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Document overview

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Technical content

Features

  • High to low side isolation of 1000V
  • Common-mode dv/dt immunity of greater than 50V/nanosecond
  • On-chip generated negative gate drive
  • Overcurrent protection by means of desaturation detection
  • Under voltage lockout
  • Fault indication output for system diagnostic
  • Optimized power circuit layout
  • High side bootstrap supply
  • Sockets for freewheeling fast recovery diodes (FREDS)
  • Flexibility of power level utilization
  • 5V compatible HCMOS input logic with hysterisis
  • Protection from cross conduction of the half bridge
  • Simple, fast and low cost means of evaluation and design
  • Option for using IXDP630 with RC oscillator or IXDP631 with crystal oscillator for improved dead time accuracy.
  • Three phase operation with the ability to attach additional slave driver boards. First Release Copyright © IXYS CORPORATION 2003 Introduction The EVBD4400 evaluation board implements a single power phaseleg circuit on a double sided PCB with ground plane, using the proven ISOSMART TM HALF BRIDGE DRIVER CHIPSET - IXBD4410, IXBD4411, IXDP630. The IXDP631 is optional. This board includes all parts required for the circuit implementation so that you can just follow the instructions in this document and connect the board to the load and power. The kit consists of an assembled and tested PCB with two power devices. Any power circuit is layout sensitive. The layout of this kit is a proven, working layout. The designer is invited to duplicate this layout in his system, following the evaluation of the driver chipset. Most systems vary in their power level requirements and therefore the power devices used. Due to this fact and fluctuations in availability of power devices, the kit will not always include the same power devices. The designer is encouraged to use the power devices that are required for his system. The devices that are enclosed serve only for initial evaluation. DS99026A(07/03) HALF BRIDGE DRIVER Evaluation Board EVBD4400 Figure 1: EVBD4400 Assembled PC board

ASSEMBLY: Figure 3 is a complete schematic diagram of the board. This schematic indicates an application using MOSFET's. When IGBT are used, freewheeling diodes (D4&D5) are typically added. To assemble the kit, simply solder the MOSFET power devices included or install devices specific to your appli- cation. Note gate, drain, source orientation of power devices when installing on the PC board. NOTES: a) The ICs and Power devices are static sensitive and require special handling. b) Use any power device that is suitable for your applica- tion. The PCB was designed to accept devices with TO- 247 packages. Two IXYS power devices are included in the kit with their data sheet. D4 and D5 are required only if Q1 and Q2 are IGBTs, and thus are not included in your kit. (A recommendation for D4 & D5 is in the Bill of Materials). D6, D7 footprints provide a smaller package or footprint option. g) Dead time is provided by timing components R17, C22 and is fixed at roughly 2.5 µ. See IXDP630 data sheet for calculation and modification of the dead time value. c) Use any convenient method of interconnection at GND, Q1-D, Q2-S,DC-BUS. The hole spacing is a standard 5.08mm and will fit common terminal blocks. (A recom- mendation for a connector 'P2' that the PCB will accept is in the Bill of Materials and is available from Digi-Key among others). d) For fault detection, R2 is pulled up to the supply voltage of the front end logic. If the FLT (fault) signal is to be sensed by TTL logic, remove R2 and connect FLT externally from P1-5 to +5V through a pull up resistor. e) For half bridge applications, insert a jumper between Q1-D and Q2-S. DATA SHEETS: The following list provides direct web links for the IXYS devices included with this kit. Please visit the IXYS web site at www.ixys.com for a complete overview of the entire IXYS product line. IXTH 6N90 Power MOSFETS: http://www.ixys.com/91543.pdf IXDB4410/11 Half Bridge Driver Chip Set: http://www.ixys.com/96528.pdf IXDP630 Digital Dead Time Generator http://www.ixys.com/98568.pdf TX02-4400 Interface Transformer http://www.ixys.com/99016.pdf It is also possible to construct your own pulse transformers from scratch using the guidelines presented in the discus- sion located at http://www.ixys.com/t092702.pdf. f) The gate resistors, R6 and R11, will depend on the power device size that is used. Twenty two ohm resistors are installed and should work for most applications.

Reference Qty. Description Mfr. Part No. U1 1 Low side gate driver I.C. IXYS IXBD4410PI U2 1 High side gate driver I.C IXYS IXBD4411PI U3 1 Dead time generator I.C. (IXDP631 optional) IXYS IXDP630 U4 1 5V regulator National Semi. LM78L05ACZ D1 1 1A, 1000V high speed diode ITS BYT11-1000 U1, U2 2 16 pin socket Assmann A16-LC-TT U3 1 18 pins socket Assmann A18-LC-TT D2, D3 2 20V, 1A Shottky diode Diodes Inc 1N5817 Q1, Q2 2 High voltage power device IXYS IXTH6N90 T1 1 Interface transformer IXYS TX02-4400PI R1 1 10 ohm, 1/4 W resistor R15, 16 2 4.7ohm, 1/4 W resistors R3, 4, 6, 11 4 22 ohm, 1/4 W resistors R5, 10 2 68 ohm, 1/4 W resistors R7, 12 2 4.7k ohm, 1/4 W resistors R2, 18, 19 3 10k ohm, 1/4 W resistor R8, 9, 13, 14 4 510k ohm, 1 W resistors R17 1 3k ohm, 1/4 W IXDP630 osc timing resistor C22 1 82pF IXDP630 osc timing cap C2,3,7,9,11,13, 21 7 .1mF, 50V, ceramic cap Panasonic C5, 6, 16,17,18,19 6 .022mF, 50V, cermaic cap Panasonic C8,12, 20 3 .01mF, 50V, ceramic cap Panasonic C1,4,10,14 4 10mF, 25V, alum elect cap Panasonic C15 1 .1mF, 1000V, ceramic cap Sprague 10GAP10 P1 1 8 pin header (cut into a 8 pin header) Berg 68000-236 JP1, JP2 2 2 pin header/ jumpers (cut into 2 pin headers) Berg 68000-236 NOT INCLUDED: U3 1 Crystal based dead time generator IXYS IXDP631 D4, D5 2 12A, 1000V fast recovery diode IXYS DSEI12-10A P2 1 4 pole terminal block Altech Corp. AKZ250/4 R17 1 1M ohm, 1/4 W IXDP631 osc load resistor C22, 23 2 Crystal load capacitors, 22pF 50V ceramic Panasonic Y1 1 Crystal for IXDP631 operation Pletronics

OPERATION: For performance evaluation and power system design please note the following: a) The assembled board can be ran with the IXDP630/631 removed by applying comple- mentary 5V square waves with proper "dead time" to the input pins INL (P1-3) and INH (P1- 2). For standard IXDP630 operation, R17 and C22 have been loaded with their respec- tive values represented on the bill of materi- als. These values are for demonstration and may not be appropriate for your application. Change values as needed. For IXDP631 operation, load R17, C22, C23 with the rec- ommended load components as outlined in the IXDP630/631 data sheet along with the crystal at the frequency of choice. R17 and C22 serve a dual purpose depending on which dead timer is selected. d) Figure 4 shows the load terminated at point A. This point could be connected to a number of places depending on the application. For ex- ample: Connection to ground will test the high side device. Connection to DC BUS will test the low side device. It could also be connected to the center point of a capacitive divider (UPS systems). e) Figure 5 shows a three phase power system implementation with a load configured in a Y (star). It could also be configured in a DELTA configuration. Please note the grounding scheme. Cut the connection between "ground plane 2" and "ground plane 4" on the compo- nents side of the PCB and solder a 10 Ohm resistor between these ground planes. The GND of each board is terminated to a single ground point. c) Before using the PCB at full power or at- tempting a short circuit test, make sure that a proper high voltage electroytic capacitor is connected between DC BUS and GND as shown in Figure 4. The leads to this capacitor should be as short as possible to minimize any stray inductance. b) Be careful with ground connections. Avoid ground loops. In general, connect the grounds as shown in Figure 4 to minimize ground bounce effects. This is particularly important when three "High/Low side driver design kits" are connected together with a single IXDP630 to form a three phase drive system, such as that shown in Figure 5. To add phases 'S' and / or 'T', enable phases with jumpers at JP1 and/or JP2 and apply PWM phase drive signals to TP7 and/ or TP8 taking the respective complementary outputs from TP3 through TP6. Note that TP1-TP15 are through-hole pads that have been added to the board to serve as conve- nient solder and / or test points. If additional 'slave' boards are to be used for mutiple phase operation, R17 - R19, C20 - C23, and Y1 do not need to be installed on the addtional slave boards. The IXDP630 is hardwired for phase 'R' operation, see 630/631 data sheet, with pins OUTENA, ENAR, and RESET tied high. PWM drive input signal for ' R' phase is applied to P1-6.

8,1 5,4 414 + 10µF S G D IXFK90N20Q 4411 OUT Vdd Vee 8,1 5,4 414 + 10µF S G D IXFK90N20Q Figure 7: Boosting the 4410/11 outputs for larger MOSFETs.