DSA2-12A IXYS | Alldatasheet
Document overview
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Technical content
Features
G International standard package G Axial wire connexions G Planar glassivated chips
Applications
G Field supply for DC motors G Power supplies G High voltage rectifiers Advantages G Space and weight savings G Simple PCB mounting G Improved temperature and power cycling G Reduced protection circuits Dimensions in mm (1 mm = 0.0394") Symbol Test Conditions Characteristic Values IR TVJ = 180°C; VR = VRRM /G163 2m A VF IF = 7 A; TVJ = 25/G176C /G1631.25 V VT0 For power-loss calculations only 0.85 V rT TVJ = TVJM 43 m /G87 R thJA Forced air cooling with 1.5 m/s, Tamb = 45/G176C 30 K/W Soldered between 2 cooling fins, Tamb = 45/G176C 37 K/W Soldered onto PC board (25 mm), Tamb = 45/G176C 75 K/W Free air cooling, Tamb = 45/G176C 115 K/W dS Creepage distance on surface 2.25 mm dA Strike distance through air 2.25 mm a Max. allowable acceleration 100 m/s 2 Data according to IEC 60747 IXYS reserves the right to change limits, test conditions and dimensions DS 2 DSA 2 Rectifier Diode Avalanche Diode A C A C C A
© 2000 IXYS All rights reserved 2 - 2 10-3 10-2 10-1 100 101 100 23 4 5 6 7 8 911 0 100 0123456789 20 40 60 80 100 120 140 160 10-3 10-2 10-1 100 101 102 103 104
100 I2 t
A IF A VF V t s t ms PF W PF W IFAVM A Tamb t s Z(th)t °C/W DS 2 DSA 2 R thJA for various conduction angles d: dR thJA (K/W) DC 75 180/G176 75.7 120/G176 76.1 60/G176 76.7 30/G176 77.4 Constants for ZthJA calculation: iR thi (K/W) t i (s) 1 0.15 0.001 2 10.85 0.1 36 4 3 5 Fig. 1 Forward characteristics Fig. 4 Power dissipation versus forward current and ambient temperature Fig. 5 Transient thermal impedance junction to ambient Fig. 2 Surge overload current I FSM : crest value, t: duration Fig. 3 I2t versus time (1-10 ms) TVJ= 180°C TVJ= 25°C 50Hz, 80%VRRM TVJ = 45°C TVJ = 180°C VR = 0 V TVJ=45°C TVJ=180°C typ. lim. RthJA :
30 K/W
37 K/W
45 K/W
75 K/W
115 K/W
180° sin 120° 60° 30°