G23564-006

DH61WW INTEL | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 86

Technical content

Datasheet sections

• 1 Product Description
• 1.1 Overview
• 1.1.1 Feature Summary
• 1.1.2 Board Layout
• 1.1.3 Block Diagram
• 1.2 Legacy Considerations
• 1.3 Online Support
• 1.4 Processor
• 1.5 Intel® H61 Express Chipset
• 1.6 System Memory
• 1.6.1 Memory Configurations
• 1.7 Graphics Subsystem
• 1.7.1 Integrated Graphics
• 1.7.2 PCI Express x16 Graphics
• 1.8 USB
• 1.9 SATA Interfaces
• 1.10 Legacy I/O Controller
• 1.10.1 Serial Port
• 1.11 Audio Subsystem
• 1.11.1 Audio Subsystem Software
• 1.11.2 Audio Headers and Connectors
• 1.12 LAN Subsystem
• 1.12.1 Intel® 82579V Gigabit Ethernet Controller
• 1.12.3 RJ-45 LAN Connector with Integrated LEDs
• 1.13 Real-Time Clock Subsystem
• 1.14 Thermal Monitoring
• 1.15 Platform Management and Security
• 1.15.1 Hardware Management Subsystem
• 1.15.2 Hardware Monitoring

Datasheet sections

• 5.1.3 Product Ecology Statements
• 5.1.4 EMC Regulations
• 5.1.6 Regulatory Compliance Marks (Board Level)
• 5.2 Battery Disposal Information

Intel® Desktop Board DH61WW Technical Product Specification July 2013 Part Number: G23564-006 The Intel® Desktop Board DH61WW may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH61WW Specification Update.

Revision History

Revision Revision History Date -001 First release of the Intel® Desktop Board DH61WW Technical Product Specification February 2011 -002 Second release of the Intel® Desktop Board DH61WW Technical Product Specification May 2011 -003 Updated maximum memory supported from 8 GB to 16 GB March 2012 -004 Specification clarification June 2012 -005 Specification clarification May 2013 -006 Specification clarification July 2013 Disclaimer This product specification applies to only the standard Intel® Desktop Board DH61WW with BIOS identifier BEH6110H.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Intel, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others. Copyright  2011-2013, Intel Corporation. All rights reserved.

Board Identification Information Basic Desktop Board DH61WW Identification Information G23116-202 BEH6110H.86A.0016 1,2 G23116-203 BEH6110H.86A.0016 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2. The H61 chipset used on this AA revision consists of the following component: Device Stepping S-Spec Numbers 82H61 B3 SLJ4B Specification Changes or Clarifications The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel® Desktop Board DH61WW. Specification Changes or Clarifications Date Type of Change Description of Change or Clarification May 2011 Spec Clarifications • The Intel H61 Express Chipset does not support RAID. The following sections of this manual have been updated: ― Reference to RAID in Table 1. Feature Summary has been deleted ― Section 1.9.1.1 Serial ATA RAID has been deleted ― Section 1.9.1.2 Intel® Rapid Recover Technology has been deleted ― The Caution in Section 3.1 Introduction has been deleted

• The maximum memory supported changed from 16 GB to

8 GB in the following sections of this manual:

― Table 1. Feature Summary ― Section 1.6 System Memory ― Section 2.1.1 Addressable Memory ― Figure 8. Detailed System Memory Address Map ― Error! Reference source not found.

• The Korean Certification mark has changed. The following sections of this manual have been updated: ― Section 5.1.4 EMC Regulations. The Korean Class B Statement translation has been updated. ― Section 5.1.6 Regulatory Compliance Marks (Board Level). The new Korean Certification mark has been added. March 2012 Spec Clarification Updated maximum memory supported from 8 GB to 16 GB June 2012 Spec Clarification Added additional supported memory to Table 3 and corrected a typo in Table 9. May 2013 Spec Clarification Added ENERGY STAR Note to Section 5.1.5. July 2013 Spec Clarification Deleted reference to ENERGY STAR.

Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/motherboards/desktop- motherboards/motherboards.html?wapkw=desktop+boards for the latest documentation.

v Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel ® Desktop Board DH61WW. Intended Audience The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH61WW and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description

1 A description of the hardware used on the Intel Desktop Board DH61WW

2 A map of the resources of the Intel Desktop Board

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. CAUTION Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH61WW Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners.

Intel Desktop Board DH61WW Technical Product Specification

2 Technical Reference

3 Overview of BIOS Features

3.6.2

4 Error Messages and Beep Codes

Intel Desktop Board DH61WW Technical Product Specification

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board. Table 1. Feature Summary

• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology
• Support for non-ECC memory Graphics • Integrated graphics support for processors with Intel® Graphics Technology
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card Audio • Intel® High Definition Audio: ― Realtek* ALC892 audio codec ― S/PDIF audio header ― Front panel audio header continued

Intel Desktop Board DH61WW Technical Product Specification T able 1. Feature Summary (continued) Peripheral Interfaces

• Six USB ports: ― Four USB 2.0 ports are implemented with stacked back panel connectors ― Two USB 2.0 front panel ports are implemented through one dual-port internal header
• Four SATA interfaces through the Intel H61 Express Chipset
• One serial port header
• One parallel port connector on the back panel
• One PS/2* keyboard/mouse port on back panel Legacy I/O Control • Nuvoton* W83677HG-i Super I/O controller for hardware management and serial port, parallel port, and PS/2 support BIOS • Intel® BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Instantly Available PC Technology
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express*
• Suspend to RAM support
• Wake on Conventional PCI, PCI Express, LAN, front panel, serial, PS/2, and USB ports LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579V Gigabit Ethernet Controller Expansion Capabilities
• One PCI Express 2.0 x16 add-in card connector
• One PCI Express 2.0 x1 add-in card connector
• One Conventional PCI bus connector Hardware Monitor Subsystem
• Hardware monitoring through the Nuvoton Super I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control

1.1.2 Board Layout

Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.

Intel Desktop Board DH61WW Technical Product Specification T able 2. Components Shown in Figure 1 Item/callout from Figure 1

Description

A Conventional PCI bus add-in card connector B Chassis intrusion header C S/PDIF header D PCI Express x1 add-in card connector E Battery F PCI Express x16 add-in card connector G Back panel connectors H Standby power LED I 12 V internal power connector (ATX12V) J Rear chassis fan header K Piezoelectric speaker L LGA1155 processor socket M Processor fan header N Low Pin Count (LPC) Debug header O DIMM 1 (Channel A DIMM 1) P DIMM 2 (Channel B DIMM 1) Q Trusted Platform Module (TPM) header R Main power connector (2 x 12) S SATA connectors T BIOS setup configuration jumper block U Front panel header V Intel H61 Express Chipset W Serial port header X Front panel USB 2.0 headers Y Front panel audio header

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board. Figure 2. Block Diagram

Intel Desktop Board DH61WW Technical Product Specification

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No Parallel ATA (PATA) IDE drive connector

1.3 Online Support

To find information about… Visit this World Wide Web site: Intel Desktop Board DH61WW http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for the Intel Desktop Board DH61WW http://ark.intel.com Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS- 025414.htm Integration information http://www.intel.com/support/go/buildit

1.4 Processor

The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1155 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 95 W. See the Intel web site listed below for the most up-to-date list of supported processors. For information about… Refer to: Supported processors http://processormatch.intel.com CAUTION Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply. NOTE This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 54 for information on power supply requirements for this board.

1.5 Intel® H61 Express Chipset

The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, and PCI Express. The PCH is a centralized controller for the board’s I/O paths. For information about Refer to The Intel H61 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.6 System Memory

The board has two DIMM sockets and supports the following memory features:

• Two independent memory channels with interleaved mode support
• Supports 1.2 V – 1.8 V DIMM memory voltage
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8 organization
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 38 for information on the total amount of addressable memory.
• Minimum total system memory: 1 GB using 1 Gb x8 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs NOTE To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

able 3 lists the supported DIMM configurations. Table 3. Supported Memory Configurations

512 MB SS 1 Gbit 64 M x16/empty 4

1024 MB SS 1 Gbit 128 M x8/empty 8

1024 MB SS 2 Gbit 128 M x16/empty 4

2048 MB DS 1 Gbit 128 M x8/128 M x8 16

2048 MB SS 2 Gbit 128 M x16/empty 8

4096 MB DS 2 Gbit 256 M x8/256 M x8 16

4096 MB SS 4 Gbit 512 M x8/empty 8

8192 MB DS 4 Gbit 512 M x8/512 M x8 16

single-sided memory modules (containing one row of SDRAM).

1.6.1 Memory Configurations

• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. For information about… Refer to: Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs- 011965.htm

Intel Desktop Board DH61WW Technical Product Specification

1.7 Graphics Subsystem

The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card.

1.7.1 Integrated Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface (Intel® FDI) for processors with Intel Graphics Technology.

1.7.1.1 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.7.2 PCI Express x16 Graphics

The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1155 socket support discrete add in graphics cards through the PCI Express 2.0 x16 graphics connector:

• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is 8 GB/s in each direction, simultaneously, when operating in x16 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is 4 GB/s in each direction, simultaneously, when operating in x16 mode. For information about Refer to PCI Express technology http://www.pcisig.com

1.8 USB

The board supports up to six USB 2.0 ports. The port arrangement is as follows:

• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Two USB 2.0 front panel ports are implemented through one dual-port internal header All six USB ports are high-speed, full-speed, and low-speed capable. NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices. For information about Refer to The location of the USB connectors on the back panel Figure 9, page 41 The location of the front panel USB headers Figure 10, page 42

1.9 SATA Interfaces

The board provides four 3 Gb/s SATA connectors, which support one device per connector. The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems. For more information, see: http://www.serialata.org/ For information about Refer to The location of the SATA connectors Figure 10, page 42

Intel Desktop Board DH61WW Technical Product Specification

1.10 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• One serial port
• One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support
• PS/2-style keyboard/mouse interface on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support The BIOS Setup program provides configuration options for the Legacy I/O controller.

1.10.1 Serial Port

The serial port is implemented as a 10-pin header on the board. The serial port supports data transfers at speeds up to 115.2 kbits/s with BIOS support. For information about Refer to The location of the serial port header Figure 10, page 42

1.11 Audio Subsystem

• 6+2-channel audio with independent multi-streaming stereo.
• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.
• Stereo input and output through back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• S/PDIF audio header
• A signal-to-noise (S/N) ratio of 90 dB Table 4 lists the supported functions of the front panel and back panel audio jacks.

Table 4. Audio Jack Support

Intel Desktop Board DH61WW Technical Product Specification

1.11.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.3, page 16

1.11.2 Audio Headers and Connectors

The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following:

• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow) For information about Refer to The locations of the front panel audio header, S/PDIF header, and internal mono speaker header Figure 10, page 42 The signal names of the front panel audio header Table 14 and Table 15, page 45 The signal names of the S/PDIF header Table 13, page 44 The back panel audio connectors Section 2.2.1, page 41

1.11.2.1 Analog Audio Connectors

The available configurable back panel audio connectors are shown in Figure 4. Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers. panel headset, respectively).

1.11.2.2 S/PDIF Header

Intel Desktop Board DH61WW Technical Product Specification

1.12 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel H61 Express Chipset
• RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management  ACPI technology support  LAN wake capabilities
• LAN subsystem software For information about Refer to LAN software and drivers http://downloadcenter.intel.com

1.12.1 Intel® 82579V Gigabit Ethernet Controller

The Intel 82579V Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer (PHY):  PCI Express-based interface for active state operation (S0) state  SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility

1.12.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.3, page 16

1.12.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Figure 5. LAN Connector LED Locations Table 5. LAN Connector LED States Off LAN link is not established. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected or negotiated. Green 100 Mbits/s data rate is selected or negotiated. Yellow 1000 Mbits/s data rate is selected or negotiated.

Intel Desktop Board DH61WW Technical Product Specification

1.13 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the power supply 5V STBY rail. NOTE If the battery and AC power fail, date and time values will be reset and the user will be notified during POST. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.14 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers. Figure 6. Thermal Sensors and Fan Headers

Intel Desktop Board DH61WW Technical Product Specification

1.15 Platform Management and Security

Intel DH61WW Desktop Board integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller.

1.15.1 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection

1.15.2 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on the Nuvoton W83677HG-i device, which supports the following:

• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM, and +VCCP
• SMBus interface

1.15.2.1 Fan Monitoring

Fan monitoring can be observed through the BIOS setup user interface, Intel® Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.16.2.2, page 35

1.15.2.2 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position. For information about Refer to The location of the chassis intrusion header Figure 10, page 42

1.16 Power Management

• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:  Power connector  Fan headers  LAN wake capabilities  Instantly Available PC technology  Wake from USB  Power Management Event signal (PME#) wake-up support  PCI Express WAKE# signal support  Wake from serial port  Wake from PS/2

1.16.1 ACPI

• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 33)
• Support for a front panel power and sleep mode switch Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 6. Effects of Pressing the Power Switch

1.16.1.1 System States and Power States

on user preferences and knowledge of how devices are being used by applications. Table 7. Power States and Targeted System Power

1. Total system power is dependent on the system configuration, including add-in boards and peripherals

powered by the system chassis’ power supply.

1. Dependent on the standby power consumption of wake-up devices used in the system.

1.16.1.2 Wake-up Devices and Events

Table 8. Wake-up Devices and Events

• S4 implies operating system support only.
• USB ports are turned off during S4/S5 states. NOTE The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

Intel Desktop Board DH61WW Technical Product Specification

1.16.2 Hardware Support

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including:

• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from serial port
• Wake from PS/2
• +5 V Standby Power Indicator LED LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. NOTE The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.16.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about Refer to The location of the main power connector Figure 10, page 42 The signal names of the main power connector Table 21, page 47

1.16.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state
• The fans are off when the board is in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC
• All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation
• The rear fan header also supports linear fan control on 3-wire fans For information about Refer to The location of the fan headers Figure 10, page 42 The location of the fan headers and sensors for thermal monitoring Figure 6, page 29

1.16.2.3 LAN Wake Capabilities

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

Intel Desktop Board DH61WW Technical Product Specification

1.16.2.4 Instantly Available PC Technology

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off and the front panel power LED will behave as configured by the BIOS “S3 State Indicator” option). When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 8 on page 33 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.16.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.

1.16.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.16.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.16.2.8 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S3 state.

1.16.2.9 Wake from PS/2 Devices

PS/2 device activity wakes the computer from an ACPI S3, S4, or S5 state. However, when the computer is in an S4 or S5 state, the only PS/2 activity that will wake the computer is the alt-PrtScrn key combination on the keyboard.

Power indicator LED on the board. board. Failure to do so could damage the board and any attached devices. Figure 7. Location of the Standby Power LED (Green)

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 16 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (32 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI Express add-in cards (256 MB) The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Figure 8. Detailed System Memory Address Map

Intel Desktop Board DH61WW Technical Product Specification

2.1.2 Memory Map

Error! Reference source not found. lists the system memory map. Table 9. System Memory Map

1024 K – 16777216 K 100000 – 400000000 16382 MB Extended memory

960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS

896 K - 960 K E0000 - EFFFF 64 KB Reserved

800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS

memory (open to the PCI bus). Dependent on video adapter used.

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS

639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

memory manager software)

512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory

0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

2.2 Connectors and Headers

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, and PS/2. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. This section describes the board’s connectors. The connectors can be divided into these groups:

• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 42)

2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors for the board. Figure 9. Back Panel Connectors

2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers Table 10 lists the component-side connectors and headers identified in Figure 10.

Table 10. Component-side Connectors and Headers Shown in Figure 10 A Conventional PCI bus add-in card connector B Chassis intrusion header C S/PDIF header D PCI Express x1 add-in card connector E PCI Express x16 bus add-in card connector F 12 V internal power connector (ATX12V) G Rear chassis fan header H Processor fan header I LPC Debug header J TPM header K Main power connector (2 x 12) L SATA connectors M Front panel header N Serial port header O Front panel USB 2.0 header P Front panel audio header

2.2.2.1 Signal Tables for the Connectors and Headers

Table 11. TPM Header

1 CK_33M_TPM_DIP 2 Ground

3 LFRAME# 4 Key (no pin)

5 PLTRST# 6 No connection

7 LAD3 8 LAD2

11 LAD0 12 Ground

13 No connection 14 No connection

17 Ground 18 TPM_CLKRUN#

19 LPCPD# 20 No connection

Table 12. Serial Port Header

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)

3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)

5 Ground 6 DSR (Data Set Ready)

7 RTS (Request To Send) 8 CTS (Clear To Send)

9 RI (Ring Indicator) 10 Key (no pin)

Table 13. S/PDIF Header

1 Ground

2 S/PDIF out

3 Key (no pin)

Table 14. Front Panel Audio Header for Intel HD Audio

7 SENSE_SEND (Jack detection) 8 Key (no pin)

Table 15. Front Panel Audio Header for AC ’97 Audio

1 MIC 2 AUD_GND

3 MIC_BIAS 4 AUD_GND

5 FP_OUT_R 6 FP_RETURN_R

7 AUD_5V 8 KEY (no pin)

9 FP_OUT_L 10 FP_RETURN_L

Table 16. Front Panel USB Header

3 D- 4 D-

5 D+ 6 D+

7 Ground 8 Ground

9 KEY (no pin) 10 No Connect

Table 17. SATA Connectors

2 TXP

3 TXN

4 Ground

5 RXN

6 RXP

7 Ground

Table 18. Chassis Intrusion Header

1 Intruder#

2 Ground

Table 19. Fan Headers

1 Ground 3 Ground

3 FAN_TACH 1 FAN_TACH

4 FAN_CONTROL N/A N/A

2.2.2.2 Add-in Card Connectors

• PCI Express 2.0 x16: one PCI Express 2.0 x16 connector. This connector supports simultaneous transfer speeds of up to 8 GB/s of peak bandwidth per direction.
• PCI Express 2.0 x1: one PCI Express 2.0 x1 connector. The x1 interface supports simultaneous transfer speeds up to 1 GB/s of peak bandwidth per direction and up to 2 GB/s concurrent bandwidth.
• One Conventional PCI (rev 2.3 compliant) connector. Note the following considerations for the Conventional PCI bus connector:
• The Conventional PCI bus connector is bus master capable.
• SMBus signals are routed to the Conventional PCI bus connector. This enables Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:  The SMBus clock line is connected to pin A40.  The SMBus data line is connected to pin A41.

2.2.2.3 Power Supply Connectors

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting. CAUTION If a high power (75 W or greater) add-in card is installed in the PCI Express x16 connector, that card must also be connected directly to the power supply. Failure to do so may cause damage to the board and the add-in card.

Table 20. Processor Core Power Connector

1 Ground 2 Ground

Table 21. Main Power Connector

3 Ground 15 Ground

5 Ground 17 Ground

7 Ground 19 Ground

8 PWRGD (Power Good) 20 −5 V (obsolete)

24 Ground (Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Intel Desktop Board DH61WW Technical Product Specification

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 22. Front Panel Header Hard Drive Activity LED Power LED

1 HD_PWR Out Hard disk LED

2 FP_LED+ Out Front panel green

3 HDA# Out Hard disk active

4 FP_LED− Out Front panel yellow

Reset Switch On/Off Switch

5 Ground Ground 6 PWR# In Power switch

7 FP_RESET# In Reset switch 8 Ground Ground

9 +5 V Power 10 N/C Not connected Figure 11. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

a SATA hard drive or optical drive connected to an onboard SATA connector.

2.2.2.4.2 Reset Switch Header

2.2.2.4.3 Power LED Header

states for this LED. More options are available through BIOS setup. Table 23. States for a One-Color Power LED

2.2.2.4.4 Power Switch Header

2.2.2.5 Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.

• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Headers

2.2.2.6 Low Pin Count (LPC) Debug Header

to Section 4.5 on page 67 for a description of the POST codes). contents on a medium such as a seven-segment display. Table 24. LPC Debug Header

1 CK_33M_DEBUG 2 GND

3 PLTRST# 4 LFRAME#

5 LAD0 6 LAD1

7 LAD2 8 LAD3

9 GND 10 GND

2.3 BIOS Configuration Jumper Block

modes: normal, configure, and recovery. Figure 13. Location of the Jumper Block

Intel Desktop Board DH61WW Technical Product Specification T able 25. BIOS Setup Configuration Jumper Settings Function/Mode Jumper Setting Configuration Normal 1-2 The BIOS uses current configuration information and passwords for booting. Configure 2-3 After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values. Recovery None The BIOS attempts to recover the BIOS configuration. A recovery CD or USB flash drive is required.

2.4 Mechanical Considerations

2.4.1 Form Factor

mounting holes are in compliance with the ATX specification. Figure 14. Board Dimensions

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

Additional power required will depend on configurations chosen by the integrator.

• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances For example, for a system consisting of a supported 95 W processor (see Section 1.4 on page 16 for information on supported processors), 2 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 460 W. Table 26 lists the recommended power supply current values.

Table 26. Recommended Power Supply Current Values

2.5.2 Fan Header Current Capability

component damage that will halt fan operation. Table 27 lists the current capability of the fan headers. Table 27. Fan Header Current Capability

2.5.3 Add-in Board Considerations

Intel Desktop Board DH61WW Technical Product Specification

2.6 Thermal Considerations

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is required. Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION The ambient temperature must not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit.

2.7 Reliability

predicted data at 55 ºC. The MTBF for the board is 324,824 hours.

2.8 Environmental

Table 29 lists the environmental specifications for the board. Table 29. Environmental Specifications

3.1 Introduction

The board uses an Intel BIOS that is stored in a 32 Mbit (8.192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as BEH6110H.86A. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Configuration Performance Security Power Boot Exit NOTE The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 51 shows how to put the board in configure mode.

Intel Desktop Board DH61WW Technical Product Specification Table 30 lists the BIOS Setup program menu features. Table 30. BIOS Setup Program Menu Bar

features

Memory, Bus and Processor overrides Sets passwords and security Table 31 lists the function keys available for menu screens. Table 31. BIOS Setup Program Function Keys <←> or <→> Selects a different menu screen (Moves the cursor left or right) <↑> or <↓> Selects an item (Moves the cursor up or down) <Tab> Selects sub-items within a field (i.e., date/time) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current values and exits the BIOS Setup program <Esc> Exits the menu

3.2 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.3 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

Intel Desktop Board DH61WW Technical Product Specification

3.4 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
• Intel® F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper. Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS. NOTE Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to BIOS update utilities http://www.intel.com/support/motherboards/desktop/sb/CS- 022312.htm.

3.4.1 Language Support

The BIOS Setup program and help messages are supported in US English.

3.4.2 Custom Splash Screen

available from Intel can be used to create a custom splash screen.

3.5 BIOS Recovery

be made bootable however, it must contain the motherboard .bio file at the root level. Table 32. Acceptable Drives/Media Types for BIOS Recovery

3.6 Boot Options

3.6.1 Optical Drive Boot

optical drive is listed as a boot device. Boot devices are defined in priority order. to boot from the next defined drive.

3.6.2 Network Boot

onboard LAN or a network add-in card with a remote boot ROM installed.

3.6.3 Booting Without Attached Devices

• Video adapter
• Keyboard
• Mouse

3.6.4 Changing the Default Boot Device During POST

Table 33. Boot Device Menu Options

4.1 Speaker

4.2 BIOS Beep Codes

piezoelectric speaker to beep an error message describing the problem (see Table 34). Table 34. BIOS Beep Codes for eight beeps, followed by system shut down.

4.3 Front-panel Power LED Blink Codes

panel power LED to blink an error message describing the problem (see Table 35). Table 35. Front-panel Power LED Blink Codes

4.4 BIOS Error Messages

Table 36 lists the error messages and provides a brief description of each. Table 36. BIOS Error Messages CMOS Battery Low The battery may be losing power. Replace the battery soon. been corrupted. Run Setup to reset values. was removed, then memory may be bad. No Boot Device Available System did not find a device to boot.

4.5 Port 80h POST Codes

port 80h. This code is useful for determining the point where an error occurred. LPC Debug header in Figure 1.

• Table 37 lists the Port 80h POST code ranges
• Table 38 lists the Port 80h POST codes themselves
• Table 39 lists the Port 80h POST sequence NOTE In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 37. Port 80h POST Code Ranges 0x00 – 0x05 Entering SX states S0 to S5. 0x70 – 0x7F Output devices: All output consoles. 0x90 – 0x9F Input devices: Keyboard/Mouse. critical since consoles should be up at this point.

Table 38. Port 80h POST Codes

Table 38. Port 80h POST Codes (continued)

Table 39. Typical Port 80h POST Sequence

21 Initializing a chipset component

22 Reading SPD from memory DIMMs

23 Detecting presence of memory DIMMs

25 Configuring memory

28 Testing memory

34 Loading recovery capsule

12 Starting application processor initialization

13 SMM initialization

50 Enumerating PCI busses

51 Allocating resourced to PCI bus

92 Detecting the presence of the keyboard

90 Resetting keyboard

94 Clearing keyboard input buffer

95 Keyboard Self Test

58 Resetting USB bus

01 INT 19

00 Ready to boot

5 Regulatory Compliance and Battery

5.1 Regulatory Compliance

• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings

5.1.1 Safety Standards

Table 40 when correctly installed in a compatible host system. Table 40. Safety Standards

Intel Desktop Board DH61WW Technical Product Specification

5.1.2 European Union Declaration of Conformity

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DH61WW is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions. This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC. Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. 中文 作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰 当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board DH61WW Technical Product Specification Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc. Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc. 日本語 インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。 対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in tel/other/ehs/product_ecology （英語）をご覧ください。 Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

положениях и условиях и т.д.

5.1.4 EMC Regulations

Table 41 when correctly installed in a compatible host system. Table 41. EMC Regulations VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.

Intel Desktop Board DH61WW Technical Product Specification FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1- 800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use. Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. Korea Class B Statement Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..

Intel Desktop Board DH61WW Technical Product Specification 5.1.5 e-Standby and ErP Compliance Intel Desktop Board DH61WW meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2013 (ErP) Lot 6 For information about Refer to Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02 /pg02100300.asp European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainable- product-policy/ecodesign/index_en.htm

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DH61WW has the regulatory compliance marks shown in Table 42. Table 42. Regulatory Compliance Marks number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Low Voltage directive, and RoHS directive. supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark. Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. been determined to be 10 years.

Intel Desktop Board DH61WW Technical Product Specification

5.2 Battery Disposal Information

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς. VIGYÁZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board DH61WW Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel Desktop Board DH61WW Technical Product Specification