MCC312 IXYS | Alldatasheet

Document overview

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Technical content

Features

G International standard package G Direct copper bonded Al2O 3-ceramic with copper base plate G Planar passivated chips G Isolation voltage 3600 V~ G UL registered E 72873 G Keyed gate/cathode twin pins

Applications

G Motor control, softstarter G Power converter G Heat and temperature control for industrial furnaces and chemical processes G Lighting control G Solid state switches Advantages G Simple mounting G Improved temperature and power cycling G Reduced protection circuits ITRMS = 2x 520 A ITAVM = 2x 320 A VRRM = 1200-1800 V Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions MCC 312 MCD 312 Thyristor Modules Thyristor/Diode Modules 3 76 54 MCD MCC 36 7 1 5 4 2 31 5 4 2

© 2000 IXYS All rights reserved 2 - 4 MCC 312 MCD 312 Symbol Test Conditions Characteristic Values IRRM , IDRM TVJ = TVJM ; VR = VRRM ; VD = VDRM 40 mA VT, VF IT, IF = 600 A; TVJ = 25/G176C 1.32 V VT0 For power-loss calculations only (TVJ = 140/G176C) 0.8 V rT 0.68 m /G87 VGT VD = 6 V; T VJ = 25/G176C2 V TVJ = -40/G176C3 V IGT VD = 6 V; T VJ = 25/G176C 150 mA TVJ = -40/G176C 220 mA VGD TVJ = TVJM ;V D = 2/3 VDRM 0.25 V IGD TVJ = TVJM ;V D = 2/3 VDRM 10 mA IL TVJ = 25/G176C; tP = 30 /G109s; VD = 6 V 200 mA IG = 0.45 A; diG /dt = 0.45 A//G109s IH TVJ = 25/G176C; VD = 6 V; RGK = /G165 150 mA tgd TVJ = 25/G176C; VD = 1/2 VDRM 2 /G109s IG = 1 A; diG /dt = 1 A//G109s tq TVJ = TVJM ; IT = 300 A, tP = 200 /G109s; -di/dt = 10 A//G109s typ. 200 /G109s VR = 100 V; dv/dt = 50 V//G109s; VD = 2/3 VDRM Q S TVJ = 125/G176C; IT, IF = 300 A; -di/dt = 50 A//G109s 760 /G109C IRM 275 A R thJC per thyristor (diode); DC current 0.12 K/W per module other values 0.06 K/W R thJK per thyristor (diode); DC current see Fig. 8/9 0.16 K/W per module 0.08 K/W d S Creeping distance on surface 12.7 mm dA Creepage distance in air 9.6 mm a Maximum allowable acceleration 50 m/s 2 Optional accessories for modules Keyed Gate/Cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red Type ZY 180 L (L = Left for pin pair 4/5) UL 758, style 1385, Type ZY 180 R (R = Right for pin pair 6/7) CSA class 5851, guide 460-1-1 Dimensions in mm (1 mm = 0.0394") MCC MCD Fig. 1 Gate trigger characteristics Fig. 2 Gate trigger delay time 0.01 0.1 1 10 100 10-3 10-2 10-1 100 101 102 0.1 IG VG A A IG 1: IGT , TVJ = 140/c176 C 2: IGT , TVJ = 25/c176 C 3: IGT , TVJ = -40/c176 C µs tgd V 4: PGM = 20 W 5: PGM = 60 W 6: PGM = 120 W IGD , TVJ = 140/c176 C Limittyp. TVJ = 25/c176 C M8x20 M8x20

© 2000 IXYS All rights reserved 3 - 4 MCC 312 MCD 312 0 100 200 300 400 500 100 200 300 400 500 600 0 25 50 75 100 125 150 11 0 104 105 106 0 25 50 75 100 125 150 0.001 0.01 0.1 1 2000 4000 6000 8000 10000 0 200 400 600 800 500 1000 1500 2000 2500 3000 I2t ITAVM / IFAVM IdAVM A Ptot W TA TC s t ms t A2s 0 2 55 07 5 1 0 0 1 2 5 1 5 0 100 200 300 400 500 600 ITSM A A 80 % VRRM TVJ = 45°C 50 Hz TVJ = 140°C TVJ = 140°C TVJ = 45°C ITAVM I FAVM W Ptot A °C 0.6 0.8 0.1 0.2 0.3 0.4 RthKA K/W 0.06 0.2 0.15 0.1 0.07 0.04 0.02 0.3 3xMCC312 or 3xMCD312 Circuit TA RthKA K/W 180° sin 120° 60° 30° DC 180° sin 120° 60° 30° DC VR = 0V Fig. 5 Power dissipation versus on- state current and ambient temperature (per thyristor or diode) Fig. 3 Surge overload current I TSM , IFSM : Crest value, t: duration Fig. 4 I2t versus time (1-10 ms) Fig. 4a Maximum forward current at case temperature Fig. 6 Three phase rectifier bridge: Power dissipation versus direct output current and ambient temperature

© 2000 IXYS All rights reserved 4 - 4 MCC 312 MCD 312 R thJC for various conduction angles d: d R thJC (K/W) DC 0.120 180/G176 0.128 120/G176 0.135 60/G176 0.153 30/G176 0.185 Constants for ZthJC calculation: iR thi (K/W) t i (s) 1 0.0058 0.00054 2 0.031 0.098 3 0.072 0.54 4 0.0112 12 Fig. 9 Transient thermal impedance junction to heatsink (per thyristor or diode) R thJK for various conduction angles d: d R thJK (K/W) DC 0.160 180/G176 0.168 120/G176 0.175 60/G176 0.193 30/G176 0.225 Constants for ZthJK calculation: iR thi (K/W) t i (s) 1 0.0058 0.00054 2 0.031 0.098 3 0.072 0.54 4 0.0112 12 5 0.04 12 t ZthJK s t 10-3 10-2 10-1 100 101 102 0.00 0.05 0.10 0.15 0.20 0.25 K/W ZthJC IRMS Ptot 0 25 50 75 100 125 1500 200 400 600 500 1000 1500 2000 2500 3000 3xMCC312 or 3xMCD312 Circuit 0.2 0.15 0.1 0.07 0.04 0.02 R thKA K/W 0.3 10-3 10-2 10-1 100 101 102 0.00 0.05 0.10 0.15 0.20 DC 180° 120° 60° 30° DC 180° 120° 60° 30° TA W K/W s Fig. 8 Transient thermal impedance junction to case (per thyristor or diode) Fig. 7 Three phase AC-controller: Power dissipation versus RMS output current and ambient temperature