DSSK60-0045 IXYS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- International standard package Very low V F Extremely low switching losses Low I RM -values Epoxy meets UL 94V-0
Applications
Rectifiers in switch mode power supplies (SMPS) Free wheeling diode in low voltage converters Advantages High reliability circuit operation Low voltage peaks for reduced protection circuits Low noise switching Low losses Dimensions see Outlines.pdf ACA DSSK 60-0045B IFAV = 2x30 A VRRM = 45 V VF = 0.44 V Symbol Conditions Maximum Ratings IFRMS 70 A IFAV TC = 120°C; rectangular, d = 0.5 30 A IFAV TC = 120°C; rectangular, d = 0.5; per device 60 A IFSM TVJ = 45°C; tp = 10 ms (50 Hz), sine 500 A EAS IAS = 18 A; L = 180 µH; TVJ = 25°C; non repetitive 46 mJ IAR VA =1.5 VRRM typ.; f=10 kHz; repetitive 1.8 A (dv/dt)cr 1000 V/ µs TVJ -55...+150 °C TVJM 150 °C Tstg -55...+150 °C Ptot TC = 25°C 115 W Weight typical 6 g 232 VRSM VRRM Type V V 45 45 DSSK 60-0045B Symbol Conditions Characteristic Values typ. max. IR c TVJ = 25°CV R = VRRM 20 mA TVJ = 100°CV R = VRRM 200 mA VF IF = 30 A; T VJ = 125°C 0.44 V IF = 30 A; T VJ =2 5 °C 0.50 V IF = 60 A; T VJ = 125°C 0.68 V R thJC 1.1 K/W R thCH 0.25 K/W
© 2002 IXYS All rights reserved 2 - 2 100 0 1 02 03 04 05 0 0.1 100 1000 10 30 5002 0 4 0 6 0 0.0001 0.001 0.01 0.1 1 10 0.01 0.1 04 0 8 0 1 2 0 1 6 0 IF(AV) TC IF(AV) t s K/W IFSM tP A 0 1 02 03 04 0 100 1000 10000 C TIR IF A VF VR VR V pF V mA A P(AV) W ZthJC V Single Pulse (Thermal Resistance) DSSK 60-0045B A µs 0.08 150°C 125°C 100°C 75°C 25°C TVJ = 150°C 125°C 25°C TVJ= 25°C d=0.5 d = DC 0.5 0.33 0.25 0.17 0.08 50°C D=0.5 0.33 0.25 0.17 DC DSSK 60-0045B Fig. 3 Typ. junction capacitance CT versus reverse voltage VR Fig. 2 Typ. value of reverse current IR versus reverse voltage VR Fig. 1 Maximum forward voltage drop characteristics Fig. 4 Average forward current IF(AV) versus case temperature TC Fig. 5 Forward power loss characteristics Fig. 6 Transient thermal impedance junction to case at various duty cycles Note: All curves are per diode 232