DSA30C200PC IXYS | Alldatasheet

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Low Loss and Soft Recovery High Performance Schottky Diode Common Cathode Schottky Diode Part number DSA30C200PC Backside: cathode FAV FV V 0.78 RRM 200 V = V I = A2x Features / Advantages: Applications: Package:

  • Very low Vf
  • Extremely low switching losses
  • Low Irm values
  • Improved thermal behaviour
  • High reliability circuit operation
  • Low voltage peaks for reduced protection circuits
  • Low noise switching
  • Rectifiers in switch mode power supplies (SMPS)
  • Free wheeling diode in low voltage converters TO-263 (D2Pak)
  • Industry standard outline
  • RoHS compliant
  • Epoxy meets UL 94V-0 The data contained in this product data sheet is ex clusively intended for technically trained staff. T he user will have to evaluate the suitability of th e product for the intended application and the completeness of the product data with respect to his application. The specifications of our compon ents may not be considered as an assurance of component characteristics. The information in the valid application- and assembly notes must be considered. Should you require produc t information in excess of the data given in this p roduct data sheet or which concerns the specific application of your product, please co ntact your local sales office. Due to technical requirements our product may conta in dangerous substances. For information on the typ es in question please contact your local sales offi ce. Should you intend to use the product in aviation, i n health or life endangering or life support applic ations, please notify. For any such application we urgently recommend - to perform joint risk and quality assessments; - the conclusion of quality agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures. Terms and Conditions of Usage IXYS reserves the right to change limits, condition s and dimensions. 20180713a Data according to IEC 60747and per semiconductor un less otherwise specified © 2018 IXYS all rights reserved

V = V Symbol Definition Ratings typ. max. IR V I A VF 0.94 R 1.75 K/W R min. VRSM V

250 T = 25°C VJ

T = °C VJ mA 2.5 V = V R T = 25°C VJ I = A F V T = °C C 155 Ptot 85 WT = 25°C C R K/W 200 max. non-repetitive reverse blocking voltage reverse current, drain current forward voltage drop total power dissipation Conditions Unit 1.10 T = 25°C VJ 125 VF0 V0.53 T = °C VJ 175 rF 10.8 mΩ V0.78 T = °C VJ I = A F V 0.95 I = A F 30 I = A F 30 threshold voltage slope resistance for power loss calculation only µA 125 VRRM V200 max. repetitive reverse blocking voltage T = 25°C VJ CJ 47 junction capacitance V = V 48 T = 25°C f = 1 MHz R VJ pF IFSM t = 10 ms; (50 Hz), sine; T = 45°C VJ max. forward surge current V = 0 V R T = °C VJ 175 320 A 200 FAV d = rectangular 0.5 average forward current thermal resistance junction to case thJC thermal resistance case to heatsink thCH Schottky 200 0.25 IXYS reserves the right to change limits, condition s and dimensions. 20180713a Data according to IEC 60747and per semiconductor un less otherwise specified © 2018 IXYS all rights reserved

Part No. Logo Assembly Code XXXXXXXXX IXYS Zyyww 000000 Assembly Line D S A C 200 PC Part description Diode Schottky Diode low VF Common Cathode TO-263AB (D2Pak) (2) DSA30C200IB TO-262 (I2Pak) (3) 200 Current Rating [A] Reverse Voltage [V] Package Top °C TVJ °C 175 virtual junction temperature -55 Weight g2 Symbol Definition typ. max. min. Conditions operation temperature Unit FC N60 mounting force with clip 20 IRMS RMS current 35 Aper terminal 150 -55 TO-263 (D2Pak) Similar Part Package Voltage class DSA30C200PB TO-220AB (3) 200 Delivery Mode Quantity Code No. Ordering Number Marking on Product Ordering DSA30C200PC 524405 Tape & Reel 800 DSA30C200PC Standard Tstg °C 150 storage temperature -55 threshold voltage V0.53 mΩ V0 max R0 max slope resistance * 7.6 Equivalent Circuits for Simulation T = VJ I V0 R0 Schottky 175 °C * on die level IXYS reserves the right to change limits, condition s and dimensions. 20180713a Data according to IEC 60747and per semiconductor un less otherwise specified © 2018 IXYS all rights reserved

W A c L E 2x e L1 D 321 3.81 (0.150) 1.78 (0.07) 2.54 (0.100) 3.05 (0.120) 10.92 (0.430) 9.02 (0.355) mm (Inches) Recommended min. foot print 3x b2 2x b H Supplier Option min max min max A 4.06 4.83 0.160 0.190 b 0.51 0.99 0.020 0.039 b2 1.14 1.40 0.045 0.055 c 0.40 0.74 0.016 0.029 c2 1.14 1.40 0.045 0.055 D 8.38 9.40 0.330 0.370 D1 8.00 8.89 0.315 0.350 E 9.65 10.41 0.380 0.410 E1 6.22 8.50 0.245 0.335 e H 14.61 15.88 0.575 0.625 L 1.78 2.79 0.070 0.110 L1 1.02 1.68 0.040 0.066 W typ. 0.02 0.040 typ. 0.0008 0.002 Dim. Millimeter Inches typ. 0.10 typ. 0.004 2.41 0.095 0.098 4.28 0.169 All dimensions conform with and/or within JEDEC standard. 2,54 BSC 0,100 BSC 2.5 1 2 3 Outlines TO-263 (D2Pak) IXYS reserves the right to change limits, condition s and dimensions. 20180713a Data according to IEC 60747and per semiconductor un less otherwise specified © 2018 IXYS all rights reserved