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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls 3750Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Machine Insertable, Wave Solderable Surface Mount Tape & Reel Version Available Approvals Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD tontoff UL Recognized Component: File E76270 CSA Certified Component: Certificate 1175739 EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 + Control – Control N/C Load Do Not Use Load AC/DC Configuration + Control – Control + Load – Load DC Only Configuration N/C The LCB110 is a single-pole, normally closed (1-Form-B) relay that uses optically coupled MOSFET technology to provide 3750V rms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The LCB110 has low on-resistance and is well suited for most applications requiring a normally closed relay.
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R09 LCB110 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 350 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 3.33 mW / ºC 1 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous AC/DC Confi guration -I L -- 120 mA rms / mADC DC Confi guration 200 mA DC Peak Load Current t=10ms I L - - ±350 mA P On-Resistance AC/DC Confi guration I L=120mA RON -2 3 3 5 DC Confi guration I L=200mA - 7 10 Off-State Leakage Current I F=5mA, VL=350VP ILEAK --1 A Switching Speeds T urn-On I F=5mA, VL=10V ton - 0.38 3 ms T urn-Off t off - 0.93 3 Output Capacitance I F=5mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L=120mA I F --5m A Input Control Current to Deactivate - I F 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Input to Output Capacitance - C I/O -3 - p F Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION LCB110 www.ixysic.com 3R09 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) 0.18 Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) Turn-Off Time (ms) Device Count (N) 1.0 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mADC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=120mADC) Device Count (N) Typical On-Resistance Distribution (N=50, IL=120mADC) On-Resistance (:) 370 375 380 385 390 395 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=5mA) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=10mA IF=5mA Temperature (ºC) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.30 0.25 0.20 0.15 0.10 0.05 Typical Turn-On Time vs. LED Forward Current (IL=120mADC) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC)
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R09 LCB110 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* On-Resistance (:) -40 -20 0 20 40 60 80 100 AC/DC Configuration DC Configuration Typical On-Resistance vs. Temperature (IL=120mADC) Temperature (ºC) Turn-On Time (ms) -40 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) Temperature (ºC) Turn-Off Time (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -20 0 20 40 60 80 100 IF=10mA Typical Turn-Off Time vs. Temperature (IL=120mADC) Temperature (ºC) IF=5mA On-Resistance (:) -40 -20 0 20 40 60 80 100 Instantaneous Typical On-Resistance vs. Temperature (IL=100mA) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=120mADC) Temperature (ºC) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=120mADC) Load Current (mA) 220 200 180 160 140 120 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 DC Configuration AC/DC Configuration Maximum Load Current vs. Temperature (IF=0mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 -4 -3 -2 -1 1 2 3 0 4 Typical Load Current vs. Load Voltage Blocking Voltage (VP) -40 400 395 390 385 380 375 370 365 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature (IF=5mA) Leakage (PA) -40 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 4&6 (IF=5mA, VL=350V) Temperature (ºC) Time Load Current (A) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10Ps 1ms 100ms 10s100Ps 10ms 1s 100s Energy Rating Curve
INTEGRATED CIRCUITS DIVISION LCB110 www.ixysic.com 5R09 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LCB110 / LCB110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LCB110 / LCB110S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R09 LCB110 Dimensions mm (inches) PCB Hole Pattern 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 0.254 ± 0.0127 (0.010 ± 0.0005) 9.144 ± 0.508 (0.360 ± 0.020)
7.239 TYP
(0.285 TYP) 7.620 ± 0.254 (0.300 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002)
4.064 TYP
(0.160 TYP) 0.457 ± 0.076 (0.018 ± 0.003) 8.382 ± 0.381 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 Dimensions mm (inches) PCB Land Pattern 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 8.382 ± 0.381 (0.100 ± 0.005) 9.524 ± 0.508 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) Pin 1 LCB110 LCB110S MECHANICAL DIMENSIONS
INTEGRATED CIRCUITS DIVISION Specification: DS-LCB110-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 For additional information please visit our website at: www.ixysic.com LCB110 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Dimensions mm (inches) Embossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) A0 = 10.10 (0.398) P = 12.00 (0.472) K1 = 3.80 (0.15) K0 = 4.90 (0.19) User Direction of Feed LCB110STR Tape & Reel