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Security Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Aerospace Industrial Controls Meets Requirements of EN50130-4 (Installation Class 3) 3750Vrms Input/Output Isolation 100% Solid State Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable The CPC1317 is a single-pole, normally open (1-Form-A) solid state relay with bi-directional transient voltage suppressor (TVS) relay protection, which is designed to meet the requirements of EN50130-4 (installation class 3). The relay output is constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient GaAlAS infrared LED, controls the optically coupled output. The CPC1317 is available in an 8-pin, space-saving surface-mount package. Switching Characteristics of Normally Open Devices Form-A IF ILOAD 10% 90% ton toff Approvals UL Certified Component: File E76270 CSA Certified Component: Certificate 1172007 EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Transient Protection Characteristics Peak Pulse Power V WM 600W 40.2V + Control – Control TVS +/- TVS -/+ Load Load
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 CPC1317 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units SSR Output Blocking Voltage 70 V P TVS Working Voltage, Maximum 40.2 V Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 150 mW SSR Output Power Dissipation 2 400 mW TVS Peak Pulse Power (IPP=9.3A, 10/1000s pulse) 600 W Isolation Voltage, Input to Output 3750 V rms Operating T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous - I L - - 150 mA rms / mADC Peak t=10ms I LPK - - ±400 mA P On-Resistance 1 IL=150mA, IF=1mA R ON -7 1 6 Off-State Leakage Current V L=70VP ILEAK --1 µ A Switching Speeds T urn-On I F=5mA, VL=10V ton - - 2.5 ms T urn-Off t off - - 2.5 Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate 2 IL=150mA I F --1 m A Input Dropout Current to Deactivate - I F 0.1 - - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Common Characteristics Capacitance, Input to Output - C I/O -3 - p F 1 Measurement taken within 1 second of turn-on time. 2 For applications requiring high temperature operation (> 60oC) a minimum LED drive current of 3mA is required. Parameter Conditions Symbol Min Typ Max Units Clamping Voltage I PP=9.3A V C - - 66.5 V Reverse Breakdown Voltage I=1mA V BR 44.4 - - V Reverse Leakage Current V WM=40.2V I L --5 A
INTEGRATED CIRCUITS DIVISION CPC1317 www.ixysic.com 3R05 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 75 85 95 10580 90 100 Turn-On (Ps) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA, TA=25ºC) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IL=100mA, TA=25ºC) LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA, TA=25ºC) 84 86 88 9085 87 89 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, TA=25ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=10mA IF=20mA IF=5mA IF=2mA IF=1mA LED Forward Current (mA) 0 5 10 15 20 Turn-On Time (Ps) 200 400 600 800 1000 1200 Typical Turn-On Time vs. LED Forward Current LED Forward Current (mA) 0 5 10 15 20 Turn-Off Time (Ps) 460 465 470 475 480 485 Typical Turn-Off Time vs. LED Forward Current Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.15 0.20 0.25 0.30 0.35 LED Current to Operate vs. Temperature (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 100 200 300 400 500 600 Turn-On Time vs. Temperature IF=1mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 200 300 400 500 600 700 800 Turn-Off Time vs. Temperature IF=5mA IF=1mA
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 CPC1317 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) On-Resistance vs. Temperature (IF=1mA, IL=50mA) Load Voltage (V) Load Current (A) -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 Typical Load Current vs. Load Voltage (IF=1mA, TA=25ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Blocking Voltage vs. Temperature (Pins 5 & 6) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (PA) Leakage Current vs. Temperature Measured Between Pins 5 & 6 (VL=70V) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (mA) 200 400 600 800 1000 Energy Rating Curve Temperature (ºC) -40 -20 0 20 40 60 80 100 TVS Breakdown Voltage (V) TVS Diode Breakdown Voltage vs. Temperature (Pins 7 & 8) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) TVS Diode Leakage vs. Temperature (Pins 7 & 8) (VL=40V) Temperature (ºC) -40 -20 0 20 40 60 80 100 Peak Pulse Power (% PPP @ 25ºC) 100 120 TVS Derating Curve Time (Ps) PPP - Peak Pulse Current (% IPP) 100 110 TVS Pulse Waveform 10/1000 (Ps) 10 100 1000 10 4 105 106 Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 120 125 130 135 140 145 150 155 Maximum Load Current vs. Temperature (IF=1mA)
INTEGRATED CIRCUITS DIVISION CPC1317 www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1317P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1317P 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1317-R05 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS ® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/16/2012 For additional information please visit our website at: www.ixysic.com CPC1317 MECHANICAL DIMENSIONS Dimensions mm (inches) PCB Land Pattern 9.398 ± 0.127 (0.370 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.286 MAX. (0.090 MAX.) 0.203 ± 0.013 (0.008 ± 0.0005) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 0.457 ± 0.076 (0.018 ± 0.003) 2.159 ± 0.025 (0.085 ± 0.001) 2.54 (0.10) 8.70 (0.3425)1.55 (0.0610) 0.65 (0.0255) 0.864 ± 0.120 (0.034 ± 0.004) Pin 1 Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) User Direction of Feed P = 12.00 (0.472) W = 16.00 (0.63) Bo = 10.30 (0.406) Ao = 10.30 (0.406) K1 = 2.00 (0.079) K0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157) CPC1317P CPC1317PTR Tape & Reel