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 Telecom Switching  Tip/Ring Circuits  Hook Switch  Modem Switching (Laptop, Notebook, Pocket Size)  Loop Detect  Ringing Detect  Current Sensing  5000Vrms Input/Output Isolation  350VP Breakdown Voltage  Small 4-Pin Package  Surface Mount Tape & Reel Version Available The CPC1301 is a unidirectional input optocoupler with a high-voltage Darlington output. Light output from the highly efficient infrared LED activates the optically coupled silicon NPN photo-Darlington output transistor. The input LED and the output transistor are separated by a 5000V rms isolation barrier. With a LED current of only 1mA, a current transfer ratio of 1000% to 8000% is guaranteed at the collector of the 350V Darlington output transistor. The CPC1301's low input current, high current transfer ratio, high output voltage capability, and large isolation barrier rating make it ideal for many applications such as telecom, industrial, and power control. Approvals  UL 1577 Approved Component: File E76270  CSA Certified Component: Certificate 1172007  EN 60950 Certified Component: TUV Certificate B 13 12 82667 003 A K C E

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R06 CPC1301 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manfacturing testing requirements. Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Breakdown Voltage I CEO=100µA BV CEO 350 - - V P Emitter-Collector Breakdown Voltage I E=0.1mA BV ECO 0.3 - - V Phototransistor Output (Dark) Current V CEO=200V , IF=0mA I CEO - - 100 nA Saturation Voltage I C=10mA, IF=1mA VCE(Sat) -- 1 VIC=100mA, IF=10mA - - 1.2 Current T ransfer Ratio I F=1mA, VCE=1V CTR 1000 5500 8000 % Output Capacitance V CEO=50V , f=1MHz C OUT -1 3 - p F Input Characteristics Input Control Current I C=10mA, VCE=1V I F - 0.07 1 mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Input Reverse Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance - C I/O -3 - p F Parameter Ratings Units Breakdown Voltage, BVCEO 350 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW Phototransistor Power Dissipation 2 150 mW Isolation Voltage, Input to Output 5000 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / oC 2 Derate linearly 1.5 mW / oC Characteristic Symbol Test Condition Typ Units Rise Time t R VCC=10V IF=10mA RL=100 Fall Time t F 2.6 T urn-On Time t on 2.75 Storage Time t S 20 T urn-Off Time t off 60 T urn-On Time t on VCC=10V IF=16mA RL=180 Storage Time t S 40 T urn-Off Time t off 80 Switching Characteristics @ 25ºC Switching Time Test Circuit VCC VCE RL IF Pulse Width=5ms Duty Cycle=50% IF 10% 90% t on t off t S VCE t F t R

INTEGRATED CIRCUITS DIVISION CPC1301 www.ixysic.com 3R06 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage (V) LED Current (mA) LED Current (IF) vs. LED Forward Voltage (VF) LED Forward Voltage (V) LED Current (mA) 0.1 100 LED Current (IF) vs. LED Forward Voltage (VF) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 100,000 0.1 1 10 100 10,000 1000 100 LED Current (mA) CTR (%) VCE=1.5V VCE=1.0V CTR vs. LED Current (IF) LED Forward Current (mA) Collector Current IC (mA) 0.01 1000 100 0.1 1 10 100 Collector Current vs. LED Current (IF) VCE=1.5V VCE=1.0V Temperature (ºC) Collector Current IC (mA) Collector Current vs. Temperature (VCE = 1.2V) 375 300 225 150 -40 -20 0 20 40 60 80 100 IF=10mA IF=5mA IF=1mA IF=0.5mA Load Resistance (:) 10 100 1K 10K 100K Switching Time (Ps) 0.1 100 1000 Switching Time vs. Load Resistance tOFF, IF=16mA tOFF, IF=1.6mA tON, IF=1.6mA tON, IF=16mA Collector-Emitter Voltage VCE (V) Collector Current IC (mA) 180 160 140 120 100 Collector Current vs. Collector-Emitter Voltage IF = 1mA IF = 0.5mA IF = 2mA IF = 5mA IF = 10mA Temperature (ºC) Leakage Current (µA) Leakage vs. Temperature (VCEO = 350V) 3.0 2.5 2.0 1.5 1.0 0.5 -40 -20 0 20 40 60 80 120 100 Breakdown Voltage vs. Temperature Temperature (ºC) Breakdown Voltage BVCEO (VP) -40 450 440 430 420 410 400 390 380 370 -15 10 35 60 85 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R06 CPC1301 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1301G MSL 1 CPC1301GR MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1301GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole device, CPC1301G, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (T c) Time CPC1301GR 250 ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION CPC1301 www.ixysic.com 5R06 MECHANICAL DIMENSIONS PC Board Pattern (Top View) Dimensions mm (inches) PIN 1 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 0.991 (0.039) 9º (ALL) 3.30 ± 0.050 (0.130 ± 0.002) 0.254 (0.010) 9.144 ± 0.508 (0.360 ± 0.020) 7.620 ± 0.250 (0.300 ± 0.010) 7.620 ± 0.127 (0.300 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 9º (ALL) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.125) 0.508 (0.020) 2.159 (0.085) Dimensions mm (inches) PCB Land Pattern PIN #1 6.350 ± 0.127 (0.250 ± 0.005) 0.991 (0.039) 9.525 (0.375) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.254 (0.025 ± 0.010) 0.254 (0.010) 3.300 ± 0.050 (0.130 ± 0.002) 3.480 ± 0.076 (0.137 ± 0.003) 2.287 (0.09) 8.80 (0.346) 1.60 (0.063) 0.95 (0.037) 9º ± 1º (ALL) 0.102 min / 0.254 max (0.004 min / 0.010 max) 4.572 ± 0.127 (0.180 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) CPC1301G CPC1301GR

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1301-R06 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016 For additional information please visit our website at: www.ixysic.com CPC1301 Dimensions mm (inches) NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) Embossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.165) K1=3.70 (0.146) W=16.00±0.30 (0.630±0.012) A0=10.01 (0.394) P=12.00 (0.472) B0=5.00 (0.197) CPC1301GRTR Tape & Reel