DSA30C200IB IXYS | Alldatasheet

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Low Loss and Soft Recovery High Performance Schottky Diode Common Cathode Schottky Diode Gen ² 1 2 3 Part number DSA30C200IB Backside: cathode FAV FVV 0.78 RRM 200 V= V I= A 2x Features / Advantages: Applications: Package:

  • Very low Vf
  • Extremely low switching losses
  • Low Irm values
  • Improved thermal behaviour
  • High reliability circuit operation
  • Low voltage peaks for reduced protection circuits
  • Low noise switching
  • Rectifiers in switch mode power supplies (SMPS)
  • Free wheeling diode in low voltage converters TO-262 (I2Pak)
  • Industry standard outline
  • RoHS compliant
  • Epoxy meets UL 94V-0 IXYS reserves the right to change limits, conditions and dimensions. 20131031bData according to IEC 60747and per semiconductor unless otherwise specified © 2013 IXYS all rights reserved

V = V Symbol Definition Ratings typ. max. IR V I A VF 0.94 R 1.75 K/ W R min. VRSM V 250T = 25°CVJ T = °CVJ mA2.5V = VR T = 25°CVJI = AF V T = °CC 155 Ptot 85 WT = 25°CC R K/W 200 max. non-repetitive reverse blocking voltage reverse current, drain current forward voltage drop total power dissipation Conditions Unit 1.10 T = 25°CVJ 125 VF0 V0.53T = °CVJ 175 rF 10.8 mΩ V0.78T = °CVJI = AF V 0.95 I = AF 30 I = AF 30 threshold voltage slope resistance for power loss calculation only µA 125 VRRM V200max. repetitive reverse blocking voltage T = 25°CVJ CJ 47junction capacitance V = V48 T = 25°Cf = 1 MHzR VJ pF IFSM t = 10 ms; (50 Hz), sine; T = 45°C VJmax. forward surge current V = 0 VR T = °CVJ 175 320 A 200 FAV d =rectangular 0.5 average forward current thermal resistance junction to casethJC thermal resistance case to heatsinkthCH Schottky 200 0.50 IXYS reserves the right to change limits, conditions and dimensions. 20131031bData according to IEC 60747and per semiconductor unless otherwise specified © 2013 IXYS all rights reserved

Part No. Logo Assembly Code abcd IXYS YYWWZ Assembly Line D S A C 200 IB Part number Diode Schottky Diode low VF Common Cathode TO-262 (I2Pak) (3) Current Rating [A] Reverse Voltage [V] Package Top °C TVJ °C175virtual junction temperature -55 Weight g1.5 Symbol Definition typ. max.min.Conditions operation temperature Unit FC N60mounting force with clip 20 I RMS RMS current 35 Aper terminal 150-55 TO-262 (I2Pak) Similar Part Package Voltage class DSA30C200PB TO-220AB (3) 200 Delivery Mode Quantity Code No.Part Number Marking on ProductOrdering DSA30C200IB 512200Tube 50DSA30C200IBStandard Tstg °C150storage temperature -55 threshold voltage V0.53 mΩ V0 max R0 max slope resistance * 7.6 Equivalent Circuits for Simulation T =VJ I V0 R0 Schottky 175 °C* on die level IXYS reserves the right to change limits, conditions and dimensions. 20131031bData according to IEC 60747and per semiconductor unless otherwise specified © 2013 IXYS all rights reserved

NOTE: 1. This drawing will meet all dimensions requirement of JEDEC outline TO-262 AA. 2. All metal surface are matte pure tin plated except trimmed area. 3. Inter locking slot depends upon frame type. Optional Note 3 123 E D L b c A1 e A 1 2 3 Outlines TO-262 (I2Pak) IXYS reserves the right to change limits, conditions and dimensions. 20131031bData according to IEC 60747and per semiconductor unless otherwise specified © 2013 IXYS all rights reserved