DHG30IM600PC IXYS | Alldatasheet

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Technical content

Features / Advantages: typ. max. IFSM IR A V 200 I A VF 2.37 R 0.60 K/W VR = min. t = 10 ms Applications: VRRM V600 50TVJV° C = TVJ °C=m A 5 Package: Part number VR = TVJ =° CIF =A V TC = 95°Cd = Ptot 210 WTC °C= TVJ 150 °C-55 V I RRM = 600 TVJ = 45°C DHG 30 IM 600 PC V A 600 V600 max. repetitive reverse voltage reverse current forward voltage virtual junction temperature total power dissipation max. forward surge current Conditions Unit 3.18 TVJ °C=2 5 CJ junction capacitance V = V; T 125 VF0 V1.31TVJ = 150°C rF 29.2 Ω f = 1 MHz = °C 25 m V2.22TVJ =° CIF =A V 30 150 3.11 IF =A 60 IF =A 60 threshold voltage slope resistance for power loss calculation only Backside: cathode

12 ATVJ =° C

(50 Hz), sine t rr = 35 ns

  • Housing: High Performance Fast Recovery Diode Low Loss and Soft Recovery Single Diode TO-263 (D2Pak)
  • rIndustry standard outline
  • rEpoxy meets UL 94V-0
  • rRoHS compliant R VJ IRM max. reverse recovery current IF =A ;35 T= °CVJ -diF =A / µ s600/dttrr VR =V 400 TVJ =° C25 T= °CVJ µA 16400 pF thermal resistance junction to casethJC rectangular 0.5
  • Planar passivated chips
  • Very low leakage current
  • Very short recovery time
  • Improved thermal behaviour
  • Very low Irm-values
  • Very soft recovery behaviour
  • Avalanche voltage rated for reliable operation
  • Soft reverse recovery for low EMI/RFI
  • Low Irm reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch
  • Antiparallel diode for high frequency switching devices
  • Antisaturation diode
  • Snubber diode
  • Free wheeling diode
  • Rectifiers in switch mode power supplies (SMPS)
  • Uninterruptible power supplies (UPS) FAV average forward current FAV IXYS reserves the right to change limits, conditions and dimensions. 20081031Data according to IEC 60747and per diode unless otherwise specified

2008 IXYS all rights reserved

RthCH K/W0.25 Tstg °C150storage temperature -55 Weight g2 Symbol Definition Ratings typ. max.min.Conditions RMS current thermal resistance case to heatsink Unit I is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting the backside. FC N60mounting force with clip 20 Ordering Delivering Mode Base Qty Code Key Standard Part Name DHG 30 IM 600 PC 503501Tape & Reel 800 Product Marking Date Code Part No. Logo Order Code XXXXXXXXX IXYS yww abcd D H G IM 600 PC Part number Diode Sonic Fast Recovery Diode extreme fast Single Diode TO-263AB (D2Pak) (2) DHG30I600PA DHG30I600HA TO-220 TO-247 Similar Part Package Marking on Product DHG30IM600PC 600 600 Voltage Class Current Rating [A] Reverse Voltage [V] RMS IXYS reserves the right to change limits, conditions and dimensions. 20081031Data according to IEC 60747and per diode unless otherwise specified

A 4.06 4.83 0.160 0.190 b 0.51 0.99 0.020 0.039 b2 1.14 1.40 0.045 0.055 c 0.40 0.74 0.016 0.029 c2 1.14 1.40 0.045 0.029 D 8.38 9.40 0.330 0.370 D1 8.00 8.89 0.315 0.350 E 9.65 10.41 0.380 0.410 E1 6.22 8.13 0.245 0.320 e H 14.61 15.88 0.575 0.625 L 1.78 2.79 0.070 0.110 L1 1.02 1.68 0.040 0.066 L2 1.02 1.52 0.040 0.060 W typ. 0.02 0.040 typ. 0.0008 0.0016 All dimensions conform with and/or are within JEDEC standard. Dim. Millimeter Inches 2,54 BSC typ. 0.10 typ. 0.004 0,100 BSC Outlines TO-263 (D2Pak) IXYS reserves the right to change limits, conditions and dimensions. 20081031Data according to IEC 60747and per diode unless otherwise specified