CPC1019N

CPC1019N IXYS | Alldatasheet

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 Security  Passive Infrared Detectors (PIR)  Data Signalling  Sensor Circuitry  Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Utility Meters (gas, oil, electric and water)  Medical Equipment—Patient/Equipment Isolation  Aerospace  Industrial Controls  ATE  Low On-Resistance: 0.6  Low Drive Current: 2mA  High Load Current: 750mA  1500V rms Input/Output Isolation  100% Solid State  Compact 4-Pin SOP Package  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Immune to Radiated EM Fields  Tape & Reel Version Available  Flammability Rating UL 94 V-0 CPC1019N is a miniature, low-voltage, low on-resistance, single-pole, normally-open (1-Form-A) solid state relay in a small 4-pin SOP package. Embodying IXYS Integrated Circuits' patented OptoMOS technology, the CPC1019N comprises a highly efficient infrared LED that is optically coupled to efficient MOSFET output switches to provide 1500V rms of input-to-output isolation. IXYS Integrated Circuits' state of the art double-molded vertical construction packaging produces a very compact solid state relay that is ideal for replacing larger, less-reliable reed and electromechanical relays. Switching Characteristics of Normally-Open Devices Approvals Form-A IF ILOAD 10% 90% ton toff 2 3 + Control - Control Load Load  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: Certificate available on our website

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R05 CPC1019N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 60 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous IF=2mA I L - - 750 mA DC Continuous, AC Peak - - 1 A Peak t < 10ms I LPK --3 A P On-Resistance 1 IL=750mA R ON - 0.35 0.6  Off-State Leakage Current V L=60VP ILEAK --1 A Switching Speeds T urn-On I F=5mA, VL=10V ton - 0.4 3 ms T urn-Off t off - 0.4 3 ms Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -6 0 - p F Input Characteristics Input Control Current to Activate 2 IL=750mA I F - 0.15 2 mA Input Control Current to Deactivate - I F 0.1 0.14 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output V IO=0V , f=1MHz C IO -1 - p F 1 Measurement taken within 1 second of on-time. 2 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1019N www.ixysic.com 3R05 PERFORMANCE DATA* Blocking Voltage (VP) Device Count (N) Typical Blocking Voltage Distribution (N=50) Turn-On Time (ms) Device Count (N) Typical Turn-On Time Distribution (N=50, IF=5mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time Distribution (N=50, IF=5mA, IL=100mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IF=2mA, IL=0.75A) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA) LED Forward Voltage (V) Device Count (N) LED Forward Voltage Distribution (N=50, IF=5mA) -40 -20 0 20 40 60 80 100 LED Current (mA) 0.10 0.15 0.20 0.25 0.30 Typical LED Current to Operate vs. Temperature (IL=500mA) Temperature (ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-On Time (ms) 0.5 1.0 1.5 2.0 Typical Turn-On Time vs. Temperature (IL=100mA) IF=2mA IF=5mA Temperature (ºC) -40 -20 0 20 40 60 80 100 Turn-Off Time (ms) 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Typical Turn-Off Time vs. Temperature (IL=100mA) IF=5mA IF=2mA Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Typical LED Forward Voltage Drop vs. Temperature IF=50mA IF=20mA IF=10mA IF=2mA IF=5mA LED Forward Current (mA) 0 1 02 0 3 04 05 0 Turn-On Time (ms) 0.0 0.5 1.0 1.5 2.0 2.5 Typical Turn-On Time vs. LED Forward Current (IL=100mA) LED Forward Current (mA) 0 1 02 03 04 05 0 Turn-Off Time(ms) 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R05 CPC1019N Load Voltage (V) Load Current (mA) -1000 -750 -500 -250 250 500 750 1000 Typical Load Current vs. Load Voltage (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 On-Resistance (:) 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 Typical On-Resistance vs. Temperature (IF=2mA, IL=500mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Load Current (mA) 450 500 550 600 650 700 750 800 Maximum Load Current vs. Temperature (IF=2mA) Temperature (ºC) -40 -20 0 20 40 60 80 100 Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature Temperature (ºC) -40 -20 0 20 40 60 80 100 Leakage Current (nA) Typical Leakage Current vs. Temperature (VL=60V) Time 10Ps 100 Ps 1ms 10ms 100ms 1s 10s 100s Load Current (A) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Energy Rating Curve (IF=2mA) PERFORMANCE DATA* *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department.

INTEGRATED CIRCUITS DIVISION CPC1019N www.ixysic.com 5R05 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1019N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1019N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1019N-R05 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018 For additional information please visit our website at: www.ixysic.com CPC1019N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1019N CPC1019NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 3.85 (0.152) 1.54 (0.061) 0.60 (0.024) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 ± 0.025 (0.015 ± 0.001) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019) 0.203 ± 0.025 (0.008 ± 0.001) Note: 1. Lead dimensions do not include plating: 1000 microinches max.