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Switching Characteristics of Normally Open (Form A) Devices  Dual Relays  Low On-resistance: 150m Max  2 Amp Load Current; Single-Pole Operation  4000Vrms Input/Output Isolation  Low Drive Power Requirements  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  8-Pin SOIC Surface Mount Package  Flammability Rating UL 94 V-0  Security  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Medical Equipment-Patient/Equipment Isolation  Industrial Controls  UL 508 Certified Component: File E69938  CSA Certified Component: Certificate 1175739  EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Form-A IF ILOAD 10% 90% ton toff CPC2907B is a dual, normally open (1-Form-A) Solid State Relay that comprises two independent, optically coupled MOSFET switches. The combination of highly efficient LEDs and photovoltaic die makes possible an input to output isolation of 4000V rms. The optically coupled output driver, which uses the patented OptoMOS architecture, is controlled by a highly efficient infrared LED. Dual OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-pin package. + Control - Switch #1 – Control - Switch #1 + Control - Switch #2 – Control - Switch #2 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R02 CPC2907B Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous, Single-pole 1 -I L -- 2A rms / ADC Peak t =10ms I LPK - - ±10 A P On-Resistance 2 IF=5mA, IL=1A R ON - 0.10 0.15  Off-State Leakage Current V L=60VP ILEAK -- 1 A Switching Speeds T urn-On I F=5mA, VL=10V ton - 0.62 2.5 ms T urn-Off t off - 0.09 0.25 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -6 0 - p F Input Characteristics Input Control Current to Activate 3 IL=1A I F - 0.78 5 mA Input Control Current to Deactivate - - 0.4 0.78 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -3 - p F

1 If both poles operate at the same time, the load current must be derated

in order not to exceed the package power dissipation value. See Total Load Current chart on this page. 2 Measurement taken within one (1) second of on-time.

3 For applications requiring operation at temperatures greater than 60 ºC,

a minimum LED drive current of 10mA is recommended. Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW Output Power Dissipation Single Pole 2 1125 mW Both Poles 3 1700 Isolation Voltage, Input to Output 4000 V rms Operational Temperature (TA) -40 to +85 °C Storage Temperature -40 to +125 °C 1 Derate linearly 1.33 mW / °C 2 Derate linearly 11.4 mW / °C 3 Derate linearly 17.1 mW / °C Absolute Maximum Ratings @ 25°C Electrical Characteristics @ 25°C Pole 1 Current (A) Pole 2 Current (A) 0.0 0.5 1.0 1.5 2.0 2.5 Total Load Current 25ºC 85ºC 55ºC

INTEGRATED CIRCUITS DIVISION CPC2907B www.ixysic.com 3R02 LED Forward Voltage (V) Device Count (N) LED Forward Voltage Distribution (N=50, IF=5mA) Turn-On Time (Ps) 500 550 600 650 700 750 800 Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Turn-Off Time (Ps) 84 86 88 90 92 94 96 Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) LED Forward Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=1A) Blocking Voltage (VP) 81 82 83 84 85 86 87 Device Count (N) Typical Blocking Voltage Distribution (N=50) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 Typical IF for Switch Operation (IL=1A) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 500 1000 1500 2000 2500 Typical Turn-On Time vs. Temperature (IL=100mA) IF=5mA IF=10mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 100 110 120 130 Typical Turn-Off Time vs. Temperature (IL=100mA) IF=10mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-On Time (Ps) 200 400 600 800 1000 1200 1400 1600 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 01 0 2 0 3 0 4 0 5 0 Turn-Off Time (Ps) 100 105 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) *The Performance data shown in the graphs above is typical of device operation. Unless otherwise noted, data is presented at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. PERFORMANCE DATA*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R02 CPC2907B *The Performance data shown in the graphs above is typical of device operation. Unless otherwise noted, data is presented at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Load Voltage (V) 01 0 2 0 3 0 4 0 5 0 6 0 Output Capacitance (pF) 100 150 200 250 Output Capacitance vs. Load Voltage Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 150 200 250 300 350 Leakage Current vs. Temperature (VL=60V) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature Load Voltage (V) Load Current (A) Typical Load Current vs. Load Voltage (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (m:) 100 110 120 130 140 150 Typical On-Resistance vs. Temperature (IF=5mA, IL=1A) Temperature (ºC) 0 2 04 06 08 0 1 0 0 Load Current (A) 0.0 0.5 1.0 1.5 2.0 2.5 Maximum Load Current vs. Temperature (IF=5mA) Single Pole Both Poles 2.25 1.75 1.25 0.75 0.25 10 30 50 70 90 PERFORMANCE DATA*

INTEGRATED CIRCUITS DIVISION CPC2907B www.ixysic.com 5R02 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC2907B MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC2907B 245ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION Specification: DS-CPC2907B-R02 ©Copyright 2016, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/30/2016 For additional information please visit our website at: www.ixysic.com CPC2907B IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. MECHANICAL DIMENSIONS CPC2907B Dimensions Unless Otherwise Noted mm (inches) 21.082 ± 0.381 (0.830 ± 0.015) Pin 1 10.160 ± 0.254 (0.400 ± 0.010) 16.764 ± 0.381 (0.660 ± 0.015) 0.889 ± 0.178 (0.035 ± 0.007) FOOTPRINT 0.381 ± 0.025 (0.015 ± 0.001) 0.762 ± 0.102 (0.030 ± 0.004) 5.080 ± 0.127 (0.200 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005)

1.651 TYP 4 PLCS

(0.065 TYP 4 PLCS) Pin 8 3.302 ± 0.051 (0.005 ± 0.003) ST ANDOFF 5.080 (0.200) 7.622 (0.300) 15.80 (0.622) 2.00 (0.079) 0.95 (0.037) 5.080 (0.200) Recommended PCB Pattern Notes: 1. Pin-to-pin tolerances are non-cumulative. 2. Lead thickness does not include plating (1000 microinches minimum). 3. Package outline exclusive of mold flash and metal burr. Pin 4