LBA716

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Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices LBA716 is a 60V, 1A, 0.4 dual Solid State Relay integrating independent normally open (1-Form-A) and normally closed (1-Form-B) relays into a single package. It features a superior combination of low on-resistance and enhanced peak load current (5A max.) handling capability.  Telecommunications  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Utility Meters (gas, oil, electric and water)  Medical Equipment-Patient/Equipment Isolation  Security  Aerospace  Industrial Controls  UL Recognized Component: File # E76270  CSA Certified Component: Certificate # 1175739  EN/IEC 60950-1 Certified Component TUV Certificate B 09 07 49410 004  3750Vrms Input/Output Isolation  Low Drive Power Requirements (TTL/CMOS Compatible)  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Small 8-Pin Package  Machine Insertable, Wave Solderable  Surface Mount Version  Tape & Reel available + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open Normally Closed Normally Open Form-A IF ILOAD 10% 90% ton toff Form-B IF 10% 90% ILOAD tontoff

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R03 LBA716 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Conditions Symbol Min Typ Max Units Characteristics: Form-A (Normally Open) Load Current Continuous -I L --1 Arms / ADC Peak t < 10ms I LPK -- ± 5A P On-Resistance I L=1A R ON - 0.21 0.4  Off-State Leakage Current V L=60V I LEAK --1 A Output Capacitance 50V , f=1MHz C OUT - 105 - pF Switching Speeds T urn-On I F=5mA, VL=10V ton - 0.7 5 ms T urn-Off t off - 0.09 5 Input Control Current to Activate I L=1A I F --2m A Input Control Current to Deactivate - I F 0.1 - - mA Characteristics: Form-B (Normally Closed) Load Current Continuous -I L - - 0.5 Arms / ADC Peak t < 10ms I LPK - - ±1.2 A P On-Resistance I L=0.5A R ON - 1.63 2  Off-State Leakage Current V L=60V , IF=5mA I LEAK --1 A Output Capacitance I F=5mA, 50V , f=1MHz C OUT - 280 - pF Switching Speeds T urn-On IF=5mA, VL=10V ton - 0.58 5 ms T urn-Off t off - 0.76 5 Input Control Current to Activate - I F --2m A Input Control Current to Deactivate I L=0.5A I F 0.1 - - mA Common Characteristics: Form-A and Form-B Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R -- 1 0 A Capacitance, Input to Output - C I/O -3- p F *NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package power dissipati on value. Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC

INTEGRATED CIRCUITS DIVISION LBA716 www.ixysic.com 3R03 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage Drop (V) Device Count (N) Form-A Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Form-A Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) LED Forward Current (mA) Device Count (N) Form-A Typical IF for Switch Operation (N=50, IL=200mA) On-Resistance (:) Device Count (N) Form-A Typical On-Resistance (N=50, IF=5mA, IL=1A) Blocking Voltage (VP) Device Count (N) Form-A Typical Blocking Voltage (N=50) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.70 0.75 0.80 0.85 0.90 0.95 Form-A Typical IF for Switch Operation vs. Temperature (IL=200mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 200 400 600 800 1000 1200 Form-A Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (Ps) 77.1 77.2 77.3 77.4 77.5 77.6 77.7 77.8 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.5 1.0 1.5 2.0 2.5 Form-A Typical Turn-On Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) Form-A Typical Turn-Off Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 AC On-Resistance (:) 0.12 0.14 0.16 0.18 0.20 0.22 0.24 0.26 Form-A Typical On-Resistance (AC) vs. Temperature (IL=500mA, IF=5mA) Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R03 LBA716 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Voltage (V) Current (A) -1.0 -0.5 0.0 0.5 1.0 Form-A Typical Load Current vs. Load Voltage (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Form-A Maximum Load Current vs. Temperature (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Form-A Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) Form-A Typical Leakage vs. Temperature Measured Across Pins 5 & 6 (VL=60V) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) Form-A Energy Rating Curve LED Forward Voltage Drop (V) Device Count (N) Form-B Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Form-B Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) LED Forward Current (mA) Device Count (N) Form-B Typical IF for Switch Operation (N=50, IL=200mA) On-Resistance (:) Device Count (N) Form-B Typical On-Resistance (N=50, IF=0mA, IL=5mA) Blocking Voltage (VP) 75 76 77 78 79 80 Device Count (N) Form-B Typical Blocking Voltage (N=50, IF=5mA) Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION LBA716 www.ixysic.com 5R03 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.10 0.15 0.20 0.25 0.30 0.35 0.40 Form-B Typical IF for Switch Operation vs. Temperature (IL=100mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 417 418 419 420 421 422 423 Form-B Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (ma) 0 1 02 0 3 04 05 0 Turn-Off Time (ms) 0.5 1.0 1.5 2.0 2.5 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 100 200 300 400 500 600 700 800 Form-B Typical Turn-On Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Form-B Typical Turn-Off Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=100mA) Voltage (V) Current (A) -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 Form-B Typical Load Voltage vs. Load Current (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (A) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Form-B Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Form-B Typical Blocking Voltage vs. Temperature (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 150 200 250 300 350 Form-B Typical Leakage vs.Temperature Measured Across Pins 7&8 (IF=5mA, VL=60V) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.3 0.5 0.7 0.9 1.1 1.3 1.5 Form-B Energy Rating Curve Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R03 LBA716 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBA716 / LBA716S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBA716 / LBA716S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION LBA716 www.ixysic.com 7R03 Mechanical Dimensions Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP . (0.285) 7.620 ± 0.254 (0.300 ± 0.010)

4.064 TYP

(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 LBA716 LBA716S

INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com LBA716 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-LBA716-R03 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 Dimensions mm (inches) User Direction of Feed NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1 =4.20 (0.165) 0 K =4.90 (0.193) P=12.00 (0.472) W=16.00 (0.63)Bo=10.30 (0.406) Ao=10.30 (0.406) LBA716STR Tape & Reel