MCMA140PD1200TB IXYS | Alldatasheet

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Thyristor \\ Diode Module 3 1 25 4 Part number MCMA140PD1200TB Backside: isolated TAV TV V 1.28 RRM 140 1200 V = V I = A Features / Advantages: Applications: Package:

  • Thyristor for line frequency
  • Planar passivated chip
  • Long-term stability
  • Direct Copper Bonded Al2O3-ceramic
  • Line rectifying 50/60 Hz
  • Softstart AC motor control
  • DC Motor control
  • Power converter
  • AC power control
  • Lighting and temperature control TO-240AA
  • Industry standard outline
  • RoHS compliant
  • Soldering pins for PCB mounting
  • Base plate: DCB ceramic
  • Reduced weight
  • Advanced power cycling
  • Isolation Voltage: V~ 4800 The data contained in this product data sheet is ex clusively intended for technically trained staff. T he user will have to evaluate the suitability of th e product for the intended application and the completeness of the product data with respect to his application. The specifications of our compon ents may not be considered as an assurance of component characteristics. The information in the valid application- and assembly notes must be considered. Should you require produc t information in excess of the data given in this p roduct data sheet or which concerns the specific application of your product, please co ntact your local sales office. Due to technical requirements our product may conta in dangerous substances. For information on the typ es in question please contact your local sales offi ce. Should you intend to use the product in aviation, i n health or life endangering or life support applic ations, please notify. For any such application we urgently recommend - to perform joint risk and quality assessments; - the conclusion of quality agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures. Terms Conditions of usage: IXYS reserves the right to change limits, condition s and dimensions. 20161222c Data according to IEC 60747and per semiconductor un less otherwise specified © 2016 IXYS all rights reserved

V = V kA²s kA²s kA²s kA²s Symbol Definition Ratings typ. max. I V I A VT 1.29 R 0.22 K/W min. 140 V V

100 T = 25°C VJ

T = °C VJ mA 10 V = V T = 25°C VJ I = A T V T = °C C 85 Ptot 520 WT = 25°C C 150 1200 forward voltage drop total power dissipation Conditions Unit 1.63 T = 25°C VJ 140 VT0 V0.85 T = °C VJ 140 rT 2.8 mΩ V1.28 T = °C VJ I = A T V 150 1.70 I = A 300 I = A 300 threshold voltage slope resistance for power loss calculation only µA 125 V V1200 T = 25°C VJ I A220 PGM Wt = 30 µs 10 max. gate power dissipation P T = °C C 140 Wt = 5P PGAV W0.5 average gate power dissipation CJ 119 junction capacitance V = V 400 T = 25°C f = 1 MHz R VJ pF ITSM t = 10 ms; (50 Hz), sine T = 45°C VJ max. forward surge current T = °C VJ 140 I²t T = 45°C value for fusing T = °C 140 V = 0 V R V = 0 V R V = 0 V V = 0 V t = 8,3 ms; (60 Hz), sine t = 10 ms; (50 Hz), sine t = 8,3 ms; (60 Hz), sine t = 10 ms; (50 Hz), sine t = 8,3 ms; (60 Hz), sine t = 10 ms; (50 Hz), sine t = 8,3 ms; (60 Hz), sine VJ R VJ R thJC thermal resistance junction to case T = °C VJ 140 2.40 2.59 20.8 20.2 kA kA kA kA 2.04 2.21 28.8 27.9 1200 300 µs RMS forward current T(RMS) TAV 180° sine average forward current (di/dt) cr A/µs 150 repetitive, I = TVJ = 140°C; f = 50 Hz critical rate of rise of current VGT gate trigger voltage V = 6 V T = °C 25 (dv/dt) T = 140°C critical rate of rise of voltage A/µs 500 V/µs t = µs; I A; V = ⅔ V R = ∞; method 1 (linear voltage rise) VJ D VJ 450 AT P G = 0.45 di /dt A/µs; G =0.45 DRM cr V = ⅔ V DRM GK 1000 1.5 V T = °C -40 VJ IGT gate trigger current V = 6 V T = °C 25 D VJ 150 mA T = °C -40 VJ 1.6 V 200 mA VGD gate non-trigger voltage T = °C VJ 0.2 V IGD gate non-trigger current 10 mA V = ⅔ V D DRM 140 latching current T = °C VJ 200 mA IL 25 t µs p = 10 I A; G = 0.45 di /dt A/µs G = 0.45 holding current T = °C VJ 200 mA IH 25 V = 6 V D R = ∞GK gate controlled delay time T = °C VJ 2 µs tgd 25 I A; G = 0.45 di /dt A/µs G = 0.45 V = ½ V D DRM turn-off time T = °C VJ 185 µs tq di/dt = A/µs 10 dv/dt = V/µs 20 V = R 100 V; I A; T = 150 V = ⅔ V DRM t µs p = 200 non-repet., I = 150 AT 125 RthCH thermal resistance case to heatsink K/W Rectifier 1300 RRM/DRM RSM/DSM max. non-repetitive reverse/forward blocking voltage max. repetitive reverse/forward blocking voltage R/D reverse current, drain current T T R/D R/D 200 0.20 IXYS reserves the right to change limits, condition s and dimensions. 20161222c Data according to IEC 60747and per semiconductor un less otherwise specified © 2016 IXYS all rights reserved

C M M A 140 PD 1200 TB Part description Thyristor (SCR) Thyristor (up to 1800V) Phase leg TO-240AA-1B Module Current Rating [A] Reverse Voltage [V] Package Top °C MD Nm 4mounting torque 2.5 TVJ °C 140 virtual junction temperature -40 Weight g81 Symbol Definition typ. max. min. Conditions operation temperature Unit MT Nm 4terminal torque 2.5 V Vt = 1 second Vt = 1 minute isolation voltage mm mm 13.0 9.7 16.0 16.0 d Spp/App creepage distance on surface | striking distance th rough air dSpb/Apb terminal to backside IRMS RMS current 200 Aper terminal 125 -40 terminal to terminal TO-240AA Delivery Mode Quantity Code No. Ordering Number Marking on Product Ordering 50/60 Hz, RMS; I ≤ 1 mA ISOL MCMA140PD1200TB 512618 Box 36 MCMA140PD1200TB Standard

4800 ISOL

Tstg °C 125 storage temperature -40 4000 threshold voltage V0.85 mΩ V0 max R0 max slope resistance * 1.6 Equivalent Circuits for Simulation T = VJ I V0 R0 Thyristor 140 °C * on die level IXYS reserves the right to change limits, condition s and dimensions. 20161222c Data according to IEC 60747and per semiconductor un less otherwise specified © 2016 IXYS all rights reserved

IXYS reserves the right to change limits, condition s and dimensions. 20161222c Data according to IEC 60747and per semiconductor un less otherwise specified © 2016 IXYS all rights reserved

0.01 0.10 1.00 10.00 0.1 1.0 10.0 100.0 0.01 0.1 1 800 1200 1600 2000 0.5 1.0 1.5 2.0 100 150 200 250 300 1 10 100 1000 10000 0.00 0.04 0.08 0.12 0.16 0.20 0.24 IT [A ] t [s]VT [V] 2 3 4 5 6 7 8 9 0 11 10 3 10 4 10 5 I2t [A2s] t [ms] ITSM [A] TVJ = 25°C TVJ = 45°C

50 Hz, 80% V RRM

TVJ = 45°C VR = 0 V ITAVM [A] Tcase [°C] ZthJC [K/W] t [ms] Fig. 1 Forward characteristics Fig. 2 Surge overload current ITSM: crest value, t: duration Fig. 3 I 2t versus time (1-10 s) Fig. 4 Gate voltage & gate current Fig. 6 Max. forward current at case temperature Fig. 8 Transient thermal impedance junction to case tgd [μs] IG [A] lim. typ. Fig. 5 Gate controlled delay time t gd 0 40 80 120 160 100 150 200 250 IT(AV) [A] Ptot [W] Fig. 7a Power dissipation versus direct output current Fig. 7b and ambient temperature 0 40 80 120 160 Tamb [°C] TVJ = 125°C dc = 0.5 0.4 0.33 0.17 0.08 dc = 0.5 0.4 0.33 0.17 0.08 0.01 0.1 1 10 0.1 100 VG [V] IG [A] tp = 30 µs tp = 500 µs PGM = 120 W 60 W PGAV = 8 W 125°C 25°C IGD IGT (TVJ = -40°C) IGT (TVJ = 0°C) IGT (TVJ = 25°C) TVJ = 140°C TVJ = 140°C i R thi (K/W) ti (s) 1 0.0073 0.0001 2 0.0128 0.0031 3 0.1329 0.084 4 0.067 0.42 TVJ = 125°C 140°C RthHA 0.1 0.2 0.4 0.6 0.8 1.0 Thyristor IXYS reserves the right to change limits, condition s and dimensions. 20161222c Data according to IEC 60747and per semiconductor un less otherwise specified © 2016 IXYS all rights reserved