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Security Passive Infrared Detectors (PIR) Data Signalling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment—Patient/Equipment Isolation Aerospace Industrial Controls Designed for EN50130-4 Compliant Security Systems Only 0.5mA of LED Current Required to Operate 1500V rms Input/Output Isolation Small 4-Pin SOP Package High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields Wave Solderable Tape & Reel Version Available The CPC1106N is a 60V, normally-closed, single-pole (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The CPC1106N, using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays, offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals Form-B IF 10% 90% ILOAD tontoff Pin Configuration Switching Characteristics of Normally-Closed Devices 2 3 + Control – Control Load Load UL Recognized Component: File E76270 CSA Certified Component: Certificate 1172007 EN/IEC 60950-1 Certified Component: Certificate B 13 12 82667 003
INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R04 CPC1106N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Disipation 70 mW T otal Power Dissipation 1 400 mW Isolation Voltage, Input to Output 1500 V rms ESD Rating, Human Body Model 8 kV Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous I F=0mA I L - - 75 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance 1 IF=0mA, IL=75mA R ON - 3.85 10 Off-State Leakage Current I F=0.5mA, VL=60VP ILEAK --1µ A Switching Speeds T urn-On I F=2mA, VL=10V ton -- 1 0 ms T urn-Off t off -- 1 0 Output Capacitance I F=0.5mA, VL=50V , f=1MHz C OUT -1 0 - p F Input Characteristics Input Control Current to Activate 2 -I F - 0.16 0.5 mA Input Control Current to Deactivate I L=75mA I F 0.05 - - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.4 V Reverse Input Current V R=5V I R - - 10 µA Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Measurement taken within 1 second of on-time. 2 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 2mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.
INTEGRATED CIRCUITS DIVISION CPC1106N www.ixysic.com 3R04 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)* *The Performance Data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=2mA, IL=75mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=2mA, IL=75mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=0mA, IL=75mA) LED Forward Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=75mA) Blocking Voltage (VP) 79 81 83 85 87 89 91 93 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=0.5mA) LED Forward Voltage (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA IF=1mA LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (Ps) 532 534 536 538 540 542 544 546 548 Typical Turn-On Time vs. LED Forward Current (IL=50mA) LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-Off Time (Ps) 200 400 600 800 1000 1200 1400 Typical Turn-Off Time vs. LED Forward Current (IL=50mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Current (mA) 0.10 0.15 0.20 0.25 0.30 Typical IF for Switch Operation vs. Temperature (IL=50mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 100 200 300 400 500 600 700 800 900 Typical Turn-On Time vs. Temperature (IL=50mA) IF=5mA IF=2mA IF=1mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 500 1000 1500 2000 2500 3000 Typical Turn-Off Time vs. Temperature (IL=50mA) IF=1mA IF=2mA IF=5mA
INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R04 CPC1106N *The Performance Data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 3.0 3.5 4.0 4.5 5.0 Typical On-Resistance vs. Temperature (IF=0mA, IL=50mA) Load Voltage (V) Load Current (mA) -100 -50 100 Typical Load Current vs. Load Voltage (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) Maximum Load Current vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature (IF=1mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=1mA, VL=60V) Load Voltage (V) 0 1 02 03 04 05 06 0 Output Capacitance (pF) Output Capacitance vs. Load Voltage (IF=0.5mA) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (mA) 100 200 300 400 500 600 700 800 Energy Rating Curve (IF=0mA) PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION CPC1106N www.ixysic.com 5R04 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1106N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Refl ow Cycles CPC1106N 260ºC for 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1106N-R04 ©Copyright 2014, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/10/2014 For additional information please visit our website at: www.ixysic.com CPC1106N Mechanical Dimensions Recommended PCB Land Pattern 2.54 (0.10) 5.60 (0.2205) 1.30 (0.0512) 0.60 (0.0217) Dimensions mm (inches) Pin 1 4.089 ± 0.203 (0.161 ± 0.008)
2.54 Typ
(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.076 (0.017 ± 0.005) 0.200 ± 0.025 (0.008 ± 0.001) 1.02 ± 0.025 (0.040 ± 0.001)
2.184 Max
(0.086 Max) 0.381 TYP . (0.015 TYP .) Pin to package standoff: 0.0637 ± 0.0383 (0.0025 ± 0.0015) 0.762 ± 0.102 (0.030 ± 0.004) Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier
330.2 Dia
(13.00 Dia) Top Cover Tape Thickness
0.102 Max
(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P=8.00 (0.315)A0=6.50 (0.256) CPC1106N CPC1106NTR Tape & Reel