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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Energy Meters  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  Designed for use in Security Systems Complying with EN50130-4  Voltage-Controlled Operation  2500V rms Input/Output Isolation  100% Solid State  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Immune to Radiated EM Fields  Small 4-Pin SIP Package  Auto Pick & Place, Wave Solderable The CPC1219 is a voltage-controlled, single-pole, normally closed (1-Form-B) optically coupled solid state relay in a 4-pin Single In-line Package (SIP). IXYS Integrated Circuits Division's patented OptoMOS architecture makes available the optically coupled technology necessary to activate the output's efficient MOSFET switches while providing a 2500V rms input-to-output isolation barrier. Control of the isolated output is accomplished by means of a highly effective GaAlAs infrared LED at the input. An internal resistor in series with the LED enables the voltage- controlled operation of the input. Because the input is solid state there is no need for snubbers or "catch" diodes to suppress the inductive fly-back transient voltage normally associated with EMR coils. CPC1219 Pinout Switching Characteristics of Normally Closed Devices Approvals  UL 508 Approved Component: File E69938  CSA Certified Component: Certificate 1172007 Form-B IF 10% 90% ILOAD tontoff Load LoadIN + IN - 12 3 4

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R06 CPC1219 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Voltage 15 V Input Power Dissipation 225 mW T otal Power Dissipation 1 800 mW Isolation Voltage, Input to Output 2500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 6.67 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L - - 200 mA rms / mADC Peak t ≤10ms I LPK - - ±400 mA P On-Resistance 2 IL=200mA R ON -- 1 6  Off-State Leakage Current V IN=5V , VL=60VP ILEAK --1 A Switching Speeds T urn-On (Output Closed) VIN = 5V , VL = 10V ton --5m s T urn-Off (Output Open) t off --5m s Output Capacitance V IN=5V , VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Voltage Output Open IL = 200mA V IN - - 3.75 V Output Closed 1 - - V Recommended Operating Range 5 - 12 V Reverse Input Current V IN = -5V I R -- 1 0 A Input Resistor - - 900 1000 1100  Common Characteristics Capacitance, Input to Output - - - 1 - pF 1 Load current derates linearly from 200mA @ 25oC to 125mA @80oC. 2 Measurement taken within 1 second of on-time. Electrical Characteristics @ 25ºC

INTEGRATED CIRCUITS DIVISION CPC1219 www.ixysic.com 3R06 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. Turn-On (ms) Device Count (N) Typical Turn-On Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Turn-Off (ms) Device Count (N) Typical Turn-Off Time (N=50, VIN=5V, IL=100mA, TA=25ºC) Device Count (N) Typical On-Resistance Distribution (N=50, VIN=0V, IL=100mA, TA=25ºC) On-Resistance (:) VIN (V) Device Count (N) Typical VIN for Switch Operation (N=50, IL=100mA, TA=25ºC) V IN (V) Device Count (N) Typical VIN for Switch Dropout (N=50, IL=100mA, TA=25ºC) 89 91 93 9590 92 94 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, VIN=5V, TA=25ºC) VIN (V) Turn-On (ms) 0 51 0 1 5 2 0 0.54 0.53 0.52 0.51 0.50 0.49 0.48 0.47 0.46 0.45 0.44 Typical Turn-On vs. VIN (IL=100mA, TA=25ºC) VIN (V) -40 -20 0 20 40 60 80 100 1.32 1.30 1.28 1.26 1.24 1.22 1.20 Temperature (ºC) Typical VIN for Switch Operation vs. Temperature (IL=100mA) VIN = 5V Turn-On (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 Temperature (ºC) Typical Turn-On vs. Temperature (IL=100mA) VIN (V) Turn-Off (ms) 0 2 4 6 8 10 12 14 16 18 2.1 1.8 1.5 1.2 0.9 0.6 0.3 Typical Turn-Off vs. VIN (IL=100mA, TA=25ºC) VIN (V) -40 1.30 1.28 1.26 1.24 1.22 1.20 1.18 -20 0 20 40 60 80 100 Temperature (ºC) Typical VIN for Switch Dropout vs. Temperature (IL=100mA) Turn-Off (ms) -40 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -20 0 20 40 60 80 100 VIN = 5V Temperature (ºC) Typical Turn-Off vs. Temperature (IL=100mA)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R06 CPC1219 PERFORMANCE DATA* *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in t he written specifications, please contact our application department. -40 -20 0 20 40 60 80 100 Steady State VIN = 0V Temperature (ºC) On-Resistance (:) Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) Load Voltage (V) Load Current (mA) 200 -200 100 -150 150 -50 -100 0.75-0.25 Typical Load Current vs. Load Voltage (VIN=0V, TA=25ºC) Load Current (mA) 225 200 175 150 125 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 VIN = 0V Typical Maximum Load Current vs. Temperature Blocking Voltage (VP) -40 104 102 100 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature (VIN=5V) Leakage (PA) -40 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 1&4 (VIN=5V, VL=60V) Time Load Current (mA) 10Ps 500 450 400 350 300 250 200 150 100 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve

INTEGRATED CIRCUITS DIVISION CPC1219 www.ixysic.com 5R06 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1219Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1219Y 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3Pb

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1219-R06 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012 For additional information please visit our website at: www.ixysic.com CPC1219 MECHANICAL DIMENSIONS CPC1219Y DIMENSIONS mm (inches) 19.202 ± 0.381 (0.756 ± 0.015) 6.401 ± 0.127 (0.252 ± 0.005) 5.944 ± 0.127 (0.234 ± 0.005) 2.642 ± 0.127 (0.104 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 0.457 ± 0.076 (0.128 ± 0.004) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.013 (0.010 ± 0.0005) 5.08 (0.200) 10.16 (0.400) 15.24 (0.600) 1.30 (0.051) FINISHED HOLE

0.80 DIA x4

(0.031 DIA x4) Pin 1 Pin 7 PCB Hole Pattern