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Package Pinout: LED Drive Circuits Telecommunications Normally On Switches Ignition Modules Converters Security Power Supplies Regulators 350V Drain-to-Source Voltage Depletion Mode Device Offers Low RDS(on) at Cold Temperatures Low On-Resistance: 8 (Typical) @ 25°C Low VGS(off) Voltage High Input Impedance Low Input and Output Leakage Small Package Size SOT -89 and SOT -223 PC Card (PCMCIA) Compatible PCB Space and Cost Savings The CPC3708 is a N-channel, depletion mode Field Effect Transistor (FET) that is available in an SOT -223 package (CPC3708Z) and an SOT -89 package (CPC3708C). Both utilize IXYS Integrated Circuits Division’s proprietary third-generation vertical DMOS process that realizes world class, high voltage MOSFET performance in an economical silicon gate process. The vertical DMOS process yields a highly reliable device, particularly for use in difficult application environments such as telecommunications, security, and power supplies. CPC3708Z and the CPC3708C have a typical on-resistance of 8 and a drain-to-source voltage of 350V. As with all MOS devices, the FET structure prevents thermal runaway and thermally induced secondary breakdown. Pin Number Name 1G A T E
2 DRAIN
3 SOURCE
4 DRAIN
Drain-to-Source Voltage - V(BR)DSX 350 V Max On-Resistance - RDS(on) 14 Max Power Circuit Symbol D G D S 123 D S G
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R03 CPC3708 Parameter Symbol Conditions Min Typ Max Units Gate-to-Source Voltage V GS ID=60mA, VDS=5V -1.005 - -1.735 V Gate-to-Source Off Voltage V GS(off) ID=2A, VDS=10V , VDS=100V -2 - -3.6 V Drain-to-Source Leakage Current I DS(off) VGS= -5V , VDS=190V - - 20 nA VGS= -5V , VDS=350V - - 1 A Drain Current ID VGS= -2.7V , VDS=5V , VDS=50V - - 5 mA VGS= -0.57V , VDS=5V 130 - - mA On-Resistance R DS(on) VGS= -0.35V , IDS=50mA - 8 14 Gate Leakage Current I GSS VGS=±20V - - 100 nA Gate Capacitance C ISS VDS= VGS=0V - - 300 pF Electrical Characteristics @25oC (Unless Otherwise Specified) Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Thermal Resistance Package Parameter Symbol Conditions Min Typ Max Units SOT -89 Junction to Case R JC -- - ºC/W Junction to Ambient R JA 90 SOT -223 Junction to Case R JC -- - Junction to Ambient R JA 55 Parameter Ratings Units Drain-to-Source Voltage (V(BR)DSX) 350 V Gate-to-Source Voltage (VGS) ±20 V T otal Package Dissipation 1 SOT -89 1.1 W SOT -223 2.5 Operational T emperature -40 to +110 oC Storage T emperature -40 to +125 oC 1 Mounted on 1"x1" FR4 board.
INTEGRATED CIRCUITS DIVISION CPC3708 www.ixysic.com 3R03 CPC3708Z (SOT-223) PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance in SOT -223 Package. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. VDS (V) 012 345 ID (A) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 Output Characteristics (TA=25ºC) VGS=-0.5 VGS=-1 VGS=-1.5 VGS=-2 ID (A) On-Resistance (:) On-Resistance vs. Drain Current (VGS=0V) ID (mA) 0 50 100 150 100 150 200 250 300 Transconductance vs Drain Current (VDS=10V) TA=-40ºC TA=25ºC TA=125ºC GFS (m): VGS (V) ID (mA) 100 150 200 250 Transfer Characteristics (VDS=10V) TA=125ºC TA=25ºC TA=-40ºC Temperature (ºC) -40 -20 0 20 40 60 80 100 VGS(off) (V) -3.0 -2.9 -2.8 -2.7 -2.6 -2.5 -2.4 -2.3 VGS(off) vs. Temperature (VDS=10V, ID=2PA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) On-Resistance vs. Temperature (VGS=0V, ID=100mA) VDS (V) 0 5 10 15 20 25 30 Capacitance (pF) 100 150 200 250 300 Capacitance vs. Drain-Source Voltage (VGS=-5V) CISS COSS CRSS VDS (V) 1 10 100 1000 IDS(A) 0.001 0.01 0.1 Forward Safe Operating Bias (VGS=0V, DC Load, TC=25ºC) Limited by Device Channel Saturation Limited by Device RDS(on)
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R03 CPC3708 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC3708C / CPC3708Z MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC3708C / CPC3708Z 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
INTEGRATED CIRCUITS DIVISION CPC3708 www.ixysic.com 5R03 Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 6.705 / 7.290 (0.264 / 0.287) 0.229 / 0.330 (0.009 / 0.013)
0.914 MIN
(0.036 MIN) 1.90 (0.075) 1.90 (0.075) 6.10 (0.24) 2.286 (0.090) 0.90 (0.035) 3.20 (0.126) 6.30 / 6.71 (0.248 / 0.264) 2.286 (0.090) 3.30 / 3.71 (0.130 / 0.146) 2.90 / 3.10 (0.114 / 0.122) 0.610 / 0.787 (0.024 / 0.031) 0.020 / 0.102 (0.0008 / 0.004) 0.864 / 1.067 (0.181) 1.549 / 1.803 (0.061 / 0.071) 1.499 / 1.981 (0.059 / 0.078) PCB Land Pattern Pin 1 CPC3708Z MECHANICAL DIMENSIONS CPC3708C Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.286 / 2.591 (0.090 / 0.102) 3.937 / 4.242 (0.155 / 0.167) 1.397 / 1.600 (0.055 / 0.063) 0.356 / 0.432 (0.014 / 0.017) 1.626 / 1.829 (0.064 / 0.072) R 0.254 (R 0.010) 0.889 / 1.194 (0.035 / 0.047) 0.356 / 0.483 (0.014 / 0.019) 0.432 / 0.559 (0.017 / 0.022) 4.394 / 4.597 (0.173 / 0.181) 1.422 / 1.575 (0.056 / 0.062) 2.921 / 3.073 (0.115 / 0.121) 0.60 (0.024) TYP 3 1.40 (0.055) 2.45 (0.096) 1.90 (0.075) 1.90 (0.074) 5.00 (0.197) 50º PCB Land Pattern Pin 1 1.118 / 1.270 0.432 / 0.508 (0.017 / 0.020) 0.864 / 1.016 (0.034 / 0.040) 2.845 / 2.997 (0.112 / 0.118) 45º
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. INTEGRATED CIRCUITS DIVISION Specification: DS-CPC3708-R03 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/1/2014 For additional information please visit our website at: www.ixysic.com CPC3708 CPC3708ZTR Tape & Reel MECHANICAL DIMENSIONS CPC3708CTR Tape & Reel Dimensions mm (inches)Embossment Embossed Carrier
177.8 Dia
(7.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) W=12.00 ± 0.3 (0.472 ± 0.012) B0=4.60 ± 0.1 (0.181 ± 0.004) A0=4.80 ± 0.1 (0.189 ± 0.004) P=8.00 ± 0.1 (0.315 ± 0.004) K0=1.80 ± 0.1 (0.071 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 5.50 ± 0.05 (0.217 ± 0.002) Dimensions mm (inches)Embossment Embossed Carrier (7.00 Dia) Top Cover Tape Thickness (0.004 Max) W=12.08 ± 0.2 (0.476 ± 0.008) B0=7.42 ± 0.1 (0.292 ± 0.004) A0=6.83 ± 0.1 (0.269 ± 0.004) P=8.03 ± 0.1 (0.316 ± 0.004) K0=1.88 ± 0.1 (0.074 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 ± 0.1 (0.157 ± 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 5.50 ± 0.05 (0.217 ± 0.002)