CPC1130N IXYS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

Description

Ordering Information

 Telecommunications  Telecom Switching  Tip/Ring Circuits  Modem Switching (Laptop, Notebook, Pocket Size)  Hook Switch  Dial Pulsing  Ground Start  Ringing Injection  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment-Patient/Equipment Isolation  Security  Aerospace  Industrial Controls  1500Vrms Input/Output Isolation  Low Drive Power Requirements  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Small 4-Pin SOP Package  Tape & Reel Version Available  Flammability Rating UL 94 V-0 The CPC1130N is a miniature normally-closed, single-pole (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS® architecture while the optically coupled output is controlled by a highly efficient infrared LED. The CPC1130N offers board space savings of at least 20% when compared to competitive 4-pin SOP solid state relays. Approvals Switching Characteristics of Normally-Closed Devices Form-B IF 10% 90% ILOAD toff ton 2 3 + Control – Control Load Load  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: Certificate available on our website

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R08 CPC1130N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 350 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 150 mW T otal Power Dissipation 2 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L - - 120 mA rms / mADC Peak t =10ms I LPK - - ±350 mA P On-Resistance 2 IL=120mA R ON -2 5 3 0  Off-State Leakage Current I F=2mA, VL=350VP ILEAK --5 µ A Switching Speeds T urn-On I F=5mA, VL=10V ton --2 ms T urn-Off t off --2 Output Capacitance I F=2mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate 3 IL=120mA I F - 0.6 2 mA Input Control Current to Deactivate - I F 0.3 0.55 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1130N www.ixysic.com 3R08 PERFORMANCE DATA* 395 405 415 425400 410 420 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50) 23.5 24.5 25.5 26.524 25 26 Device Count (N) On-Resistance (:) Typical On-Resistance Distribution (N=50, IL=120mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=120mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=120mA) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=120mA) LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Forward Voltage Drop (V) Temperature (ºC) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA LED Current (mA) -40 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical IF for Switch Operation vs. Temperature (IL=50mA) Temperature (ºC) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 -6 -4 -2 0 2 4 6 Typical Load Current vs. Load Voltage (IF=5mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R08 CPC1130N PERFORMANCE DATA* Typical Turn-On Time vs. Temperature (IL=50mA) Turn-On Time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 IF=5mA IF=10mA Temperature (ºC) IF=5mA IF=10mA Turn-Off Time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Turn-Off Time vs. Temperature (IL=50mA) Temperature (ºC) Load Current (mA) 180 160 140 120 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 Maximum Load Current vs. Temperature (IF=0mA, IL=AC Peak) Blocking Voltage (VP) -40 425 420 415 410 405 400 395 390 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=5mA, VL=350V) Temperature (ºC) Time Load Current (A) 10μs 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100μs 100ms 1s10ms 10s 100s Energy Rating Curve -40 -20 0 20 40 60 80 100 Temperature (ºC) Typical On-Resistance vs. Temperature (IF=5mA, IL=120mA) On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=120mA) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION CPC1130N www.ixysic.com 5R08 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1130N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1130N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1130N-R08 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/14/2018 For additional information please visit our website at: www.ixysic.com CPC1130N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1130N CPC1130NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 3.85 (0.152) 1.54 (0.061) 0.60 (0.024) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 ± 0.025 (0.015 ± 0.001) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 ± 0.025 (0.008 ± 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max.