe) EN55024 - Immunity (Europe) EN61000-3-2 - Harmonics (Europe) EN61000-3-3 - Voltage Flicker (Europe) CE - EMC Directive 89/336/EEC (Europe) VCCI Emissions (Japan) AS/NZS 3548 Emissions (Australia / New Zealand) BSMI CNS13438 Emissions (Taiwan) GOST R 29216-91 Emissions (Russia) GOST R 50628-95 Immunity (Russia) Belarus Certification (Belarus) Ukraine Certification (Ukraine) KCC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea) GB 9254 - CNCA Certification (China) GB 17625 - (Harmonics) CNCA Certification (China)
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Regulatory Requirements Revision 1.3 Intel order number E15155-005
4.1.3 Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world wide regulatory requirements. A Material Declaration Data Sheet is available for Intel products. For more reference on material restrictions and compliance you can view Intel's Environmental Product Content Specification at http://supplier.intel.com/ehs/environmental.htm. Europe - European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS) Threshold limits and banned substances are noted below. Quantity limit of 0.1% by mass (1000 PPM) for: Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers (PBB/PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium California Code of Regulations, Title 22, Division 4.5, Chapter 33: Best Management Practices for Perchlorate Materials China - Restriction of Hazardous Substances (China RoHS) WEEE Directive (Europe) Packaging Directive (Europe)
4.1.4 Certifications / Registrations / Declarations
UL Certification (US/Canada) CE Declaration of Conformity (CENELEC Europe) FCC/ICES-003 Class A Attestation (USA/Canada) VCCI Certification (Japan) C-Tick Declaration of Conformity (Australia) MED Declaration of Conformity (New Zealand) BSMI Certification (Taiwan) GOST R Certification / License (Russia) Belarus Certification / License (Belarus) KCC Certification (Korea) IRAM Certification (Argentina) CNCA Certification (China) Ecology Declaration (International) China RoHS Environmental Friendly Use Period Packaging & Product Recycling Marks
4.2 Product Regulatory Compliance Markings
This Intel Server Chassis product is provided with the following regulatory and safety markings. In the event there is no room for a marking(s) on the chassis, the information is provided here in this document.
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS Requirement Country Marking cULus Listing Marks USA/Canada GS Mark Germany CE Mark Europe FCC Marking (Class A) USA EMC Marking (Class A) Canada VCCI Marking (Class A) Japan Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Regulatory Requirements Revision 1.3 Requirement Country Marking BSMI Certification & Class A Warning Taiwan GOST R Marking Russia KCC Mark Korea Note: The following is the former Korean EMC mark and is seen on older Intel products. KCC Mark Korea Note: The following symbol is the new Korean EMC mark and is seen on newer Intel products. China Compulsory Certification Mark China 于符合中国《子信息品染控制管理法》的声明 Management Methods on Control of Pollution from Electronic Information Products (China RoHS declaration) 品中有毒有害物.的名称及含量 部件名称 (Parts) 有毒有害物.或元素 Intel order number E15155-005
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS Requirement Country Marking 金属部件 (Metal Parts) 印刷板.件 (Printed Board Assemblies (PBA)) 限量要求以下。 Indicates that this hazardous substance contained in all homogeneous materials of this part is below the limit requirement in SJ/T 11363-2006. .定的限量要求。 Indicates that this hazardous substance contained in at least one of the homogeneous materials of this part is above the limit requirement in SJ/T 11363-2006. 所售.品中可能'也可能'会含有所有所列的部件 This table shows where these substances may be found in the supply chain of our electronic information products, as of the date of sale of the enclosed product. Note that some of the component types listed above may or may not be a part of the enclosed product. Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Regulatory Requirements Revision 1.3 Requirement Country Marking Belarus Belarus Safety Compliance Mark Waste of Electronic and Electrical Equipment Recycling Mark Europe China Restriction of Hazardous Substance Environmental Friendly Use Period Mark China China Recycling Mark China Recycling Marks International Battery Perchlorate Warning Information California Perchlorate Material - Special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate This notice is required by California Code of Regulations, Title 22, Division 4.5, and Chapter 33: Best Management Practices for Perchlorate Materials. This product may include a battery which contains Perchlorate material. Intel order number E15155-005
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS Requirement Country Marking Safety Multiple Power Cord Marking This unit has more than one power supply cord. To reduce the risk of electrical shock, disconnect (2) two power supply cords before servicing. Simplified Chinese: Traditional Chinese: German: Dieses GerŠte hat mehr als ein Stromkabel. Um eine Gefahr des elektrischen Schlages zu verringern trennen sie beide (2) Stromkabeln bevor Instandhaltung. Nordic Countries Connection to Proper Ground Outlet "WARNING:" "Apparaten skall anslutas till jordat uttag, nŠr den ansluts till ett nŠtverk." "Laite on liitettŠvä suojamaadoituskoskettimilla varustettuun pistorasiaan." "Connect only to a properly earth grounded outlet." Safety Standyby power
4.3 Regulated Specified Components
To maintain the UL listing and compliance to other regulatory certifications and/or declarations, the following regulated components must be used and conditions adhered to. Interchanging or use of other component will void the UL listing and other product certifications and approvals. You can find updated product information for configurations on the Intel Server Builder Web site at the following URL: http://channel.intel.com/go/serverbuilder If you do not have access to Intel’s Web address, contact your local Intel representative. 1. Server Chassis: Base chassis is provided with power supply and fans—UL listed. 2. Server board: You must use an Intel server board—UL recognized. Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Regulatory Requirements Revision 1.3 Intel order number E15155-005 3. Add-in Boards: Must have a printed wiring board flammability rating of minimum UL94V-1. Add-in boards containing external power connectors and/or lithium batteries must be UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed. In addition, the modem must have the appropriate telecommunications, safety, and EMC approvals for the region in which it is sold. 4. Peripheral Storage Devices: Must be UL recognized or UL listed accessory and TUV or VDE licensed. Maximum power rating of any one device is 19 watts. Total server configuration is not to exceed the maximum loading conditions of the power supply.
4.4 Electromagnetic Compatibility Notices
4.4.1 FCC Verification Statement (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Intel Corporation 5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497 Phone: 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product. Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC Class A or B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception. All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS
4.4.2 ICES-003 (Canada)
Cet appareil numŽrique respecte les limites bruits radioŽlectriques applicables aux appareils numŽriques de Classe A prescrites dans la norme sur le matŽriel brouilleur: “Appareils NumŽriques”, NMB-003 ŽdictŽe par le Ministre Canadian des Communications. English translation of the notice above: This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of Communications. Recycle battery in accordance with applicable WEEE and Battery laws. Perchlorate Material - special handling may apply. See: http://www.dtsc.ca.gov/hazardouswaste/perchlorate This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33: Best Management Practices for Perchlorate Materials. This product/part includes a battery which contains perchlorate material.
4.4.3 Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance. Recycle battery in accordance with applicable WEEE and Battery laws. Perchlorate Material - special handling may apply. See: http://www.dtsc.ca.gov/hazardouswaste/perchlorate This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33: Best Management Practices for Perchlorate Materials. This product/part includes a battery which contains perchlorate material. Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Product Regulatory Requirements Revision 1.3
4.4.4 VCCI (Japan)
English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. Recycle battery in accordance with applicable WEEE and Battery laws. Perchlorate Material - special handling may apply. See: http://www.dtsc.ca.gov/hazardouswaste/perchlorate This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33: Best Management Practices for Perchlorate Materials. This product/part includes a battery which contains perchlorate material.
4.4.5 BSMI (Taiwan)
The BSMI Certification Marking and EMC warning is located on the outside rear area of the product. Recycle battery in accordance with applicable WEEE and Battery laws. Intel order number E15155-005
Product Regulatory Requirements Intel® Modular Server System MFSYS25/MFSYS35 TPS Perchlorate Material - special handling may apply. See: http://www.dtsc.ca.gov/hazardouswaste/perchlorate This notice is required by California Code of Regulations, Title 22, Division 4.5, Chapter 33: Best Management Practices for Perchlorate Materials. This product/part includes a battery which contains perchlorate material. Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Glossary Glossary This appendix contains important terms used in the preceding sections. Acronyms are followed by non-acronyms. Word / Acronym Definition ACPI Advanced Configuration and Power Interface BIOS Basic Input / Output System BMC Baseboard Management Controller CE European Conformity (Conformité Européenne) CISPR Special International Committee on Radio Interference (Comité International Spécial des Perturbations Radioélectriques) CMM Chassis Management Module CMOS Complementary Metal-Oxide Semiconductor CSA Canadian Standards Organization DB Data Bus dBA Decibel Acoustic DDR2 Double Data Rate DIMM Dual In-line Memory Module DMA Direct Memory Access ECC Error Checking Code EEPROM Electrically Erasable Programmable Read-Only Memory EMC Electromagnetic Compatibility EMI Electromagnetic Interference EMP Emergency Management Port EPS External Product Specification ESD Electrostatic Discharge ESM Ethernet Switch Module FCC Federal Communications Commission FPGA Field-Programmable Gate Array FRB Fault Resilient Booting FRU Field Replaceable Unit FSB Front Side Bus FWH Firmware Hub GbE Gigabit Ethernet GND Ground GUI Graphical User Interface HDD Hard Disk Drive HL Hub-Link HSC Hot-Swap Controller I/O Input / Output I²C Inter-Integrated Circuit ICMB Intelligent Chassis Management Bus IDE Integrated Device Electronics IEC International Electrotechnical Commission Revision 1.3 Intel order number E15155-005
Glossary Intel® Modular Server System MFSYS25/MFSYS35 TPS Word / Acronym Definition IMB Intelligent Management Bus IPMB Intelligent Platform Management Bus IPMI Intelligent Platform Management Interface ISP In-System Programmable ITE Information Technology Equipment ITP In-Target Probe JTAG Joint Test Action Group KVM Keyboard, VDU, and Mouse LAN Local Area Network LED Light Emitting Diode LPC Low-Pin Count LVDS Low Voltage Differential SCSI NIC Network Interface Card OEM Original Equipment Manufacturer OS Operating System OTP Over-Temperature Protection PCI Peripheral Component Interconnect PDB Power Distribution Board PEF Platform Event Filtering PEP Platform Event Paging PFC Power Factor Correction PIROM Processor Information Read-Only Memory PLD Programmable Logic Device PSM Power Supply Module PSU Power Supply Unit PWM Pulse Width Modulator RAID Redundant Array of Independent Disks RAS Reliability, Availability, and Serviceability RASUM Reliability, Availability, Serviceability, Usability, and Manageability ROMB RAID On Motherboard RPM Revolutions Per Minute RoHS Restriction of Hazardous Substances SAF-TE SCSI Accessed Fault-Tolerant Enclosure SAS Serial Attached SCSI SATA Serial Advanced Technology Attachment SCA Single Connector Attachment SCL Serial Clock SCM Switch Controller Module SCSI Small Computer Systems Interface SDA Serial Data SDINT System Diagnostic Interrupt SDR Sensor Data Record SDRAM Synchronous Dynamic Random Access Memory SE Single-Ended Intel order number E15155-005
Intel® Modular Server System MFSYS25/MFSYS35 TPS Glossary Word / Acronym Definition SEEPROM Serial Electrically Erasable Programmable Read-Only Memory SEL System Event Log SerDes Serializer/Deserializer SMASH CLP Systems Management Architecture for Server Hardware/Command Line Protocol SMP Symmetric Multiprocessing SNMP Simple Network Management Protocol SOL Serial Over LAN TTL Transistor-Transistor Logic TUV Technical Monitoring Association (Technischer Überwachungsverein) USB Universal Serial Bus UL Underwriters Laboratories, Inc. UV Under-Voltage VAC Alternating Current (AC) voltage VCC Voltage Controlled Current VCCI Voluntary Control Council for Interference by Information Technology Equipment VDE Association for Electrical, Electronic and Information Technologies (Verband der Elektrotechnik, Elektronik und Informationstechnik) VDU Video Display Unit VGA Video Graphics Array VID Voltage Identifier VRM Voltage Regulator Module VSB Voltage Standby WfM Wired for Management WS Web Services WS-MAN WS-Management XAUI 10-Gigabit Attachment Unit Interface Revision 1.3 Intel order number E15155-005
Reference Documents Intel® Modular Server System MFSYS25/MFSYS35 TPS Reference Documents See the following documents for additional information: SCSI Accessed Fault-Tolerant Enclosures Interface Specification (SAF-TE) Intel® Compute Module MFS5000SI Technical Product Specification (TPS) Intel® Modular Server System MFSYS25/MFSYS35 Tested Hardware and Operating Systems List (THOL) IPMI Specification, Version 2.0 Intel order number E15155-005