DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

Description

Ordering Information

 Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment: Patient/Equipment Isolation  Aerospace  Industrial Controls  5000Vrms Input/Output Isolation  Low Drive Power Requirements  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Small 4-pin Package The CPC1303 is a unidirectional input optocoupler with a single-transistor output, which uses optically coupled technology to provide an enhanced 5000V rms isolation barrier between the input and the output. The optically coupled output is controlled by a highly efficient infrared LED. This optocoupler satisfies the PD output requirements of IXYS Integrated Circuits Division's CPC1466 Broadband ADSL/VDSL DC Termination IC. Approvals  UL 1577 Approved Component: File E76270  EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 A K C E

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 CPC1303 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.. Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Breakdown Voltage I CEO=10µA BV CEO 30 - - V P Phototransistor Output (Dark) Current V CEO=5V , IF=0mA I CEO - 25 500 nA Saturation Voltage I C=0.4mA, IF=0.2mA VCEsat - 0.1 0.45 VIC=10mA, IF=10mA - 0.12 0.5 Current T ransfer Ratio I F=0.2mA, VCE=0.5V CTR 200 1000 2500 % Output Capacitance I F=0mA, V=25V , f=1MHz COUT -6 - p F Input Characteristics Input Control Current I C=0.4mA, VCE=0.5V I F - - 0.2 mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Input Reverse Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -3 - p F Parameter Ratings Units Breakdown Voltage 30 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Power Dissipation Input 1 150 mW Phototransistor 2 150 Isolation Voltage, Input to Output 5000 V rms Operating T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / oC 2 Derate linearly 2.00 mW / oC Characteristic Symbol Test Condition Typ Units T urn-On Time t on VCC=5V , IF=1mA, RL=500 2 sT urn-Off Time t off 8 Switching Characteristics @ 25ºC Switching Time Test Circuit VCC VCE RL IF Pulse Width=5ms Duty Cycle=1% IF 10% 90% t on t off VCE

INTEGRATED CIRCUITS DIVISION CPC1303 www.ixysic.com 3R05 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage (V) LED Forward Current (mA)0 LED Voltage vs. LED Current (Linear) LED Forward Voltage (V) LED Forward Current (mA) 0.1 100 LED Voltage vs. LED Current (LOG) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=5mA IF=10mA IF=20mA IF=0.2mA IF=1mA IF=2mA LED Forward Current (PA) 1 10 100 1000 CTR (%) 200 400 600 800 1000 1200 LED Forward Current vs. CTR -40ºC 85ºC 25ºC Collector Voltage (V) 012345 Collector Current (mA) Typical Collector Voltage vs. Typical Collector Current IF=5mA IF=3mA IF=2mA IF=1mA I F=0.5mA I F=0.2mA Temperature (ºC) -40 0 40 80 120 ICE Current (PA) 100 1000 10000 100000 ICE Current vs. Temperature IF=1000PA IF=1PA IF=2PA IF=5PA IF=10PA IF=20PA IF=50PA IF=100PA IF=200PA IF=500PA Load Resistance (k:) 0 2 04 06 08 0 1 0 0 Turn-On Time (Ps) 0.9 1.0 1.1 1.2 1.3 1.4 1.5 Turn-On Time vs. Load Resistance (IF=1mA, VCC=5V) Load Resistance (k:) 0 2 04 06 08 0 1 0 0 Turn-Off Time (Ps) 100 150 200 250 300 350 Turn-Off Time vs. Load Resistance (VCC=5V, IF=1mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Saturation Voltage (V) 0.06 0.08 0.10 0.12 0.14 0.16 Saturation Voltage vs. Temperature (IF=1mA, ICE=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) 100 200 300 400 500 Leakage Current vs. Temperature VCE Leakage 10V VCE Leakage 3V VCE Leakage 5V PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 CPC1303 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1303G MSL 1 CPC1303GR MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1303GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1303G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (T c) Time CPC1303GR 250 ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION CPC1303 www.ixysic.com 5R05 MECHANICAL DIMENSIONS PC Board Pattern (Top View) Dimensions mm (inches) PIN 1 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 0.991 (0.039) 9º (ALL) 3.30 ± 0.050 (0.130 ± 0.002) 0.254 (0.010) 9.144 ± 0.508 (0.360 ± 0.020) 7.620 ± 0.250 (0.300 ± 0.010) 7.620 ± 0.127 (0.300 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 9º (ALL) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.125) 0.508 (0.020) 2.159 (0.085) Dimensions mm (inches) PCB Land Pattern PIN #1 6.350 ± 0.127 (0.250 ± 0.005) 0.991 (0.039) 9.525 (0.375) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.254 (0.025 ± 0.010) 0.254 (0.010) 3.300 ± 0.050 (0.130 ± 0.002) 3.480 ± 0.076 (0.137 ± 0.003) 2.287 (0.09) 8.80 (0.346) 1.60 (0.063) 0.95 (0.037) 9º ± 1º (ALL) 0.102 min / 0.254 max (0.004 min / 0.010 max) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) CPC1303G CPC1303GR

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1303-R05 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016 For additional information please visit our website at: www.ixysic.com CPC1303 Dimensions mm (inches) NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004)Embossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.165) K1=3.70 (0.146) W=16.00±0.30 (0.630±0.012) A0=10.01 (0.394) P=12.00 (0.472) B0=5.00 (0.197) CPC1303GRTR Tape & Reel