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Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Security Aerospace Industrial Controls 0.4mm Distance Through Insulation (Supplementary Isolation Requirement of EN60950) 1500Vrms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin SOP Package Machine Insertable, Wave Solderable Tape & Reel Version Available The CPC1231N is a miniature single-pole, normally closed (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input-to-output isolation. The optically coupled outputs, which use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The device is compliant with supplementary isolation in accordance with EN/IEC 60950-1. IXYS Integrated Circuits Division’s state of the art double molded vertical construction packaging enables the CPC1231N to be one of the world’s smallest 4-pin relays, which offers board space savings approaching 20% over the competitor’s larger 4-pin SOP relay. Approvals UL 1577 Approved Component: File E76270 CSA Certified Component: Certificate 1172007 EN 60950 Certified Component: TUV Certificate B 10 05 49410 006 Switching Characteristics of Normally Closed Devices Form-B IF 10% 90% ILOAD tontoff 2 3 + Control – Control Load Load
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R07 CPC1231N Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 350 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 150 mW T otal Power Dissipation 1 400 mW Capacitance, Input to Output 1 pF Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L - - 120 mA rms / mADC Peak t =10ms I LPK - - ±350 mA P On-Resistance 2 IL=120mA R ON -2 5 3 0 Off-State Leakage Current I F=2mA, VL=350VP ILEAK --5 A Switching Speeds T urn-On I F=5mA, VL=10V ton --2 ms T urn-Off t off --2 Output Capacitance V L=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate 3 IL=120mA I F - 0.6 2 mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R -- 1 0 A 1 Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60°C) a LED drive current of 5mA is recomended. Electrical Characteristics @ 25ºC
INTEGRATED CIRCUITS DIVISION CPC1231N www.ixysic.com 3R07 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) Turn-On (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=120mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA, TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mA, TA=25ºC) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=120mA, TA=25ºC) 23.5 24.5 25.5 26.524 25 26 Device Count (N) Typical On-Resistance Distribution (N=50, IL=120mA, TA=25ºC) On-Resistance (:) 395 405 415 425400 410 420 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, TA=25ºC) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA Temperature (ºC) Typical Turn-On vs. LED Forward Current (IL=120mA) LED Forward Current (mA) Turn-On (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 LED Forward Current (mA) Turn-Off (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-Off vs. LED Forward Current (IL=120mA)
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R07 CPC1231N PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Typical Turn-On vs. Temperature (IL=50mA) Turn-On (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 IF=5mA IF=10mA Temperature (ºC) IF=5mA IF=10mA Turn-Off (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-Off vs. Temperature (IL=50mA) LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=50mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Temperature (ºC) On-Resistance (:) Typical On-Resistance vs. Temperature (IF=0mA, IL=120mA) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 -6 -4 -2 0 2 4 6 Typical Load Current vs. Load Voltage (IF=0mA, TA=25ºC) Load Current (mA) 180 160 140 120 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 Maximum Load Current vs. Temperature (IF=0mA) Blocking Voltage (VP) -40 425 420 415 410 405 400 395 390 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=350V) Temperature (ºC) Time Load Current (A) 10Ps 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve
INTEGRATED CIRCUITS DIVISION CPC1231N www.ixysic.com 5R07 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1231N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1231N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb
INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1231N-R07 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/16/2012 For additional information please visit our website at: www.ixysic.com CPC1231N MECHANICAL DIMENSIONS Recommended PCB Land Pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) Dimensions mm (inches) Pin 1 4.089 ± 0.203 (0.161 ± 0.008)
2.54 Typ
(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.076 (0.017 ± 0.005) 0.200 ± 0.025 (0.008 ± 0.001) 1.02 ± 0.025 (0.040 ± 0.001)
2.184 Max
(0.086 Max) 0.381 TYP . (0.015 TYP .) Lead to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015) 0.762 ± 0.102 (0.030 ± 0.004) Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P=8.00 (0.315)A0=6.50 (0.256) CPC1231N CPC1231NTR Tape & Reel