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Technical content

Features

  • Load Current up to 20Arms with 5°C/W Heat Sink  800VP Blocking Voltage Creepage Pin 1 to Pin 2 of 0.225 inch (5.715 mm)  5mA Control Current  Zero-Cross Switching  2500Vrms Isolation, Input to Output Creepage Pin 2 to Pin 3 of 0.375 inch (9.525 mm)  DC Control, AC Output  Optically Isolated  TTL and CMOS Compatible  Low EMI and RFI Generation  High Noise Immunity  Machine Insertable, Wave Solderable

Applications

 Lighting  Tungsten Load: 4.75A (Free Air), 15A (Heat Sink)  Electrical Ballast: 5A (Free Air), 15A (Heat Sink)  Programmable Control  Process Control  Power Control Panels  Remote Switching  Gas Pump Electronics  Contactors  Large Relays  Solenoids  Motors: 1/3HP (Free Air), 1/2HP (Heat Sink)  Heaters Approvals  UL 508 Recognized Component: File E69938 See “UL Approved Ratings” on page 4.

Description

CPC40055ST is an AC Solid State Switch utilizing dual power SCR outputs. This device includes zero-cross turn-on circuitry and is specified with an 800V P blocking voltage. Tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide exceptional noise immunity and 2500V rms of isolation. As a result, the CPC40055ST is well suited for industrial environments where electromagnetic interference would disrupt the operation of communications and control systems. The unique SuperSIP package pioneered by IXYS Integrated Circuits Division allows Solid State Relays to achieve the highest load current currently available in any similar-sized package. This package features a unique process in which the silicon chips are soft soldered onto the ceramic Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500V rms isolation but also very low junction-to-case thermal resistance (0.35 °C/W).

Ordering Information

Pin Configuration & Waveforms Parameter Rating Units AC Operating Voltage 20-280 VAC (Vrms) Load Current With 5°C/W Heat Sink 20 ArmsNo Heat Sink 5 On-State Voltage Drop 1.1 VP (at IL=2AP) Blocking Voltage 800 VP Thermal Resistance, Junction-to-Case, JC 0.35 °C/W Part Description CPC40055ST SuperSIP Package (13 per tube) – LED+ LEDAC Load ZC Control Load Current AC Line Voltage Across Relay CPC40055ST AC Power Switch

INTEGRATED CIRCUITS DIVISION R03 www.ixysic.com 2 CPC40055ST 1 .Specifications

1.1 Absolute Maximum Ratings @ 25°C

1 Derate linearly 1.33mW / °C. 2 Free air, no heat sink. Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.

1.2 Electrical Characteristics @ 25°C

1 Zero-cross first half-cycle @ < 100Hz. 2 Snubber circuits may be required at low power factors. 3 For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use IF 10mA. Symbol Min Max Units Blocking Voltage - 800 VP Reverse Input Voltage - 5 V Input Control Current - 50 mA Peak (10ms) - 1 A Input Power Dissipation 1 -1 5 0 mW T otal Power Dissipation 2 -4 . 4 W I2t for Fusing (1/2 Sine Wave, 60Hz) -2 0 0 A2s Isolation Voltage, Input to Output

60 Seconds - 2500 Vrms

ESD, Human Body Model - 4 kV Junction T emperature (TJ) -1 5 0 ° C Operational T emperature - 40 +85 °C Storage T emperature - 40 +125 °C Parameter Conditions Symbol Minimum Typical Maximum Units Output Characteristics Load Current Continuous No Heat Sink, V L=20-280Vrms IL 0.1 - 5 ArmsContinuous TC=25°C 0.1 - 40 Maximum Surge Current 1/2 Sine Wave, 60Hz IP -- 1 5 0 A Off-State Leakage Current VL=800V ILEAK -- 1 0 0 AP On-State Voltage Drop IL=2AP - -0 . 8 5 1 . 1 VP Off-State dV/dt IF=0mA dV/dt 1000 - - V/ s Switching Speeds Tu r n - O n IF=5mA ton -- 0 . 5 cyclesTu r n - O f f toff -- 0 . 5 Zero-Cross T urn-On Voltage 1 1st half-cycle - -6 . 8 2 0 Vsubsequent half-cycle -- - 5 Holding Current - IH -- 5 0 m A Latching Current - IL -- 7 5 m A Operating Frequency - -2 0 - 5 0 0 H z Load Power Factor for Guaranteed T urn-On 2 f=60Hz PF 0.25 - - - Input Characteristics LED Current to Activate 3 IL=1A Resistive, f=60Hz IF --5 m A Input Voltage to Deactivate - -0 . 8 - - V Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V Reverse Input Current VR=5V IR -- 1 0 A Input/Output Characteristics Capacitance, Input-to-Output - CI/O --3 p F

INTEGRATED CIRCUITS DIVISION 3 www.ixysic.com R03 CPC40055ST

2 Thermal Characteristics

2.1 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

2.2 Thermal Performance Data

Parameter Conditions Symbol Rating Units Thermal Resistance (Junction to Case) - JC 0.35 °C/W Thermal Resistance (Junction to Ambient) Free Air JA 27 °C/W Junction T emperature (Operating) - TJ -40 to +150 °C θCA = - θJC (TJ - TA) PD TJ = Junction Temperature (°C), TJ ≤ 150°C * TA = Ambient Temperature (°C) θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD = On-State Voltage (Vrms)  Load Current (Arms) * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. Heat Sink Rating Ambient Temperature (ºC) 0 1 02 03 04 05 06 07 0 809 0 Output Power (W) Output Power vs. Ambient Temperature Heat Sink 2ºC/W 5ºC/W 10ºC/W 15ºC/W No Heat Sink Load Current (Arms) 0 5 10 15 20 25 30 Output Power (W) Output Power vs. Load Current

INTEGRATED CIRCUITS DIVISION R03 www.ixysic.com 4 CPC40055ST

3 UL Approved Ratings

3.1 General Loads

3.2 Tungsten Lamp Load

3.3 Motor Load

3.4 Electronic Ballast Load

Note: *Heat Sink Used for UL Testing: Ohmite MA-302-55E Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 20 - 280 4.75 40 20 - 280 2.5 80 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 65 Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 20 - 280 4.75 40 20 - 280 2.5 80 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 65 Voltage (VAC) Current Surrounding Air Temperature (°C) 220 - 240 1/3 HP , 3.6 FLA 40 220 - 240 1/6 HP , 2.2 FLA 80 110 - 120 1/2 HP , 9.8 FLA (with Heat Sink*) 40 110 - 120 1/2 HP , 9.8 FLA (with Heat Sink*) 65 Voltage (VAC) Current (A) Surrounding Air Temperature (°C) 120 53 0 120 15 (with Heat Sink*) 40 120 10 (with Heat Sink*) 65

INTEGRATED CIRCUITS DIVISION 5 www.ixysic.com R03 CPC40055ST

4 Performance Data

The performance data shown in the graphs above is at 25°C and is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. LED Forward Voltage (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) On-State Voltage Drop (V) Device Count (N) On-State Voltage Drop (N=50, IL=2A, IF=5mA) LED Forward Current (mA) Device Count (N) LED Forward Current to Activate 1A Resistive Load (N=50, VL=120VAC/60Hz) Blocking Voltage (VP) 874 876 8788 8 0 882 884 886 Device Count (N) Typical Blocking Voltage Distribution (N=50) Zero-Cross Voltage (V) Device Count (N) Zero-Cross Voltage Distribution (N=50, IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Holding Current (mA) Holding Current vs. Temperature (IF=0mA, RL=1.9Ω) Temperature (ºC) -40 -20 0 20 40 60 80 100 Zero-Cross (V) 6.0 6.2 6.4 6.6 6.8 7.0 7.2 7.4 Zero-Cross vs. Temperature (IF=5mA, RL=120Ω) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current to Activate (mA)2.5 3.0 3.5 4.0 4.5 LED Current to Activate, Resistive (IL=1A, 60Hz) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current to Activate (mA)4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 LED Current to Activate, Inductive (IL=500mA, 60Hz, 400mH) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-State Voltage Drop (VP) 0.75 0.80 0.85 0.90 0.95 1.00 On-State Voltage Drop vs. Temperature IL=4AP IL=3AP IL=2AP IL=1AP

INTEGRATED CIRCUITS DIVISION R03 www.ixysic.com 6 CPC40055ST The performance data shown in the graphs above is at 25°C and is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. Load Frequency (Hz) 0 100 200 300 400 500 600 LED Forward Current (mA) 2.5 3.0 3.5 4.0 4.5 5.0 LED Forward Current to Activate vs. Load Frequency - Resistive Load (VL=67V, RL=10Ω, IL=4.91Arms) Load Frequency (Hz) 0 100 200 300 400 500 600 LED Forward Current (mA) 4.85 4.90 4.95 5.00 5.05 5.10 5.15 5.20 LED Forward Current to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=400mH/220Ω) Load Frequency (Hz) 0 100 200 300 400 500 600 LED Forward Current (mA) 5.10 5.12 5.14 5.16 5.18 5.20 LED Forward Current to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=196mH/110Ω) On-State Voltage Drop (V) Load Current (A) Typical Load Current vs. On-State Voltage Drop (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Breakdown Voltage (V) 800 850 900 950 1000 Breakdown Voltage vs. Temperature Time 1ms 10ms 100ms 1s 10s Surge Current (A) 100 150 200 250 300 Maximum Surge Current Non-Repetitive (TJ=50ºC Prior to Surge) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (μA) 0.001 0.01 0.1 100 Off-State Leakage Current vs. Temperature VL=800V VL=600V VL=400V

INTEGRATED CIRCUITS DIVISION 7 www.ixysic.com R03 CPC40055ST

5 Manufacturing Information

5.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

5.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

5.3 Soldering Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. NOTE: The exposed surface of the DCB substrate is not to be soldered.

5.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Device Moisture Sensitivity Level (MSL) Rating CPC40055ST MSL 1 Device Maximum Temperature x Time CPC40055ST 245°C for 30 seconds

INTEGRATED CIRCUITS DIVISION R03 www.ixysic.com 8 CPC40055ST

5.5 Mechanical Dimensions

9.169±0.127 (0.361±0.005) 2.540±0.127 (0.100±0.005) 38.100±0.254 (1.500±0.010) 17.780±0.254 (0.700±0.010) 2.540±0.254 (0.100±0.010) (4x) 3.810±0.127 (0.150±0.005) 6.350±0.127 (0.250±0.005) 3.807±0.076 (0.150±0.003) 0.635±0.025 (0.025±0.001) 1.397±0.127 (0.055±0.005) 13.005±0.254 (0.512±0.010) 2.997±0.254 (0.118±0.010) 10.160±0.127 (0.400±0.005) 12.700±0.127 (0.500±0.005) 5.080±0.127 (0.200±0.005) 35.544±0.254 (0.070±0.010) 1.016±0.076 (0.040±0.003) (4x) Hole Size 1.45 mm (0.057 in) x4 Pin 1 Pin 1 Pin 1RECOMMENDED HOLE P A TTERN DIMENSIONS millimeters (inches) TOP Pin tolerances are non-cumulative DCB Substrate NOTE: Not to be soldered For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC40055ST-R03 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/9/2015