CPC1117N

CPC1117N IXYS | Alldatasheet

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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  Designed for use in security systems complying with EN50130-4  Only 1mA of LED current required to operate  1500V rms Input/Output Isolation  Small 4-Pin SOP Package  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Immune to radiated EM fields  Tape & Reel Version Available  Flammability Rating UL 94 V-0 The CPC1117N is a miniature normally-closed single-pole (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input/ output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient infrared LED. IXYS Integrated Circuits' state of the art double- molded vertical construction packaging makes the CPC1117N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals Form-B IF 10% 90% ILOAD toff ton Pin Configuration Switching Characteristics of Normally-Closed Devices 2 3 + Control – Control Load Load  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: Certificate available on our website

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R10 CPC1117N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Disipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 IF=0mA I L - - 150 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance 2 IF=0mA, IL=120mA R ON -5 1 6  Off-State Leakage Current I F=1mA, VL=60VP ILEAK --1 µ A Switching Speeds T urn-On I F=2mA, VL=10V ton - 0.316 10 ms T urn-Off t off - 1.55 10 Output Capacitance I F=0.5mA, VL=50V , f=1MHz C OUT -1 0- p F Input Characteristics Input Control Current to Activate (Output Open) 3 -I F - 0.16 1 mA Input Control Current to Deactivate (Output Closed) I L=120mA I F 0.1 0.14 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1- p F 1 Load current derates linearly from 150mA @ 25oC to 100mA @85oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1117N www.ixysic.com 3R10 PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=150mA) Device Count (N) Typical On-Resistance Distribution (N=50, IL=150mA) On-Resistance (:) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=2mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=2mA, IL=100mA) 85 95 105 11590 100 110 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=1mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.10 0.15 0.20 0.25 0.30 Typical IF for Switch Operation vs. Temperature (IL=100mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=5mA IF=2mA IF=1mA IF=50mA IF=20mA IF=10mA Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Typical Load Current vs. Load Voltage LED Current (mA) 0 1 02 03 04 05 0 Turn-On Time (ms) 0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Current (mA) 0 1 02 03 04 05 0 Turn-Off Time (ms) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) -40 -20 0 20 40 60 80 100 Typical On-Resistance vs. Temperature (IF=0mA, IL=150mA) Temperature (ºC) On-Resistance (:)

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R10 CPC1117N PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. Blocking Voltage (VP) -40 125 120 115 110 105 100 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature (IF=2mA) Leakage (µA) -40 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=60V) Load Voltage (V) 0 1 02 03 04 05 06 0 Output Capacitance (pF) Output Capacitance vs. Load Voltage (IF=0.5mA) Time Load Current (A) 10μs 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100μs 100ms 1s10ms 10s 100s Energy Rating Curve 225 200 175 150 125 100 Temperature (ºC) Load Current (mA) -40 -20 0 20 40 60 80 120 100 Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.20 0.25 0.30 0.35 0.40 0.45 Typical Turn-On Time vs. Temperature (IL=100mA) IF=10mA IF=5mA IF=2mA IF=1mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) Typical Turn-Off Time vs. Temperature (IL=100mA) IF=1mA IF=2mA IF=5mA IF=10mA

INTEGRATED CIRCUITS DIVISION CPC1117N www.ixysic.com 5R10 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1117N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1117N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1117N-R10 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018 For additional information please visit our website at: www.ixysic.com CPC1117N Mechanical Dimensions CPC1117N CPC1117NTR Tape & Reel Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) Recommended PCB Land Pattern 2.54 (0.10) 3.85 (0.152) 1.54 (0.061) 0.60 (0.024) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 ± 0.025 (0.015 ± 0.001) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 ± 0.025 (0.008 ± 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max.