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 Current Limited 1-Form-A Relay  3750Vrms Input/Output Isolation  Low Drive Power Requirements (TTL/CMOS Compatible)  High Reliability  Arc-Free With No Snubbing Circuits  FCC Compatible  VDE Compatible  No EMI/RFI Generation  Small 8-Pin Package  Machine Insertable, Wave Solderable  Surface Mount, Tape & Reel Version Available  Telecommunications  Telecom Switching  Tip/Ring Circuits  Modem Switching (Laptop, Notebook, Pocket Size)  Hook Switch  Dial Pulsing  Ground Start  Ringing Injection  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment-Patient/Equipment Isolation  Security  Aerospace  Industrial Controls e3Pb Switching Characteristics of Normally Closed (Form B) Devices Form-B IF 10% 90% ILOAD tontoff Form-A IF ILOAD 10% 90% ton toff Switching Characteristics of Normally Open (Form A) Devices + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open Normally Closed Pole Normally Open Pole  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1175739  EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 LBA127L comprises two independent solid state relays (one current-limited, single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay), in an 8-pin package that employs optically coupled MOSFET technology to provide 3750V rms of input to output isolation. The optically coupled relay outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. LBA127L is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required in a space-saving single package.

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R08 LBA127L Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L - - 150 mA rms / mADC Peak (Form-B Only) t = 10ms I LPK - - ±400 mA P Load Current Limiting (Form-A Only) I F=5mA, VL=8V I CL ±190 ±200 ±280 mA On-Resistance 2 IL=150mA R ON - 6.8 15  Off-State Leakage Current V L=250VP ILEAK -- 1 A Switching Speeds T urn-On I F=5mA, VL=10V ton -- 5 ms T urn-Off t off -- 5 Output Capacitance V L=50V , f=1MHz C OUT - 110 - pF Input Characteristics Input Control Current to Activate I L=150mA I F -- 5 m A Input Control Current to Deactivate - - 0.4 0.7 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Input to Output Capacitance - C I/O -3 - p F 1 If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within 1 second of on-time. Parameter Ratings Units Blocking Voltage 250 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW T otal Power Dissipation 2 800 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / °C 2 Derate linearly 6.67 mW / °C Absolute Maximum Ratings @ 25°C Electrical Characteristics @ 25°C

INTEGRATED CIRCUITS DIVISION LBA127L www.ixysic.com 3R08 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Device Count (N) Typical IF for Switch Operation (N=50, IL=150mADC) LED Current (mA) Device Count (N) Typical Blocking Voltage Distribution (Form-A: IF=0mA, Form-B: IF=5mA) (N=50) 332 334 336 340 338 342 Blocking Voltage (V Device Count (N) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=5mA IF=10mA IF=20mA IF=50mA Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.40 0.45 0.50 0.55 0.60 0.65 Typical IF for Switch Operation vs. Temperature (IL=75mADC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 100 150 200 250 Load Current vs. Load Temperature (Form-A: IF=5mA, Form-B: IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 315 320 325 330 335 340 345 350 355 Typical Blocking Voltage vs. Temperature (Form-A: IF=0mA, Form-B: IF=5mA) Form-A/Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R08 LBA127L *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-A Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) Turn-On Time (ms) Device Count (N) Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) 0.13 0.150.14 0.16 Turn-Off Time (ms) Device Count (N) 0.170.12 Form-A Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) On-Resistance (:) Device Count (N) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (ms) 0.50 1.00 Form-A Typical Turn-On Time vs. LED Forward Current (IL=75mADC) 0.25 0.75 LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (ms) 0.150 0.155 0.160 0.165 Form-A Typical Turn-Off Time vs. LED Forward Current (IL=75mADC) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 Form-A Typical On-Resistance vs. Temperature (IF=5mA, IL=75mADC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.2 0.4 0.6 0.8 1.0 1.2 Form-A Typical Turn-On Time vs. Temperature (IF=5mA, IL=75mADC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) 0.08 0.10 0.12 0.14 0.16 0.18 0.20 Form-A Typical Turn-Off Time vs. Temperature (IF=5mA, IL=75mADC) Load Voltage (V) Load Current (A) -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 Form-A Typical Load Current vs. Load Voltage (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (PA) 0.000 0.005 0.010 0.015 0.020 0.025 Form-A Typical Leakage vs.Temperature (Measured Across Pins 5 & 6) (VL=250V) Form-A Typical Current Limiting vs. Temperature (IF=5mA) Temperature (ºC) Current (mA) 400 350 300 250 200 150 100 -40 -20 0 20 40 60 80 120 100

INTEGRATED CIRCUITS DIVISION LBA127L www.ixysic.com 5R08 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Form-B Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) Turn-On Time (ms) Device Count (N) Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) Turn-Off Time (ms) Device Count (N) Form-B Typical On-Resistance Distribution (N=50, IF=0mA, IL=150mADC) On-Resistance (:) Device Count (N) Form-B Typical Turn-On Time vs. LED Forward Current (IL=75mADC) LED Forward Current (mA) Turn-On Time (Ps) 78.5 78.0 77.5 77.0 76.5 76.0 01 0 2 05 1 5 2 53 03 5 40 45 50 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=75mADC) LED Forward Current (mA) Turn-Off Time (ms) 2.5 2.0 1.5 1.0 0.5 01 0 2 05 1 5 2 53 03 5 40 45 50 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=75mADC) Temperature (ºC) On-Resistance (:) -40 0 40-20 20 60 80 100 Form-B Typical Turn-On Time vs. Temperature (IF=5mA, IL=75mADC) Temperature (ºC) Turn-On Time (ms) 0.20 0.15 0.10 0.05 -40 0 40-20 20 60 80 100 Form-B Typical Turn-Off Time vs. Temperature (IL=75mADC) Temperature (ºC) Turn-Off Time (ms) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -40 0 40-20 20 60 80 100 IF=5mA IF=10mA IF=20mA Form-B Typical Load Current vs. Load Voltage (IF=0mA) Load Voltage (V) Load Current (mA) 200 150 100 -50 -100 -150 -200 0.6 0.8 1 Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (PA) 0.01 0.02 0.03 0.04 0.05 0.06 Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=5mA) Energy Rating Curve Time Load Current (A) 1.2 1.0 0.8 0.6 0.4 0.2 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s

INTEGRATED CIRCUITS DIVISION www.ixysic.com6 R08 LBA127L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LBA127L / LBA127LS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LBA127L / LBA127LS 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION LBA127L www.ixysic.com 7R08 MECHANICAL DIMENSIONS LBA127L LBA127LS Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP . (0.285) 7.620 ± 0.254 (0.300 ± 0.010)

4.064 TYP

(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1

INTEGRATED CIRCUITS DIVISION For additional information please visit our website at: www.ixysic.com LBA127L IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-LBA127L-R08 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012 MECHANICAL DIMENSIONS LBA127LSTR Tape & Reel Dimensions mm (inches) User Direction of Feed NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1 =4.20 (0.165) 0 K =4.90 (0.193) P=12.00 (0.472) W=16.00 (0.63)Bo=10.30 (0.406) Ao=10.30 (0.406)