D53427RKE

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Technical content

Datasheet sections

• 1 Product Description
• 1.1 Overview
• 1.1.1 Feature Summary
• 1.1.2 Board Layout (Top)
• 1.1.3 Board Layout (Bottom)
• 1.1.4 Block Diagram
• 1.2 Online Support
• 1.3 Processor
• 1.4 System Memory
• 1.4.1 Memory Configurations
• 1.5 Intel® QS77 Express Chipset
• 1.5.1 Direct Media Interface (DMI)
• 1.5.2 Display Interfaces
• 1.6 Graphics Subsystem
• 1.6.1 Integrated Graphics
• 1.6.2 USB
• 1.6.3 AHCI Mode
• 1.7 Real-Time Clock Subsystem
• 1.8 LAN Subsystem
• 1.8.1 Intel® 82579LM Gigabit Ethernet Controller
• 1.8.2 LAN Subsystem Software
• 1.8.3 RJ-45 LAN Connector with Integrated LEDs
• 1.9 Hardware Management Subsystem
• 1.9.2 Fan Monitoring
• 1.9.3 Thermal Solution
• 1.10 Power Management
• 1.10.1 ACPI
• 1.10.2 Hardware Support
• 1.11 Intel® Security and Manageability Technologies
• 1.11.1 Intel® vPro™ Technology
• 1.11.2 Intel® Small Business Technology

Datasheet sections

Intel® NUC Board D53427RKE Technical Product Specification May 2013 Order Number: G97389-001 The Intel NUC Board D53427RKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Board D53427RKE Specification Update.

Revision History

Revision Revision History Date

001 First release of the Intel® NUC Board D53427RKE Technical Product

This product specification applies to only the standard Intel® NUC Board with BIOS identifier RKPPT10H.86A. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel NUC Boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others. Copyright  2013, Intel Corporation. All rights reserved.

Board Identification Information Basic Intel® NUC Board D53427RKE Identification Information G87790-400 RKPPT10H.86A.0017 1,2 Notes: 1. The AA number is found on a small label on the component side of the board. 2. The Intel® QS77 PCH and Intel® Core™ i5-3427U processor used on this AA revision consists of the following components: Device Stepping S-Spec Numbers Intel Core i5-3427U L1 SR0N7 Intel BD82QS77 C1 5A002U Errata Current characterized errata, if any, are documented in a separate Specification Update. See www.intel.com/nextunitofcomputing for the latest documentation.

Intel NUC D53427RKE Technical Product Specification iv

v Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board D53427RKE. Intended Audience The TPS is intended to provide detailed, technical information about Intel NUC Board D53427RKE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter Description

1 A description of the hardware used on Intel NUC Board D53427RKE

2 A map of the resources of the Intel NUC Board

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. CAUTION Cautions are included to help you avoid damaging hardware or losing data.

Intel NUC D53427RKE Technical Product Specification vi Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kb Kilobit (1024 bits) kb/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mb Megabit (1,048,576 bits) Mb/s Megabits per second TDP Thermal Design Power xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their respective owners.

Intel NUC D53427RKE Technical Product Specification viii

2 Technical Reference

2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header . 53

3 Overview of BIOS Features

3.9

4 Error Messages and Blink Codes

Intel NUC D53427RKE Technical Product Specification x

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board. Table 1. Feature Summary

• Support for DDR3 1600 MHz and DDR3 1333 MHz SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory Chipset Intel® QS77 Express Chipset consisting of the Intel® QS77 Express Platform Controller Hub (PCH) Graphics • Integrated graphics support for processors with Intel® Graphics Technology: ― One High Definition Multimedia Interface* (HDMI*) back panel connector ― Two mini DisplayPort* back panel connectors Audio Intel® High Definition Audio via the HDMI v1.4a and DisplayPort 1.1a interfaces through the PCH Peripheral Interfaces
• USB 2.0 ports: ― Two front panel ports are implemented through one dual-port internal header ― Two ports are implemented with vertical back panel connectors ― One port is reserved for the PCI Express* Half-Mini Card ― One port is reserved for the PCI Express Full-Mini Card
• One front panel USB 3.0 port is implemented through an external connector (blue) Expansion Capabilities
• One PCI Express Half-Mini Card connector
• One PCI Express Full-Mini Card connector Intel® Visual BIOS • Intel® Visual BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) continued

Table 1. Feature Summary (continued)

• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Simple fan speed control Intel® Security and Manageability Technologies
• Intel® Active Management Technology (Intel® AMT) 8.0
• Intel® Virtualization (Intel® VT)
• Intel® Virtualization for Directed I/O (Intel® VT-d)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Identity Protection Technology (Intel® IPT)
• Intel® Anti-Theft Technology (Intel® AT)
• Trusted Platform Module (TPM)
• Intel® Small Business Technology (Intel® SBT)

1.1.2 Board Layout (Top)

Figure 1. Major Board Components (Top)

Table 2 lists the components identified in Figure 1. Table 2. Components Shown in Figure 1

1.1.3 Board Layout (Bottom)

Figure 2. Major Board Components (Bottom)

Intel NUC D53427RKE Technical Product Specification Table 3. Components Shown in Figure 2

Description

B PCI Express Full-Mini Card connector C PCI Express Half-Mini Card connector D Front panel dual-port USB 2.0 header E Front panel USB 3.0 port F BIOS setup configuration jumper G Front panel header H Intel® Management Engine BIOS Extension (Intel® MEBX) Reset header I DDR3 SO-DIMM 2 socket J DDR3 SO-DIMM 1 socket K Internal DC power connector

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board. Figure 3. Block Diagram

Intel NUC D53427RKE Technical Product Specification

1.2 Online Support

To find information about… Visit this World Wide Web site: Intel NUC Board D53427RKE http://www.intel.com/products/motherboard/index.htm NUC Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel NUC Board D53427RKE http://ark.intel.com Chipset information https://www- ssl.intel.com/content/www/us/en/chipsets/performance- chipsets/chipsets.html BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS- 025414.htm Integration information http://www.intel.com/support/go/buildit

1.3 Processor

The board has a soldered-down Intel Core i5-3427 processor with Integrated Graphics Technology and integrated memory controller. NOTE This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 56 for information on power supply requirements for this board.

1.4 System Memory

• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts
• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 41 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 1024 MB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR3 1600 MHz and DDR3 1333 MHz SDRAM SO-DIMMs NOTE To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency. Table 4 lists the supported SO-DIMM configurations.

Table 4. Supported Memory Configurations

1024 MB SS 1 Gbit 128 M x8/empty 8

2048 MB DS 1 Gbit 128 M x8/128 M x8 16

2048 MB SS 2 Gbit 256 M x8/empty 8

4096 MB DS 2 Gbit 256 M x8/256 M x8 16

4096 MB SS 4 Gbit 512 M x8/empty 8

8192 MB DS 4 Gbit 512 M x8/512 M x8 16

single-sided memory modules (containing one row of SDRAM).

Intel NUC D53427RKE Technical Product Specification

1.4.1 Memory Configurations

The processor supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used. For information about… Refer to: Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs- 011965.htm

Intel NUC D53427RKE Technical Product Specification

1.5 Intel® QS77 Express Chipset

Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths. For information about Refer to The Intel QS77 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.5.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.

1.5.2 Display Interfaces

Display is divided between the processor and the PCH. The processor houses the memory interface, display planes, and pipes while the PCH has transcoder and display interface or ports. The PCH receives the display data over Intel® Flexible Display Interface (Intel® FDI) and transcodes the data as per the display technology protocol and sends the data through the display interface.

1.5.2.1 Intel® Flexible Display Interconnect (Intel® FDI)

Intel FDI connects the display engine in the processor with the display interfaces on the PCH. The display data from the frame buffer is processed in the display engine of the processor and sent to the PCH over the Intel FDI where it is transcoded as per the display protocol and driven to the display monitor.

1.5.2.2 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or unreceptive between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDMI).

1.6 Graphics Subsystem

The board supports graphics through Intel Graphics Technology.

1.6.1 Integrated Graphics

The board supports integrated graphics through Intel FDI.

1.6.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features  DirectX* 10.1 and OpenGL* 3.0 compliant  DirectX 11.0 CS4.0 only  Shader Model 4.0
• Video  High-Definition content at up to 1080p resolution  Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video formats  Intel HD Technology with Advanced Hardware Video Transcoding  Blu-ray* S3D via HDMI 1.4a  Dynamic Video Memory Technology (DVMT) 5.0 support  Support of up to 1.7 GB Video Memory with 4 GB and above system memory configuration

1.6.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.6.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi- channel digital audio on a single cable. Each port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the HDMI 1.4a specification.

1.6.1.3.1 Integrated Audio Provided by the HDMI Interface

• AC-3 - Dolby* Digital
• Dolby Digital Plus
• DTS-HD*
• Dolby TrueHD, DTS-HD Master Audio*, (Lossless Blu-ray Disc* Audio Format
• LPCM, 192 kHz/24-bit, 8 Channel

1.6.1.4 DisplayPort*

specification. There are two mini DisplayPort connectors on the back panel. rate with a 16:10 aspect ratio (WQXGA).

1.6.1.4.1 Integrated Audio Provided by the DisplayPort Interfaces

1.6.1.4.2 Triple Display Configurations

Table 5. Triple Display Configuration Resolutions

1.6.1.5 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or interception between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection over wired displays (HDMI and DisplayPort).

1.6.2 USB

The board supports USB 2.0/3.0 ports. The port arrangement is as follows:

• USB 2.0 ports:  Two front panel ports are implemented through one dual-port internal header  Two ports are implemented with vertical back panel connectors  One port is reserved for the PCI Express Half-Mini Card  One port is reserved for the PCI Express Full-Mini Card
• One front panel USB 3.0 port is implemented through an external connector (blue) All USB 2.0/3.0 ports are high-speed, full-speed, and low-speed capable. NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices. For information about Refer to The location of the USB connectors on the back panel Figure 9, page 43 The location of the front panel USB headers Figure 2, page 15

1.6.3 AHCI Mode

The board supports AHCI storage mode via the Intel QS77 Express Chipset. NOTE In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft Windows 7 and Windows 8 include the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process, however, it is always good practice to update the AHCI drivers to the latest available by Intel.

Intel NUC D53427RKE Technical Product Specification

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V STBY rail. NOTE If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579LM Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel QS77 Express Chipset
• RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• Jumbo frame support
• LAN connect interface between the PCH and the LAN controller
• Power management capabilities  ACPI technology support  LAN wake capabilities
• LAN subsystem software For information about Refer to LAN software and drivers http://downloadcenter.intel.com

1.8.1 Intel® 82579LM Gigabit Ethernet Controller

The Intel 82579LM Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer (PHY):  PCI Express-based interface for active state operation (S0) state  SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility

1.8.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers http://downloadcenter.intel.com

1.8.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5). Figure 5. LAN Connector LED Locations Table 6. LAN Connector LED States Off LAN link is not established. Blinking LAN activity is occurring. Off 10 Mb/s data rate is selected. Green 100 Mb/s data rate is selected. Yellow 1000 Mb/s data rate is selected.

1.9 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including thermal and voltage monitoring. For information about Refer to Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/

1.9.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on a Nuvoton NCT5577D embedded controller, which supports the following:

• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), +Vccp, PCH Vcc
• SMBus interface

1.9.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

1.9.3 Thermal Solution

Figure 6 shows the location of the thermal solution and processor fan header. Figure 6. Thermal Solution and Fan Header

1.10 Power Management

• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:  Power Input  Instantly Available PC technology  LAN wake capabilities  Wake from USB  WAKE# signal wake-up support  Wake from S5  +5 V Standby Power Indicator LED

1.10.1 ACPI

• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 9 on page 33)
• Support for a front panel power and sleep mode switch Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch Note: Depending on power management settings in the operating system.

1.10.1.1 System States and Power States

on user preferences and knowledge of how devices are being used by applications. Table 8. Power States and Targeted System Power

1. Total system power is dependent on the system configuration, including add-in boards and peripherals

powered by the system chassis’ power supply.

1. Dependent on the standby power consumption of wake-up devices used in the system.

1.10.1.2 Wake-up Devices and Events

Table 9. Wake-up Devices and Events

1. S4 implies operating system support only.
2. Wake from S4 and S5 is recommended by Microsoft.
3. Wake from device/event not supported immediately upon return from AC loss.
4. Wake on LAN is only supported from sleep (S3) or hibernate (S4) in Windows 8.

1.10.2 Hardware Support

• Wake from Power Button signal
• Instantly Available PC technology
• LAN wake capabilities
• Wake from USB
• WAKE# signal wake-up support
• Wake from S5
• +5 V Standby Power Indicator LED NOTE The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

Intel NUC D53427RKE Technical Product Specification

1.10.2.1 Power Input

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu. For information about Refer to The location of the internal power connector Figure 2, page 15 The signal names of the internal power connector Table 13, page 49

1.10.2.2 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to- RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 33 lists the devices and events that can wake the computer from the S3 state. The use of Instantly Available PC technology requires operating system support and drivers for any installed PCI Express add-in card.

1.10.2.3 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

1.10.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.10.2.5 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.10.2.6 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

computer appears to be off. Figure 7 shows the location of the standby power LED. board. Failure to do so could damage the board and any attached devices. Figure 7. Location of the Standby Power LED

Intel NUC D53427RKE Technical Product Specification

1.11 Intel® Security and Manageability

Intel® Security and Manageability Technologies provides tools and resources to help small business owners and IT organizations protect and manage their assets in a business or institutional environment. NOTE Software with security and/or manageability capability is required to take advantage of Intel platform security and/or management technologies.

1.11.1 Intel® vPro™ Technology

Intel® vPro™ Technology is a collection of platform capabilitie s that support enhanced manageability, security, virtualization and power efficiency. The key platform capabilities include:

• Intel ® Active Management Technology (Intel® AMT) 8.0
• Intel® Virtualization (Intel® VT)
• Intel® Virtualization for Directed I/O (Intel® VT-d)
• Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Identity Protection Technology (Intel® IPT)
• Intel® Anti-Theft Technology (Intel® AT)
• Trusted Platform Module (TPM) For information about Refer to Intel vPro Technology http://support.intel.com/support/vpro/

1.11.1.1 Intel® Active Management Technology

When used with third-party management and security applications, Intel Active Management Technology (Intel AMT) allows business owners and IT organizations to better discover, heal, and protect their networked computing assets. Some of the features of Intel AMT include:

• Out-of-band (OOB) system access, to discover assets even while PCs are powered off
• Remote trouble-shooting and recovery, which allows remote diagnosis and recovery of systems after OS failures
• Hardware-based agent presence checking that automatically detects and alerts when critical software agents have been stopped or are missing
• Proactive network defense, which uses filters to block incoming threats while isolating infected clients before they impact the network
• Remote hardware and software asset tracking, helping to track computer assets and keep virus protection up-to-date

• Keyboard, video and mouse (KVM) remote control, which allows redirection of a managed system’s video to a remote console which can then interact with it using the console’s own mouse and keyboard NOTE Intel AMT requires the computer system to have an Intel AMT-enabled chipset, network hardware and software, as well as connection with a power source, a corporate network connection, and an Intel AMT-enabled remote management console. Setup requires additional configuration of the platform. For information about Refer to Intel Active Management Technology http://www.intel.com/technology/platform- technology/intel-amt/index.htm

1.11.1.2 Intel® Virtualization Technology

Intel® Virtualization Technology (Intel® VT) is a hardware-assisted technology that, when combined with software-based virtualization solutions, provides maximum system utilization by consolidating multiple environments into a single server or client. NOTE A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT requires a computer system with a chipset, BIOS, enabling software and/or operating system, device drivers, and applications designed for this feature. For information about Refer to Intel Virtualization Technology http://www.intel.com/technology/virtualization/tec hnology.htm

1.11.1.3 Intel® Virtualization Technology for Directed I/O

Intel® Virtualization Technology for Directed I/O (Intel® VT-d) allows addresses in incoming I/O device memory transactions to be remapped to different host addresses. This provides Virtual Machine Monitor (VMM) software with:

• Improved reliability and security through device isolation using hardware assisted remapping.
• Improved I/O performance and availability by direct assignment of devices. For information about Refer to Intel Virtualization Technology for Directed I/O http://www.intel.com/technology/itj/2006/v10i3/2-io/4- virtualization-techniques.htm

Intel NUC D53427RKE Technical Product Specification

1.11.1.4 Intel® Trusted Execution Technology

Intel® Trusted Execution Technology (Intel® TXT) is a hardware security solution that protects systems against software-based attacks by validating the behavior of key components at startup against a known good source. It requires that Intel VT be enabled and the presence of a TPM. For information about Refer to Intel Trusted Execution Technology http://www.intel.com/content/www/us/en/architecture- and-technology/trusted-execution-technology/malware- reduction-general-technology.html

1.11.1.5 Intel® Identity Protection Technology

Intel® Identity Protection Technology (Intel® IPT) provides a simple way for websites and enterprises to validate that a user is logging in from a trusted computer. This is accomplished by using the Intel Manageability Engine embedded in the chipset to generate a six-digit number that, when coupled with a user name and password, will generate a One-Time Password (OTP) when visiting Intel IPT-enabled websites. Intel IPT eliminates the need for the additional token or key fob required previously for two-factor authentication. For information about Refer to Intel Identity Protection Technology http://ipt.intel.com

1.11.1.6 Intel Anti-Theft Technology

Intel® Anti-Theft (Intel® AT) provides local, tamper-resistant defense that works like a poison pill that disables the computer and access to its data even if the operating system (OS) is reimaged, a new hard drive is installed, or the computer is disconnected from the network. NOTE No computer system can provide absolute security under all conditions. Intel AT requires the computer system to have an Intel® AT-enabled chipset, BIOS, firmware release, software, and an Intel AT-capable Service Provider/ISV application and service subscription. The detection (triggers), response (actions), and recovery mechanisms only work after the Intel® AT functionality has been activated and configured. Certain functionality may not be offered by some ISVs or service providers and may not be available in all countries. Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof. For information about Refer to Intel Anti-Theft http://antitheft.intel.com/welcome.aspx

1.11.1.7 Trusted Platform Module (TPM)

The ST Micro ST33ZP24AR28PVSP version 1.2 revision 116 component is specifically designed to enhance platform security above-and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM shields unencrypted keys and platform authentication information from software-based attacks. For information about Refer to ST Micro TPM version 1.2 http://www.st.com/web/en/home.html

1.11.2 Intel® Small Business Technology

Intel® Small Business Technology (Intel® SBT) provides small businesses with security and productivity capabilities to help keep their PCs up-to-date, protected and running well. Intel SBT is the firmware component of Intel® Small Business Advantage (Intel® SBA) and includes this hardware functionality:

• Local Maintenance Timer – Enables applications to “wake-up” the host platform when it is powered down or in a sleep state.
• Local Software Monitor – Provides a common reporting mechanism to monitor applications running on the host operating system. For information about Refer to Intel Small Business Advantage http://www.intel.com/go/SBA

Intel NUC D53427RKE Technical Product Specification

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 16 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (128 Mb)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards (256 MB) The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Intel NUC D53427RKE Technical Product Specification

2.2 Connectors and Headers

Only the following connectors and headers have overcurrent protection: back panel and front panel USB. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Back panel I/O connectors
• On-board I/O connectors and headers (see page 44)

2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors for the board. Figure 8. Back Panel Connectors

2.2.2 Connectors and Headers (Bottom)

Figure 9. Connectors and Headers (Bottom)

Table 10 lists the connectors and headers identified in Figure 10. Table 10. Connectors and Headers Shown in Figure 10 A PCI Express Full-Mini Card connector B PCI Express Half-Mini Card connector C Front panel dual-port USB 2.0 header D Front panel header E Intel MEBX Reset header F Internal DC power connector

2.2.2.1 Signal Tables for the Connectors and Headers

Table 11. PCI Express Full-/Half-Mini Card Connector

1 WAKE#

3 Reserved

4 GND

5 Reserved

7 CLKREQ#

8 Reserved

9 GND

10 Reserved

11 REFCLK-

12 Reserved

13 REFCLK+

14 Reserved

15 GND

16 Reserved

17 Reserved

18 GND

19 Reserved

20 Reserved

21 GND

22 PERST#

23 PERn0

25 PERp0

26 GND

27 GND

29 GND

30 SMB_CLK

31 PETn0

32 SMB_DATA

33 PETp0

34 GND

35 GND

36 USB_D-

37 GND

38 USB_D+

Table 11. PCI Express Full-/Half-Mini Card Connector (continued)

40 GND

42 LED_WWAN#

43 GND (mSATA) NC

44 LED_WLAN#

45 Reserved (Intel AMT) C-Link_CLK*

46 LED_WPAN#

47 Reserved (Intel AMT) C-Link_DAT*

49 Reserved (Intel AMT) C-Link_RST*

50 GND

51 Reserved (mSATA) mSATA SEL

AMT Wake-on-LAN for wireless cards.

Table 12. Dual-Port Front Panel USB 2.0 Header

3 D− 4 D−

5 D+ 6 D+

7 Ground 8 Ground

9 KEY (no pin) 10 No Connect

2.2.2.2 Add-in Card Connectors

• One PCI Express Half-Mini Card
• One PCI Express Full-Mini Card

2.2.2.3 Power Supply Connectors

• External Power Supply – the board can be powered through a 19 V DC connector on the back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +19 (±10%) V DC and the shell is GND. The maximum current rating is 10 A.
• Internal Power Supply – the board can alternatively be powered via the internal 19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (±10%) VDC. The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex 5557-02R connector from the power supply.

Table 13. 19 V Internal Power Supply Connector

1 Ground

2.2.2.4 Front Panel Header

Table 14. Front Panel Header

1 HDD_POWER_LED Pull-up resistor

2 POWER_LED_MAIN [Out] Front panel LED

3 HDD_LED# [Out] Hard disk

4 POWER_LED_ALT [Out] Front panel LED

5 GROUND Ground 6 POWER_SWITCH# [In] Power switch

7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground

Figure 10. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

drive or optical drive connected to an onboard SATA connector.

2.2.2.4.2 Reset Switch Header

2.2.2.4.3 Power/Sleep LED Header

Table 15. States for a One-Color Power LED

2.2.2.4.4 Power Switch Header

Figure 12 is a connection diagram for the front panel USB 2.0 header.

• The +5 V DC power on the USB header is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.

Figure 11. Connection Diagram for Front Panel

2.3 BIOS Setup Configuration Jumper

Figure 13 shows the location of the BIOS Setup Configuration jumper. version in the BIOS and reports if the two match. Figure 12. Location of the BIOS Configuration Setup Jumper

Table 16 lists the settings for the jumper. Table 16. BIOS Setup Configuration Jumper Settings recovery CD or flash drive is required.

2.4 Intel® Management Engine BIOS Extension

• Return all Intel ME parameters to their default values.
• Reset the Intel MEBX password to the default value (admin). CAUTION Always turn off the power and unplug the power cord from the computer before installing an MEBX reset jumper. The jumper must be removed before reapplying power. The system must be allowed to reach end of POST before reset is complete. Otherwise, the board could be damaged. NOTE After using the MEBX Reset, a “CMOS battery failure” warning will occur during the next POST. This is expected and does not indicate a component failure.

Figure 13. Intel MEBX Reset Header Table 17. Intel MEBX Reset Header Signals

1 PCH_RTCRST_PULLUP

2 Ground

3 No connection

2.5 Mechanical Considerations

2.5.1 Form Factor

Figure 14. Board Dimensions

Intel NUC D53427RKE Technical Product Specification

2.6 Electrical Considerations

2.6.1 Power Supply Considerations

The external 19 V DC jack is the primary power input connector of Intel NUC Board D53427RKE. However, the board also provides an internal 1 x 2 power connector that can be used in custom-developed systems that have a custom internal power supply. The internal 1 x 2 power connector is a Molex 5566-2 header which accepts a Molex 5557-02R connector from the power supply. There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2 power connector. It is the system integrator’s responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used. Simultaneous connection of both external and internal power supply units could result in potential damage to the board, power supplies, or other hardware. System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen.

2.6.2 Fan Header Current Capability

Table 18 lists the current capability of the fan headers. Table 18. Fan Header Current Capability

2.7 Thermal Considerations

regulator area is recommended. processor and/or voltage regulator or, in some instances, damage to the board. result in a system with adequate thermal performance. temperature, see the environmental specifications in Section 2.8.

considering proper airflow to cool the board. Table 19. Thermal Considerations for Components Table 20. This is a requirement for sustained power dissipation equal to Thermal monitoring this thermal sensor is Tcontrol. Table 20. Tcontrol Values for Components

2.8 Reliability

repair rates and spare parts requirements. The MTBF for the board is 71,537 hours.

2.9 Environmental

Table 21 lists the environmental specifications for the board. Table 21. Environmental Specifications

3.1 Introduction

utility, LAN EEPROM information, and Plug and Play support. code. The initial production BIOSs are identified as RKPPT10H.86A. BIOS and reports if the two match. Figure 16. Intel Visual BIOS Home Screen

Intel NUC D53427RKE Technical Product Specification NOTE The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 52 shows how to put the board in configure mode.

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 128 Mb (16000 KB) flash memory device.

3.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu.

1. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel ® Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.

3.5 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel ® Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.
• Intel ® Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.
• Intel ® F7 switch during POST allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper. Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS. NOTE Review the instructions distributed with the upgrade utility before attempting a BIOS update. For information about Refer to BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb /CS-022312.htm

3.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.

3.5.2 Custom Splash Screen

available from Intel can be used to create a custom splash screen. If you add a custom splash screen, it will share space with the Intel branded logo.

3.6 BIOS Recovery

Table 22. Acceptable Drives/Media Types for BIOS Recovery

• NTFS (sparse, compressed, or encrypted files are not supported)
• FAT32
• FAT16
• FAT12
• ISO 9660 For information about Refer to BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm

3.7 Boot Options

3.7.1 Network Boot

onboard LAN or a network add-in card with a remote boot ROM installed.

3.7.2 Booting Without Attached Devices

• Video adapter
• Keyboard
• Mouse

3.7.3 Changing the Default Boot Device During POST

Table 23. Boot Device Menu Options

3.8 Hard Disk Drive Password Security Feature

resume, the system BIOS will automatically unlock drives on resume from S3. cycle until the Master Key or User hard disk drive password is submitted. drive password will cause a hard disk to be locked upon a system power-cycle. Table 24 shows the effects of setting the Hard Disk Drive Passwords. Table 24. Master Key and User Hard Drive Password Functions will continue with normal POST. A manual power cycle will be required to resume system operation. Security feature, the drive will not be accessible.

3.9 BIOS Security Features

• The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in length.
• To clear a set password, enter a blank password after entering the existing password. Table 25 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 25. Supervisor and User Password Functions Note: If no password is set, any user can change all Setup options.

Intel NUC D53427RKE Technical Product Specification

4.1 Front-panel Power LED Blink Codes

panel power LED to blink an error message describing the problem (see Table 26). Table 26. Front-panel Power LED Blink Codes Note: Disabled per default BIOS setup option.

4.2 BIOS Error Messages

Table 27 lists the error messages and provides a brief description of each. Table 27. BIOS Error Messages CMOS Battery Low The battery may be losing power. Replace the battery soon. been corrupted. Run Setup to reset values. was removed, then memory may be bad. No Boot Device Available System did not find a device to boot.

Intel NUC D53427RKE Technical Product Specification

5 Regulatory Compliance and Battery

5.1 Regulatory Compliance

• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings

5.1.1 Safety Standards

when correctly installed in a compatible host system. Table 28. Safety Standards

Intel NUC D53427RKE Technical Product Specification

5.1.2 European Union Declaration of Conformity

We, Intel Corporation, declare under our sole responsibility that the products Intel® NUC Board D53427RKE is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions. This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC. Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele. Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä. Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC. Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: printed wiring board assembly and lithium battery.

5.1.4 EMC Regulations

when correctly installed in a compatible host system. Table 29. EMC Regulations VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment. provide reasonable protection against harmful interference in a residential installation.

• Reorient or relocate the receiving antenna.

Regulatory Compliance and Battery Disposal Information

• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use. Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada. Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual. Korea Class B Statement Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.

Intel NUC D53427RKE Technical Product Specification 5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel NUC Board D53427RKE allows for a compliant system built to meet the following program requirements, including appropriate selection of an efficient power supply:

• ENERGY STAR v5.2, category B
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2013 (ErP) Lot 6
• ENERGY STAR v6.0 draft 3 NOTE ENERGY STAR denotes a system level energy specification, defined by the US Environmental Protection Agency, that relies upon all of the system's components, including processor, chipset, power supply, HDD, graphics controller, memory, etc. to meet the specification. For more information on ENERGY STAR Computers Program requirements version 5.2, go to: http://www.energystar.gov For information about Refer to ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02 /pg02100300.asp European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainable- product-policy/ecodesign/index_en.htm

5.1.6 Regulatory Compliance Marks (Board Level)

Intel NUC Board D53427RKE has the regulatory compliance marks shown in Table 30. Table 30. Regulatory Compliance Marks number for Intel NUC Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Low Voltage directive, and RoHS directive. supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark. Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025.

Intel NUC D53427RKE Technical Product Specification

5.2 Battery Disposal Information

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRÉCAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement. FORHOLDSREGEL Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning. OBS! Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning. VIKTIGT! Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna. VARO Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti. VORSICHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend. AVVERTIMENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante. WAARSCHUWING Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving. ATENÇÃO Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região. AŚCIAROŽZNAŚĆ Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі. UPOZORNÌNÍ V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí. Προσοχή Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς. VIGYÁZAT Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel NUC D53427RKE Technical Product Specification AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska. PRECAUŢIE Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului. ВНИМАНИЕ При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям. UPOZORNENIE Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia. POZOR Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi. UYARI Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır. OСТОРОГА Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel NUC D53427RKE Technical Product Specification