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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Security Passive Infrared Detectors (PIR) Data Signaling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Medical Equipment—Patient/Equipment Isolation Aerospace Industrial Controls 1500V rms Input/Output Isolation TTL/CMOS Compatible Input Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields SMD Pick & Place, Wave Solderable Tape & Reel Version Available Small 8-Pin SOIC Package The CPC2125N is a miniature device with two independent normally closed (1-Form-B) solid state relays in an 8-Pin SOIC package that employs optically coupled MOSFET technology to provide 1500V rms of input/output isolation. Optically coupled outputs using the patented OptoMOS architecture are controlled by a highly efficient GaAIAs infrared LED. Constructed using IXYS Integrated Circuits Division’s state of the art packaging, this device is one of the world’s smallest relays. It offers substantial board space savings over the competitor’s larger 8-Pin SOIC relay. Switching Characteristics of Normally Closed (Form-B) Devices Approvals Form-B IF 10% 90% ILOAD tontoff UL Certified Component: File E76270 CSA Certified Component: Certificate 1172007 EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 + Control – Control Load Load + Control – Control Load Load
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R02 CPC2125N Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 400 V P Reverse Input Voltage 5 V LED Forward Current Peak (10ms) 50 mA Input Power Dissipation 70 mW T otal Power Dissipation 1 600 mW Isolation Voltage, Input to Output (60 Seconds) 1500 V rms ESD Rating, Human Body Model 8 kV Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C
1 Derate linearly 5mW / ºC
Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 IF=0mA I L - - 100 mA rms / mADC Peak t =10ms I LPK - - ±350 mA P On-Resistance 2 IL=100mA R ON -2 6 3 5 Switching Speeds T urn-On IF=5mA, VL=10V ton - 0.31 2 ms T urn-Off t off - 0.30 2 Off-State Leakage Current V L=400V , IF=2mA I LEAK --1 µ A Output Capacitance I F=2mA, VL= 50V , f=1MHz C OUT -6 - p F Input Characteristics LED Forward Current T o Activate
3 IL=100mA IF
--2 mA T o Deactivate - 0.1 - - Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output - C I/O -1 - p F 1 Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60°C) a LED forward current of 4mA is recommended. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION CPC2125N www.ixysic.com 3R02 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) LED Forward Current (mA) Device Count (N) Typical LED Forward Current to Activate (N=50, IL=120mA) On-Resistance (:) 24 25 25 26 27 28 28 Device Count (N) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) Blocking Voltage (VP) 400 410 420 430 440 450 460 470 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=2mA) LED Forward Voltage (V) LED Forward Current (mA) Typical LED Forward Voltage vs. LED Forward Current LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-Off Time (Ps) 200 400 600 800 1000 1200 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-On Time (Ps) 306 308 310 312 314 316 318 Typical Turn-On Time vs. LED Forward Current (IL=60mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 400 800 1200 1600 2000 Typical Turn-Off Time vs. Temperature (IL=60mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 100 150 200 250 300 350 400 450 500 Typical Turn-On Time vs. Temperature (IL=60mA) IF=5mA IF=2mA
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R02 CPC2125N PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Current (mA) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Typical LED Forward Current to Activate (IL=60mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) Load Voltage (V) -3 -2 -1 0 1 2 3 Load Current (mA) -150 -100 -50 100 150 Typical Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 100 110 Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 440 445 450 455 460 465 Typical Blocking Voltage vs. Temperature (IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 120 140 Leakage Current vs. Temperature Measured Between Pins 5&6, 7&8 (IF=5mA, VL=400V) Load Voltage (V) 0.1 1 10 100 1000 Output Capacitence (pF) Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.0 0.2 0.4 0.6 0.8 1.0 Energy Rating Curve
INTEGRATED CIRCUITS DIVISION CPC2125N www.ixysic.com 5R02 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2125N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC2125N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC2125N-R02 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012 For additional information please visit our website at: www.ixysic.com CPC2125N MECHANICAL DIMENSIONS CPC2125N CPC2125NTR Tape & Reel Dimensions mm (inches) PCB Land Pattern
2.184 MAX
(0.086 MAX) 0.838 ± 0.102 (0.015 ± 0.002) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.432 ± 0.127 (0.017 ± 0.005) 0.203 ± 0.025 (0.008 ± 0.001) 1.016 ± 0.025 (0.040 ± 0.001) 5.60 (0.22)1.30 (0.051) 0.55 (0.022) 2.54 (0.100) 9.347 ± 0.203 (0.368 ± 0.008) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002)
2.540 TYP
(0.100 TYP) Pin 1 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. 7. Component load per 13” reel : 2000 pcs. 7.50 ± 0.10 16.00 ± 0.30 2.00 ± 0.10 9.65 ± 0.106.50 1.20 6.55 ± 0.103.50 Ø1.50 +0.1, -0 Ø1.50 MIN Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.)