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 Telecom Switching  Tip/Ring Circuits  Modem Switching (Laptop, Notebook, Pocket Size)  Loop Detect  Ringing Detect  Current Sensing  100mA Continuous Load Rating  3750Vrms Input/Output Isolation  Bidirectional Input  Small 8-Pin Package, Thru-Hole or Surface Mount  Machine Insertable, Wave Solderable  Surface Mount Tape & Reel Packaging Available LDA210 is a dual bidirectional-input optocoupler with Darlington-transistor outputs. The LDA210 has a minimum current transfer ratio (CTR) of 300% with a typical value of 8500%. Approvals A/K A/K A/K A/K E C C E  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1175739  EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 LDA210 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Breakdown Voltage 30 V P Input Control Current 100 mA Peak (10ms) 1 A Power Dissipation Input Power Dissipation 1 150 mW Phototransistor 2 150 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33mW / ºC

2 Derate linearly 2mW / ºC

Electrical Characteristics @ 25ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Breakdown Voltage I C = 100µA BV CEO 30 50 - V Phototransistor Dark Current V CEO = 5V , IF = 0mA I CEO - 50 500 nA Saturation Voltage I C = 3mA, IF = 1mA V CE(sat) --1 V Current T ransfer Ratio I F = 1mA, VCE = 2V CTR 300 8500 30000 % Output Capacitance 50V , f =1MHz C OUT -3- p F Input Characteristics Input Control Current I C = 3mA, VCE = 2V I F - 0.07 1 mA Input Voltage Drop I F = 5mA V F 0.9 1.2 1.4 V Common Characteristics Capacitance, Input to Output - C I/O -3- p F Characteristic Symbol Test Condition Typ Units T urn-On Time t on VCC=5V , IF=1mA, RL=500 8 sT urn-Off Time t off 345 Switching Characteristics @ 25ºC Switching Time Test Circuit VCC VCE RL IF Pulse Width=5ms Duty Cycle=1% IF 10% 90% t on t off VCE

INTEGRATED CIRCUITS DIVISION LDA210 www.ixysic.com 3R05 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Voltage (V) LED Forward Current (mA) LED Voltage vs. Current LED Forward Voltage (V) LED Forward Current (mA) 0.1 100 LED Voltage vs. Current (Log) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA IF=1mA LED Forward Current (mA) 2468 1 0 CTR (%) 5000 10000 15000 20000 Typical CTR vs. LED Forward Current (VCE=5V) -40ºC 85ºC 25ºC Typical Collector Current vs. Collector Voltage Collector Voltage VCE (V) 0123456 Collector Current IC (mA) 100 150 200 250 IF=10mA IF=20mA IF=5mA IF=1mA IF=2mA IF=0.5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 ICE Current (mA) 100 150 200 250 ICE Current vs. Temperature (VCE=5V) IF=10mA IF=5mA IF=2mA IF=1mA IF=0.5mA IF=0.2mA IF=0.1mA Temperature (ºC) -40 -20 0 20 40 60 80 100 VCE(sat) (V) 0.70 0.75 0.80 0.85 0.90 0.95 VCE(sat) vs. Temperature (IF=1mA, IC=3mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (nA) 200 400 600 800 1000 1200 1400 Leakage Current vs. Temperature VCC=10V VCC=3V VCC=5V Load Resistance (:) 1x102 1x103 1x104 1x105 Turn-On Time (Ps) 6.8 6.9 7.0 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 8.0 Turn-On Time vs. Load Resistance (IF=1mA, VCC=5V) Load Resistance (:) 1x102 1x103 1x104 1x105 Turn-Off Time (Ps) 5000 10000 15000 Turn-Off Time vs. Load Resistance (IF=1mA, VCC=5V)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 LDA210 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LDA210 / LDA210S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LDA210 / LDA210S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION LDA210 www.ixysic.com 5R05 LDA210 LDA210S Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP . (0.285) 7.620 ± 0.254 (0.300 ± 0.010)

4.064 TYP

(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Mechanical Dimensions

INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com LDA210 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-LDA210-R05 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 LDA210STR Tape & Reel Dimensions mm (inches) User Direction of Feed NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1 =4.20 (0.165) 0 K =4.90 (0.193) P=12.00 (0.472) W=16.00 (0.63)Bo=10.30 (0.406) Ao=10.30 (0.406)