CPC1030N

CPC1030N IXYS | Alldatasheet

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 Telecommunications  Telecom Switching  Tip/Ring Circuits  Modem Switching (Laptop, Notebook, Pocket Size)  Hook Switch  Dial Pulsing  Ground Start  Ringing Injection  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Security  Aerospace  Industrial Controls  1500V rms Input/Output Isolation  Small 4-Pin SOP Package  Low Drive Power Requirements  High Reliability  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Tape & Reel Version Available  Flammability Rating UL 94 V-0 The CPC1030N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500V rms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging makes the CPC1030N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals Switching Characteristics of Normally-Open Devices Form-A IF ILOAD 10% 90% ton toff 2 3 + Control – Control Load Load  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R17 CPC1030N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 350 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L 120 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance 2 IL=120mA R ON - 19.5 30  Off-State Leakage Current V L=350VP ILEAK --1 µ A Switching Speeds T urn-On I F=5mA, VL=10V ton --2 ms T urn-Off t off --1 Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -9 - p F Input Characteristics Input Control Current to Activate 3 IL=120mA I F - 0.6 2 mA Input Control Current to Deactivate - I F 0.3 - - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R - - 10 µA Input/Output Characteristics Capacitance Input to Output V IO=1V , f=1MHz C IO -1 - p F 1 Load current derates linearly from 120mA @ 25oC to 60mA @85oC. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1030N www.ixysic.com 3R17 LED Forward Voltage (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (Ps) 600 650 700 750 800 850 900 Device Count (N) Typical Turn-On Time Distribution (N=50, IF=5mA, IL=60mA) Turn-Off Time (Ps) 340 350 360 370 380 390 400 Device Count (N) Typical Turn-Off Time Distribution (N=50, IF=5mA, IL=60mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=120) On Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mA) Blocking Voltage (VP) 416 419 422 425 428 431 Device Count (N) Typical Blocking Voltage Distribution (N=50, IF=0mA) Forward Voltage (V) Forward Current (mA) LED Forward Voltage vs. LED Forward Current Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (Ps) 500 1000 1500 2000 2500 Typical Turn-On Time vs. Temperature (IL=60mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (Ps) 150 200 250 300 350 400 450 500 550 Typical Turn-Off Time vs. Temperature (IL=60mA) IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage Drop (V)1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA LED Current (mA) 01 0 2 0 3 0 4 0 5 0 Turn-On Time (Ps) 500 1000 1500 2000 2500 3000 3500 Typical Turn-On Time vs. LED Forward Current (IL=60mA) LED Forward Current (mA) 01 0 2 0 3 0 4 0 5 0 Turn-Off Time (Ps) 300 310 320 330 340 350 360 370 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R17 CPC1030N Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 Typical IF for Switch Operation vs. Temperature (IL=60mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) Typical On-Resistance vs. Temperature (IF=2mA, IL=60mA) Load Voltage (V) -3 -2 -1 0 1 2 3 Load Current (mA) -150 -100 -50 100 150 Typical Load Current vs. Load Voltage (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 120 Load Current (mA) 100 120 140 Maximum Load Current vs. Temperature (IF=4mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) 390 400 410 420 430 440 450 460 Typical Blocking Voltage vs. Temperature (IF=0mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage (nA) Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=0mA, VL=350V) Load Voltage (V) 0 50 100 150 200 250 300 350 Output Capacitance (pF) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Time Load Current (A) 10μs 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100μs 100ms 1s10ms 10s 100s Energy Rating Curve PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION CPC1030N www.ixysic.com 5R17 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1030N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1030N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1030N-R17 ©Copyright 2018, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/30/2018 For additional information please visit our website at: www.ixysic.com CPC1030N Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) MECHANICAL DIMENSIONS CPC1030N CPC1030NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 5.50 (0.217) 1.45 (0.057) 0.55 (0.022) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 TYP . (0.015 TYP .) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019)

0.203 Typ

(0.008 Typ)