CPC1016N

CPC1016N IXYS | Alldatasheet

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 Instrumentation  Multiplexers  Data Acquisition  Electronic Switching  I/O Subsystems  Meters (Watt-Hour, Water, Gas)  Medical Equipment—Patient/Equipment Isolation  Security Systems  Aerospace  Industrial Controls  Reed Relay Replacement  1500Vrms Input/Output Isolation  100% Solid State  Low Drive Power Requirements  Arc-Free With No Snubbing Circuits  No EMI/RFI Generation  Tape & Reel Version Available  Flammability Rating UL 94 V-0 CPC1016N is a miniature, low-voltage, low on-resistance, normally open (1-Form-A) solid state relay in a 4-lead SOP package. The relay uses optically coupled MOSFET technology to provide 1500V rms of input/output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. The CPC1016N uses IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce a very compact solid state relay that is ideal for replacing larger, less-reliable reed and electromechanical relays. Approvals  UL Recognized Component: File E76270  CSA Certified Component: Certificate 1172007  EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Switching Characteristics of Normally Open Devices Form-A IF ILOAD 10% 90% ton toff 2 3 + Control - Control Load Load

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R10 CPC1016N Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Blocking Voltage 100 V P Reverse Input Voltage 5 V Input Control Current Peak (10ms) 50 mA Input Power Dissipation 1 70 mW T otal Power Dissipation 2 400 mW Isolation Voltage, Input to Output 1500 V rms Operational T emperature -40 to +85 ºC Storage T emperature -40 to +125 ºC 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 -I L - - 100 mA rms / mADC Peak t=10ms I LPK - - ±350 mA P On-Resistance 2 IL=100mA R ON -- 1 6  Off-State Leakage Current V L=100VP ILEAK --1 A Switching Speeds T urn-On I F=5mA, VL=10V ton --2 m s T urn-Off t off --1 m s Output Capacitance I F=0mA, VL=50V , f=1MHz C OUT -2 5 - p F Input Characteristics Input Control Current to Activate I L=100mA I F - 0.5 2 mA Input Control Current to Deactivate - I F 0.3 0.4 - mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Reverse Input Current V R=5V I R -- 1 0 A Common Characteristics Capacitance, Input to Output V IO=0, f=1MHz C IO -1 - p F 1 Load current derates linearly from 100mA @ 25ºC to 80mA @ 85ºC. 2 Measurement taken within 1 second of on-time. Electrical Characteristics @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. T ypical values are characteristic of the device at the specified temperatures and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements.

INTEGRATED CIRCUITS DIVISION CPC1016N www.ixysic.com 3R10 PERFORMANCE DATA* LED Forward Voltage Drop (V) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) Turn-On Time (ms) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Turn-Off Time (ms) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) LED Current (mA) Device Count (N) Typical IF for Switch Operation (N=50, IL=100mA) LED Current (mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=100mA) On-Resistance (:) Device Count (N) Typical On-Resistance Distribution (N=50, IL=100mA) 106 112 118 124109 115 121 Blocking Voltage (V Device Count (N) Typical Blocking Voltage Distribution (N=50) Typical Turn-Off Time vs. LED Forward Current (IL=80mA) LED Forward Current (mA) Turn-Off Time (ms) 0 5 1 01 52 02 53 03 54 04 5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 IF=50mA Temperature (ºC) IF=10mA IF=5mA IF=2mA Typical Turn-On Time vs. LED Forward Current (IL=80mA) LED Forward Current (mA) Turn-On Time (ms) 0 5 1 01 52 02 53 03 54 04 5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R10 CPC1016N PERFORMANCE DATA* IF=5mA Turn-On Time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -20 0 20 40 60 80 100 Typical Turn-On Time vs. Temperature (IL=80mA) IF=10mA Temperature (ºC) Turn-Off Time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 IF=10mA Typical Turn-Off Time vs. Temperature (IL=80mA) Temperature (ºC) IF=5mA -40 -20 0 20 40 60 80 100 Steady State Instantaneous Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) Temperature (ºC) On-Resistance (:) IF=5mA IF=5mA IF=10mA Typical IF for Switch Operation vs. Temperature (IL=80mA) LED Current (mA) -40 -20 0 20 40 60 80 100 1.8 1.5 1.2 0.9 0.6 0.3 Temperature (ºC) Typical IF for Switch Dropout vs. Temperature (IL=80mA) LED Current (mA) -40 1.8 1.5 1.2 0.9 0.6 0.3 -20 0 20 40 60 80 100 Temperature (ºC) Load Voltage (V) Load Current (mA) 150 100 -50 -100 -150 Typical Load Current vs. Load Voltage (IF=5mA) Load Current (mA) 120 115 110 105 100 Temperature (ºC) -40 -20 0 20 40 60 80 120 100 IF=10mA Maximum Load Current vs. Temperature IF=5mA Blocking Voltage (VP) -40 122 121 120 119 118 117 116 115 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature Leakage (PA) -40 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=100VP) Time Load Current (A) 10Ps 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1ms100Ps 100ms 1s10ms 10s 100s Energy Rating Curve *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION CPC1016N www.ixysic.com 5R10 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1016N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1016N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1016N-R10 ©Copyright 2018, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/30/2018 For additional information please visit our website at: www.ixysic.com CPC1016N MECHANICAL DIMENSIONS Dimensions mm (inches) NOTE: All dimensional tolerances per Standard EIA-481-2 except as notedEmbossment Embossed Carrier

330.2 Dia

(13.00 Dia) Top Cover Tape Thickness

0.102 Max

(0.004 Max) User Direction of FeedUser Direction of Feed K0=2.70 (0.106) K1=2.30 (0.091) B0=4.70 (0.185) W=12.00 (0.472) P1=8.00 (0.315)A0=6.50 (0.256) CPC1016N CPC1016NTR Tape & Reel Recommended PCB Land Pattern 2.54 (0.10) 5.50 (0.217) 1.45 (0.057) 0.55 (0.022) Dimensions mm (inches) Pin 1 4.089 ± 0.025 (0.161 ± 0.001)

2.54 Typ

(0.100 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) 2.030± 0.025 (0.080± 0.001) 0.381 TYP . (0.015 TYP .) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0-0.1 (0-0.004) 0.481 (0.019)

0.203 Typ

(0.008 Typ)