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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  Designed for use in Security Systems Complying with EN50130-4  1500V rms Input/Output Isolation  TTL/CMOS Compatible Input  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Immune to Radiated EM Fields  SMD Pick & Place, Wave Solderable  Tape & Reel Version Available  Small 8-Pin SOIC Package The CPC2017N is a miniature device with two independent 1-Form-A solid state relays in an 8-Pin SOIC package that employs optically coupled MOSFET technology to provide 1500V rms of input/output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient GaAIAs infrared LED. The CPC2017N uses IXYS Integrated Circuits Division’s state of the art, double-molded, vertical construction packaging to produce one of the world’s smallest relays. The CPC2017N offers substantial board space savings over the competitor’s larger 8-Pin SOIC relay. Switching Characteristics of Normally Open (Form A) Devices Approvals  UL Certified Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Form-A IF ILOAD 10% 90% ton toff + Control – Control Load Load + Control – Control Load Load

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R03 CPC2017N Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25°C Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA T otal Power Dissipation 1 600 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C

1 Derate linearly 5mW / ºC

Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 IF=1mA I L - - 120 mA rms / mADC Peak t =10ms I LPK - - ±350 mA P On-Resistance 2 IL=120mA R ON - 7.1 16  Off-State Leakage Current V L=60VP ILEAK --1 µ A Switching Speeds T urn-On I F=5mA, VL=10V ton - 1.25 3 ms T urn-Off t off - 0.45 3 Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Capacitance Input to Output - - -1 - p F Input Characteristics Input Control Current to Activate 3 IL=120mA I F - 0.40 1 mA Input Control Current to Deactivate - I F 0.1 0.35 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA 1 Load current derates linearly from 120mA @ 25oC to 60mA @80oC, and must be derated for both poles operating simultaneously. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended. Electrical Characteristics @ 25°C

INTEGRATED CIRCUITS DIVISION CPC2017N www.ixysic.com 3R03 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) Turn-On (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=120mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA, TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mA, TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=120mA, TA=25ºC) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=1mA, IL=120mA, TA=25ºC) 80 84 88 9282 86 90 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, TA=25ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=1mA IF=2mA IF=5mA IF=10mA IF=20mA IF=50mA LED Forward Current (mA) Turn-On (ms) 0 5 1 01 52 02 53 03 54 04 5 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 Typical Turn-On vs. LED Forward Current (IL=120mA) LED Forward Current (mA) Turn-Off (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Typical Turn-Off vs. LED Forward Current (IL=120mA)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R03 CPC2017N PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Typical IF for Switch Operation vs. Temperature (IL=60mA) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On (ms) 1.0 1.5 2.0 2.5 3.0 3.5 Typical Turn-On vs. Temperature (IL=50mA) IF=2mA IF=5mA Turn-Off (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Typical Turn-Off vs. Temperature (IL=50mA) Temperature (ºC) IF=5mA IF=2mA -40 -20 0 20 40 60 80 100 Steady State Instantaneous IF=5mA IF=5mA IF=2mA Temperature (ºC) On-Resistance (:) Typical On-Resistance vs. Temperature (IL=60mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Typical Load Current vs. Load Voltage (IF=1mA, TA=25ºC) Blocking Voltage (VP) -40 -20 0 20 40 60 80 100 Typical Blocking Voltage vs. Temperature Temperature (ºC) Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature (Measured Across Pins 3 & 4) (VL=60V) Temperature (ºC) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.0 0.2 0.4 0.6 0.8 1.0 Energy Rating Curve Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 100 110 120 130 Maximum Load Current vs. Temperature (IF=2mA)

INTEGRATED CIRCUITS DIVISION CPC2017N www.ixysic.com 5R03 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2017N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC2017N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC2017N-R03 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012 For additional information please visit our website at: www.ixysic.com CPC2017N MECHANICAL DIMENSIONS CPC2017N CPC2017N Tape & Reel Dimensions mm (inches) PCB Land Pattern

2.184 MAX

(0.086 MAX) 0.838 ± 0.102 (0.015 ± 0.002) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.432 ± 0.127 (0.017 ± 0.005) 0.203 ± 0.025 (0.008 ± 0.001) 1.016 ± 0.025 (0.040 ± 0.001) 5.60 (0.22)1.30 (0.051) 0.55 (0.022) 2.54 (0.100) 9.347 ± 0.203 (0.368 ± 0.008) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002)

2.540 TYP

(0.100 TYP) Pin 1 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. 7. Component load per 13” reel : 2000 pcs. 7.50 ± 0.10 16.00 ± 0.30 2.00 ± 0.10 9.65 ± 0.106.50 1.20 6.55 ± 0.103.50 Ø1.50 +0.1, -0 Ø1.50 MIN Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.)