DS2 IXYS | Alldatasheet

Document overview

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Technical content

Features

International standard package

  • Axial wire connexions
  • Planar glassivated chips

Applications

Low power rectifi ers

  • Field supply for DC motors
  • Power supplies
  • High voltage rectifi ers Advantages
  • Space and weight savings
  • Simple PCB mounting
  • Improved temperature and power cycling Reduced protection circuits Dimensions in mm (1 mm = 0.0394") Symbol Test Conditions Characteristic Values IR T VJ = 180°C; V R = VRRM ≤ 2 mA VF I F = 7 A; T VJ = 25°C ≤ 1.25 V VT0 For power-loss calculations only 0.85 V rT T VJ = T VJM 43 m Ω RthJA Forced air cooling with 1.5 m/s, T amb = 45°C 30 K/W Soldered between 2 cooling fi ns, T amb = 45°C 37 K/W Soldered onto PC board (25 mm), T amb = 45°C 75 K/W Free air cooling, T amb = 45°C 115 K/W dS Creepage distance on surface 2.25 mm dA Strike distance through air 2.25 mm a Max. allowable acceleration 100 m/s 2 Data according to IEC 60747 Rectifi er Diode Avalanche Diode A C C A A C

© 2017 IXYS All rights reserved 2 - 2 DS 2 DSA 2 IXYS reserves the right to change limits, test conditions and dimensions 20170323a 10 -3 10 -2 10 -1 10 0 10 1 100 2 3 4 5 6 7 8 91 10 100 0 1 2 3 4 5 6 7 8 9 20 40 60 80 100 120 140 160 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 4 100 I2 t A2s IFSM A IF A VF V t s t ms PF W PF W IFAVM A Tamb t s Z(th)t °C/W RthJA for various conduction angles d: d R thJA (K/W) DC 75 180 ° 75.7 120 ° 76.1 60 ° 76.7 30 ° 77.4 Constants for ZthJA calculation: i R thi (K/W) t i (s) 1 0.15 0.001 2 10.85 0.1 3 64 35 Fig. 1 Forward characteristics Fig. 4 Power dissipation versus forward current and ambient temperature Fig. 5 Transient thermal impedance junction to ambient Fig. 2 Surge overload current I FSM: crest value, t: duration Fig. 3 I 2t versus time (1-10 ms) TVJ = 180°C TVJ = 25°C 50Hz, 80%VRRM TVJ = 45°C TVJ = 180°C VR = 0 V TVJ =45°C TVJ =180°C typ. lim. RthJA :

30 K/W

37 K/W

45 K/W

75 K/W

115 K/W

180° sin 120° 60° 30°